Products
Practical Components, the supplier of dummy components, has added Amkor Technology's PoP (PSvfBGA), a stackable very thin fine-pitch BGA package.
Also new is Amkor's tsMLF (Thin Substrate
Micro LeadFrame-TAPP), a sub-100 micron flip chip test die, and
the redesigned Cookson, Indium and AIM print test boards and kits.
Also new is Amkor's CVBGA very thin ChipArray BGA.
VJ Electronix is releasing an update to its Summit 2200 advanced rework station. New features include:
vjelectronix.com
- Automated site prep (scavenging) system that permits fully automatic, component removal, noncontact, site prep, and placement of components with minimum operator intervention.
- Automatic and vision assisted placement, which facilitates precision placement of high lead count components such as Cu-CGAs. The system uses machine vision components and software to reduce cycle times and, improve yields. The system can be fully manual or manual with visual assist to allow fast and accurate placement of components that, without this benefit, are difficult to align.
- Wide area profile storage compatibility, which permits central storage of processes and profiles. During runtime, the system checks for the most updated profile through the network and downloads the latest process file on demand or automatically. This allows a central process lab to always maintain and distribute the latest data globally.
- New bottom heater and motorized table, including a 4.0 or 5.6 kW bottom heater designed for Pb-free processes. Also new to this table design is the ability to have a bottom heater cooling boost that decreases cycle times and meets maximum time above liquidus constraints.
- Integrated technical documentation. All manuals, help files, schematics and knowledgebase troubleshooting are imbedded in the SierraMate 7.0 application software. This allows operators and engineers to access all information about the machine locally. All GUI documentation, screens, help files and reports can be localized into native languages to ease in new operator learning.
vjelectronix.com
KIC 24/7 thermal process monitoring system version 2.3.0.0 includes bug fixes, improved printing capabilities, oven communication with SEHO reflow ovens, improved alarm functionality and more.
Market drivers such as OEM requests for process traceability, conversion to Pb-free electronics and more are compelling electronics manufacturers to move from a manual spot check routine to automatic and continuous monitoring of their reflow process. The software provides full process traceability in thousands of installations around the world, along with automatic profiling and SPC charting.
Version 2.3.0.0 is free of charge to all customers.
KIC, kicthermal.com
Market drivers such as OEM requests for process traceability, conversion to Pb-free electronics and more are compelling electronics manufacturers to move from a manual spot check routine to automatic and continuous monitoring of their reflow process. The software provides full process traceability in thousands of installations around the world, along with automatic profiling and SPC charting.
Version 2.3.0.0 is free of charge to all customers.
KIC, kicthermal.com
Press Releases
- PRIDE Industries Invests in Kurtz Ersa POWERFLOW Wave Soldering System to Expand High-Reliability Electronics Manufacturing Capabilities
- Federal Electronics Adds AS9100 Certification to Hermosillo, Mexico Facility, Expanding Aerospace & Defense Capabilities
- SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
- TTCI Expands Southeastern U.S. Presence Through Partnership with Microwave Component Sources; Bert Horner and Ryan Peavey Comment
POPULAR
- Editorial Contributions
- How Squeegee Blade Profile Helps Improve the Screen-Printing Process
- Verifying PCBA Cleanliness with Ion Chromatography
- Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization