Zasche Handling Smart Handling Big Bin Picking System comes with intelligent camera guidance with manual operator control. Designed to streamline semiautomated load handling. Automates repetitive tasks while controlling variable placements. Features include modular three-axis design and teach-in functionality.
Cognex’s OneVision electronics inspection platform enables scalable AI-powered machine vision by combining cloud-based delivery with intuitive workflows for application development and deployment. Reduces setup time and unifies tools and data across sites. Compatible with In-Sight 3800 and 8900 systems.
Shenmao SH-0595-210 (Sn95Pb5) and SH-05X25-210 (Sn92.5Pb5Ag2.5) solder pastes are for high-power component assembly in power electronics.
Würth Elektronik WL-SMTW LED series now includes 1608 (1.6 x 0.8mm) and 3528 (3.5 x 2.8mm) top-view models with water-clear lenses and maximum operating temperature of 100°C. 1608 variant offers higher brightness than comparable 0603 LEDs, while 3528 delivers greater illumination for broader applications.
Axxon-Mycronic CCAOI inline AOI system is said to inspect 100% conformal coating with parallax-free imaging, 3-D thickness measurement starting at 2µm and dual-sided inspection. Supports MES integration and real-time data feedback. Comes in two scanner configurations: 11.8 x 15.8" and 16.5 x 20.8". Delivers full-surface image capture in 25 sec. and accommodates PCB sizes up to 33.0 x 20.8".
Axxon-Mycronic
www.axxonauto.comwww.axxonauto.com
Inspectis Micro Size Optical Probe Tip inspects micro-BGAs with a 0.4 x 3.5mm probe footprint and 90° viewing angle for low-clearance components.