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Products

The LNC 60 is used to simultaneously align components on six nozzles on each placement head inside JUKI’s newest pick-and-place machines. The LaserAlign sensor reportedly allows the component alignment process to perform rapidly on the fly. Will be used in KE-2070 series of high-speed chip shooters and KE-2080 series of high-speed flexible mounters, reportedly capable of placing down to 01005 components.

CyberOptics, www.cyberoptics.com

The BondJet BJ915 heavy wire bonder reportedly offers the highest speed and accuracy, and the largest work area available. Highlights are said to include a 10% speed increase over BJ910 with bonding speeds reported as fast as 450 ms/wire (300Âµm diameter 8 mm loop length wire) and 10 µm at 3 sigma placement accuracy. Said to be the only heavy wire bonder with both integrated pull test and nondestructive shear test capability. A process-integrated quality control (PIQC) system is said to provide wire deformation graphs for multiple or single wires, data logging of all error messages and tolerance limits, storage and printing of deformation curves for analysis, statistics, and process control.

Hesse & Knipps, www.hesse-knipps.com

The BluePrint-PCB Viewer application is available as a free Web download. Reportedly allows users to create a comprehensive PCB release package. Supports three viewers, including a standard viewer; one that supports html and can be viewed using an Active X component, and the Pack and Release Viewer, which is said to allow users to control the amount of time a document release package may be viewed by a third party. All versions support hyperlinking functions that link details to notes and callouts as well as URLs, e-mail addresses, audio, video and other electronic files. Reportedly can view and query the native CAD data. Contains search function.

DownStream Technologies, www.downstreamtech.com