Products
The Medalist SP50 Series 3 solder paste inspection system reportedly provides 100% automated 2-D and 3-D inspection for process characterization and defect prevention. 3-D scanning speed is said to be 38.7 cm2; fiducial inspection and load/unload less than five sec.; gauge repeatable and reproductibility capability less than 10% gage R & R. Reportedly accommodates board sizes 2 x 2" to 20 x 20".
Agilent, www.agilent.com
Agilent, www.agilent.com
Goepel’s JTAG/Boundary Scan includes VarioCore. Reportedly allows the reconfiguration of Scanflex I/O modules with special intellectual property to support a range of test capabilities in the same hardware setup.
Goepel, www.goepel.com
Goepel, www.goepel.com
The Opto-Bonder Femto handles various assembly technologies, including power laser/laser bar bonding, flip chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass and simple die attach. Said to combine accuracy (+/-0.5 micron) and flexibility in a small footprint (1270 x 900 mm). Reported features: a 25% larger table, motorized x, y, z and theta movements, maximum die size up to 4" diameter, and substrate size up to 6" diameter. Bonding processes automatically controlled.
Finetech, www.opto-bonder.com
Finetech, www.opto-bonder.com
Press Releases
- E-tronix Hosts Webinar with Laser Wire Solutions CEO on Advancing Medical Manufacturing Through Laser Technology
- Niche Electronics Completes Transition to Enhanced Leadership Team
- Aegis Software Expands its Presence in France and Partners with STPGroup
- Altus Adds Breakthrough Automated Inline Laser Depaneling System to its Line-Up