caLogo

Products

CTS Connect air-actuated internal or external connectors for effective sealing on smooth, rough or threaded circular features of a part create a tight, long-lasting seal. New leak test accessory products include:
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
 
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
 
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
 
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540
Eunil H.A. Americas has added the PARMI SPI 3-D paste inspection system to its product line.

The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.

Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.

Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.

Eunil H.A. Americas, parmi.com

440-R SMT Detergent is available in a ready-to-use spray bottle for safe, effective manual cleaning of SMT stencils and related tooling.  The stencil-cleaning chemistry  is verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program. 
While ultrasonic technology is effective for removing solder paste from SMT stencils, manual cleaning continues to be common. Stencil cleaning has been identified as the most hazardous process with the greatest potential environmental impact associated with SMT assembly.  Flammable and VOC solvents such as alcohol and acetone are commonly used for manual cleaning and poisonous heavy metals such as lead often come in contact with the user.  This safe water-soluble detergent cleans effectively, improves print production and eliminates noxious odors and hazards associated with solvent cleaning. 
Smart Sonic Corp., smartsonic.com
AT Expo booth 6027

Page 1711 of 2023

Don't have an account yet? Register Now!

Sign in to your account