Products
FINETECH will highlight the compact rework system Fineplacer CRS10 at Nepcon South China on Aug. 29 to Sept. 1.
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71
ESSEMTEC AG will highlight CSM7100, a flexible pick-and-place system with intelligent feeders for high-mix/low-volume production, at the upcoming NEPCON South China exhibition and conference.
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
Footprint is 80 x 80 cm.
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
Footprint is 80 x 80 cm.
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50
KIC will showcase its 24/7 Process Monitor at the upcoming Nepcon South China exhibition and conference in Shenzhen.
24/7 Process Monitoring brings automation to the thermal process: Automatic profiling of each product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability -- all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. Real-time process data enables engineers to make crucial cost containment and quality control decisions.
Uses custom probes installed inside the oven at the product level to gather and record real-time thermal process data for every product. Automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process. Any process drift outside of control limits or defined Cpk value will immediately trigger an alarm. Real-time Cpk tracking provides a zero-defect, fail-safe system that automatically identifies potential defects before they occur.
KIC, kicthermal.com
Nepcon South China booth 2D58
24/7 Process Monitoring brings automation to the thermal process: Automatic profiling of each product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability -- all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. Real-time process data enables engineers to make crucial cost containment and quality control decisions.
Uses custom probes installed inside the oven at the product level to gather and record real-time thermal process data for every product. Automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process. Any process drift outside of control limits or defined Cpk value will immediately trigger an alarm. Real-time Cpk tracking provides a zero-defect, fail-safe system that automatically identifies potential defects before they occur.
KIC, kicthermal.com
Nepcon South China booth 2D58
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