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The MicroPad sensor, on the SE 300 Ultra platform, reportedly can measure solder paste on pads to 100 x 100
µm (paste height, area and volume measurements with Gage R&R <10%). Said to offer higher magnification of small solder paste pads. Reportedly ideal for batch inspection of system-on-chip, flip-chip and as NPI process qualification. Can be interchanged with a standard sensor to operate in both modes with a single machine. SE 300 Ultra platform now offers the capability to read 1- and 2-D topside barcodes using the sensor head.
 
CyberOptics Corporation, www.cyberoptics.com

The 4710 automated programming system is reportedly the fastest at programming flash devices. Is capable of programming devices with densities up to 4 Gb. Incorporates high-speed USB 2.0 standard bus for communications. Said to combine programming of 64 Mb in 15 s and FX4 socket modules; reportedly can program up to 44 devices simultaneously (up to 1,400 devices/hr.) and programs at 0.24 s/Mb; voltage support down to 1.5 V (Vdd).
 
BPM Microsystems, www.bpmmicro.com
 
 
 
Stackers lift, transport and position up to a reported 3,000 lbs. at a time.  Come with manual or electric drive and feature battery-powered electric lift. Said to lift to heights of up to 80". Designed to handle any type of pallet or skid. Available in two configurations: fork-over, which reportedly works with any type of open-bottom pallet or skid, and straddle style, which accommodates any pallet or skid. Standard fork lengths are 45" for fork-over models and 42" for straddle units. Overall length is 63-66". Controls are located in the handle. Has locking hand brake.
 
Southworth Products, www.SouthworthProducts.com
 

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