Laser cutting system is for SMT solder paste stencils and other thin metal components and parts. Said to cut standard SMT stencils at 13,000-18,000 apertures per hr. (an increase of 30-50%). Features include LongLife laser source, which consists of a high-power fiber laser; reportedly operates at reduced power requirements. FastCut beam delivery system enables MultiCut to cut small apertures of any shape without any table motion. Said to boost production throughput, especially when cutting BGA and µBGA stencils.
The real-time top-side preheating module is for high-mass assemblies. Promotes draw of solder through barrel to the board’s top side. Provides internal continuous preheat during selective soldering. Can be used as the primary preheating function or to maximize productivity when used in combination with discrete pre-heaters to maintain board temp. during soldering operation. An optical pyrometer reads actual PCB temperature with real-time, closed-loop control.
HDPE Pure-Touch liquid dispensing bottles are available with chemical names acetone, isopropanol, and DI water. Imprints are said to be non-smearing and non-running. Ideal when multiple chemicals are being used on a single workstation. Square shape provides stability and allows compact storage. Capacity is 4 oz.