Products
MFR Soldering/Desoldering systems offer assembly companies a solution tailored to their needs, whatever their size, manufacturing volume, product complexity and budgetary constraints.
MFR-DSI and MFR-DSX Systems for desoldering, comprise a compact bench-top MFR power supply and its desolder gun. Equipped with an internal air pump, MFR-DSI is ideal for small manufacturers that do not use compressed air, and for desoldering tasks performed away from the workbench. MFR/DSX uses compressed shop air, making it powerful for high-volume desoldering tasks.
Add soldering and rework hand-piece and tip cartridge to the units above to create two soldering, desoldering and rework options: the MFR-SDI with internal air pump, and the MFR-SDX with external compressed air.
All four packages use lightweight hand-pieces.
The handle of the desoldering tool is fully adjustable from “gun” to “pencil” position, for operator comfort. Incorporates a reactivation switch that senses when it is in use, and that works with “Auto Standby” and “Auto Off” functions to save on energy usage and prolong tip life.
Large-capacity chamber that catches molten solder during desoldering is made of thermal plastic and contains a disposable paper filter that, once full, is simply tapped gently out of the chamber for easy substitution. Fume filter traps solder fumes that can harden on cooling and block pumps.
Press-fit desoldering tips make changeovers easy. The operator simply handles the tips using a heat-resistant cartridge removal pad. Includes long-reach geometries for access to high-density areas on the PCB.
All soldering/desoldering tips are driven by SmartHeat technology, which senses the amount of heat energy needed at the pad.
Special LEDs on the power unit show whether the unit or a hand-piece are powered up, in ‘standby’ or ‘off.’ Will flag when the system or a tool are not grounded, and the unit will shut down.
Power units offer two ports to which any of the tools can be attached; for heavier or more varied workloads, multiple units can be slotted together to power as many tools as necessary.
OK International, okinternational.com
MFR-DSI and MFR-DSX Systems for desoldering, comprise a compact bench-top MFR power supply and its desolder gun. Equipped with an internal air pump, MFR-DSI is ideal for small manufacturers that do not use compressed air, and for desoldering tasks performed away from the workbench. MFR/DSX uses compressed shop air, making it powerful for high-volume desoldering tasks.
Add soldering and rework hand-piece and tip cartridge to the units above to create two soldering, desoldering and rework options: the MFR-SDI with internal air pump, and the MFR-SDX with external compressed air.
All four packages use lightweight hand-pieces.
The handle of the desoldering tool is fully adjustable from “gun” to “pencil” position, for operator comfort. Incorporates a reactivation switch that senses when it is in use, and that works with “Auto Standby” and “Auto Off” functions to save on energy usage and prolong tip life.
Large-capacity chamber that catches molten solder during desoldering is made of thermal plastic and contains a disposable paper filter that, once full, is simply tapped gently out of the chamber for easy substitution. Fume filter traps solder fumes that can harden on cooling and block pumps.
Press-fit desoldering tips make changeovers easy. The operator simply handles the tips using a heat-resistant cartridge removal pad. Includes long-reach geometries for access to high-density areas on the PCB.
All soldering/desoldering tips are driven by SmartHeat technology, which senses the amount of heat energy needed at the pad.
Special LEDs on the power unit show whether the unit or a hand-piece are powered up, in ‘standby’ or ‘off.’ Will flag when the system or a tool are not grounded, and the unit will shut down.
Power units offer two ports to which any of the tools can be attached; for heavier or more varied workloads, multiple units can be slotted together to power as many tools as necessary.
OK International, okinternational.com
LMS6000 is a fully functional, closed loop, ytterbium-doped fiber laser system capable of marking a variety of flat label materials and direct marking on specific metallic and plastic substrates. Includes an in-line mark grading system with error detection capability. Features reel-to-reel transportation with integrated fume extraction and vacuum hold-down of the material being marked.
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m2 marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
Tyco Electronics Corporation, www.tycoelectronics.com
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m2 marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
Tyco Electronics Corporation, www.tycoelectronics.com
The electronics group of Henkel has introduced a new process, Accelerated Cooling (AC), to be used with its two flip-chip in package non-conductive paste (NCP) underfill encapsulants. The NCP materials, Hysol FP5000 and Hysol FP5001, provide moisture resistance, thermal cycling resistance, expedite the assembly process and are designed for Pb-free interconnects.
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning.
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
Henkel, electronics.henkel.com
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning.
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
Henkel, electronics.henkel.com
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