Cadstar 9.0 desktop PCB design software features major usability and flexibility enhancements, along with functionality for adopting new technology.
Improvements include graphical representations of every function assignment, making the tool both easier to work.
"Trunk" routing functionality, within P.R.Editor XR, can now swap equivalent pins quickly and easily to improve routability. The report generator, post drill files, DXF post processing, general menu and tool bars have been made more user friendly. Back annotation function has been enhanced to make file transfer from PCB design into the schematic smoother and simpler.
Cadstar SI Verify, which offers a complete post-layout signal integrity simulation toolset with seamless integration into Cadstar, also features many new functions for ease of use and accuracy. This includes upgrades to the via modelling function, to provide more in-depth analysis details and user defined n-port circuit models to take into account components such as filters and ferrite beads. Both of these enhancements are also supported by Scenario Editor, a “what-if” simulation scratch pad.
The latest addition to the Helix automated device programmer has the same dph and is based on the Helix-TU-10 design. As a desktop automated system, the Helix comes
standard with two precision-designed tray input and output handling systems
with a reject location.The tray version uses the same core programming technology and socket modules as standard automated lines. The pressure plates are exchangeable between the two units.
Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability, which permits programming of up to four devices simultaneously per site.
Handles such packages as MSOP, SOIC, PLCC, SSOP and TSSOP.
A tray-only version will be available at a later date.
The GEM Series tabletop AOI comes with new easy-to-use
iPro√ software with a new graphical interface said to be easier to use. The software guides users on setting up
inspection parameters, resulting in improvd productivity and less training time.
Also, coverage of the Ultra 850G system
has been expanded to wire bond and die placement inspection. Flying
Color Technology has been added to broaden the defect coverage and lower false
rejects.