The MicroPad sensor, on the SE 300 Ultra platform, reportedly can measure solder paste on pads to 100 x 100
µm (paste height, area and volume measurements with Gage R&R <10%). Said to offer higher magnification of small solder paste pads. Reportedly ideal for batch inspection of system-on-chip, flip-chip and as NPI process qualification. Can be interchanged with a standard sensor to operate in both modes with a single machine. SE 300 Ultra platform now offers the capability to read 1- and 2-D topside barcodes using the sensor head.
The 4710 automated programming system is reportedly the fastest at programming flash devices. Is capable of programming devices with densities up to 4 Gb. Incorporates high-speed USB 2.0 standard bus for communications. Said to combine programming of 64 Mb in 15 s and FX4 socket modules; reportedly can program up to 44 devices simultaneously (up to 1,400 devices/hr.) and programs at 0.24 s/Mb; voltage support down to 1.5 V (Vdd).
Stackers lift, transport and position up to a reported 3,000 lbs. at a time. Come with manual or electric drive and feature battery-powered electric lift. Said to lift to heights of up to 80". Designed to handle any type of pallet or skid. Available in two configurations: fork-over, which reportedly works with any type of open-bottom pallet or skid, and straddle style, which accommodates any pallet or skid. Standard fork lengths are 45" for fork-over models and 42" for straddle units. Overall length is 63-66". Controls are located in the handle. Has locking hand brake.