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Apollo Seiko's EF 3040A selective soldering machine combines features such as live teaching, Gerber data teaching, and a 6.5kg solder pot capacity for ultimate flexibility.

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Saki's 3Si/3Di-EX Series of 3-D SPI and AOI systems introduce a modular hardware design that allows seamless optical unit upgrades.

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Nordson Electronics Solutions' Asymtek Select Coat SL-1040 ultrasonic cleaning station is designed to keep nozzles and needles clean and prevent clogging in conformal coating systems.

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ECD’s M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler.

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Hirose's DF53 Series connector is its newest addition to its SignalBee connector platform.

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MacDermid Alpha Electronics Solutions Alpha HiTech CF31-4026 reworkable edgebond is for high-reliability applications in automotive electronics and high-performance computing.

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