Products
A family of SPDIP mating pin headers complements a line of SPDIP sockets. Shrink plastic packaging is said to reduce device lead spacing between pins down to 0.070" pitch. Used in memory, microcontrollers, video controllers and automotive design applications. For interconnect applications such as board stacking, socket testing and elevating circuits off the board surface. Precision-machined using brass alloy 360 and configured with pluggable tails.
Mill-Max, www.mill-max.com
Mill-Max, www.mill-max.com
Flashstream flash programmer currently supports more than 160 device part numbers from Samsung, Intel, Spansion, ST Micro, Hynix, SST and Atmel. Comes in two models: 3000FS contains four programming sites, is rated at 1050 devices per hour, and handles parts in tray, tube or tape for device input or output. HelixFS is rated at 800 cph. Current universal site supports more than 25,000 device part numbers.
BPM Microsystems, www.bpmicro.com
BPM Microsystems, www.bpmicro.com
The MT-300 Pb-free dual wave solder system is available for low- to mid-volume, defect-free soldering of high-density boards populated with through-hole, surface-mount, or mixed technology components. Small footprint (8' long); uses dual transducer-controlled motors for uniform wave heights; features an adjustable titanium finger conveyor with a max. board width of 11.75". Automatic finger cleaner is standard, as are titanium-alloy solder pot, wave nozzles, and heavy-duty pumping system. Pot capacity of less than 500 lbs.
Manncorp, www.manncorp.com
Press Releases
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