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Series 150 Vertical Flow Modular Plenum Sections consist of full ceiling, HEPA filter plenum sections that provide filtered laminar flow air to clean areas. Designed to deliver filtered air through 100% of the ceiling’s available surface area.

Available in a number of configurations. Units with blowers on the end are the Series 151. With legs added, these become the Series 551 – a fully functional cleanroom that consists of legs and soft wall vinyl curtains that are mounted to the Series 151 low-profile filter plenum. The low-profile plenum extends beyond the end of the cleanroom. The Series 551 can be building suspended with or without curtains.

Units with blowers on top are the Series 152. With legs added, these become the Series 552. The Series 552 is a building suspended filter plenum. The blower and motor are mounted directly on top of the Series152 filter plenum and blow directly into it. The Series 552 can be supplied with or without soft wall curtains and can also be supported with legs.

The Series 151 and Series 152 are designed to hang from a building, or they may be installed on a custom frame. The Series 551 and Series 552 are designed to be freestanding.

Clean Air Products, cleanairproducts.com

ECV-100 Coolveyor is a cooling fan conveyor used post-reflow; without proper cooling, damage can occur to Flash programming IC and other temperature-sensitive components. Pb-free soldering, in particular, requires a high-temperature process.

Can efficiently reduce the temperature of a board (PCB and components) with a well-insulated unit that uses a cooling compressor to maintain the interior temperature of 5° to 10°C with a fan. Equipped with an anti-static transparent viewing window.

Benefits include room temperature setting, the capability to accommodate PCBs from 50 x 50 to 250 x 330, air is cooled by the cooling unit, insulated case structure unit with viewing window and conveyor speed control of 1 to 2 m/min. Measures 800 x 1,000 x 1,500 and weighs 310 kg. When setting at 5° to 10°C, the temperature of the board surface drops at 2°C/sec.

Eunil H.A. Americas, eunil.com

Adding to its series of recently introduced optimized material sets, Henkel has announced a materials combination designed for stacked CSP (SCSP) devices. Uniting die attach material Hysol QMI536NB with mold compound Hysol GR9820, this material set reportedly delivers JEDEC Level 1/260° reflow performance.

Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.

QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.

Henkel, www.electronics.henkel.com