Software upgrades are being offered for CBT6000, model 8000 automatic wire bonders and the model 3500 component placement work cell. Included are the latest operating software, improved vision systems for pattern recognition and Bond Data Miner, which monitors machine and process trends. Reportedly can track and archive traceability data; automatically adapt its process parameters; capture and analyze process and machine trends; and report its own uptime and statistics to any computer in the world.
SMX Series surface mount DC to 18 GHz packages reportedly have low insertion loss and good return loss and thermal properties. Designed to provide good electrical transition performance for die. Made to provide wideband electrical performance and incorporate copper composite bases for thermal dissipation. Sealed with cup-shaped liquid crystal polymer lids with B-stage epoxy preforms.
QTEK Adhesive Remover reportedly eliminates misprinted adhesives and pastes before they cure and attach themselves to screens or PCBs. Is an isoparaffinic hydrocarbon, and reportedly contains no ozone-depleting substances, and is RoHS and WEEE compliant. Is available in tubs of 100 pre-saturated wipes, 500 ml spray bottles, 5 liter containers and more.