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CyberOptics Corp. will highlight SE 300 Ultra, its 3-D solder paste inspection system, in booth 2D21 at the upcoming NEPCON South China exhibition and conference in Shenzhen.
 
The 100% inspection system reportedly provides accurate, repeatable results at speeds that keep up with increasing line cycle times. Incorporates the field-proven technology and reliable features of the SE 300 along with new features.
 
Features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options — rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.
 
Can handle odd-shaped pads, has paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. Features paste height, area and volume measurements with Gage R&R <10%.
 
New features include 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits , easy-to-use Operator Interface and Defect Review and conveyor auto-width adjustment.
 
CyberOptics, www.cyberoptics.com

KISS 103 ‘Stretch’ large-format selective soldering system with 3” nozzles will be exhibited at the upcoming ATExpo in Rosemont, IL.
 
Offers the popular features found in the KISS 101 and 102 systems, but handles larger PCBs and panelized boards. Provides a 26 x 19" work area. The user can place more boards in the work area and take advantage of the Step-and-Repeat feature of the operating program.
 
3" nozzles are a new option, designed to increase throughput as well as close the gap between selective, or secondary soldering, and full wave soldering.  Enables quick conversion from a leaded to a no-lead solder process.  By "painting" the solder side of a circuit with the 3" wide wave, can deliver productivity that approaches that of standard wave soldering tools. Can be easily integrated with A.C.E.’s line of preheat modules.
 
A.C.E.products, www.ace-protech.com
ATExpo Booth 5811

EFD’s Solder Paste Group introduces an improved no-clean solder paste product family specifically formulated for SAC 305. Pb-free formulations are known to leave dull, matte finishes, but the new clear, colorless no-clean flux residue allows the solder joint to sparkle. For applications requiring a shiny, cosmetic finish. Said to ease inspection and improve wetting capabilities for SMT, mechanical, electronic and electro-mechanical soldering applications. 
 
EFD, www.efdsolder.com

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