Circuits Assembly Online Magazine

NEWS

Sept. N. American Semi Equipment Billings Up 36%

MILPITAS, CA — North America-based semiconductor equipment manufacturers posted $3.72 billion in billings worldwide in September, according ... Read More...

GPV to Expand Manufacturing in Sri Lanka

NEGOMBO, SRI LANKA – GPV broke ground on a new manufacturing plant in Sri Lanka, according to reports. Read More...

NAND Flash Contract Prices to Undergo ‘Marginal Drop’ in Q4

TAIPEI – Contract prices of NAND flash products are expected to undergo a marginal drop of 0-5% sequentially in the fourth quarter as demand... Read More...

IDC: 58% of Orgs. Say Immediate Focus is on Supply Chain Visibility

SINGAPORE — Fifty-eight percent of organizations recently surveyed indicate their immediate focus is on increasing supply chain visibility t... Read More...

Kitron Reported Q3 Revenue Down 21%

ASKER, NORWAY – Kitron reported third quarter revenue of NOK 831 million (US$99.5 million), down 21.2% year-over-year. Read More...

Mycronic Posts Q3 Net Sales Down 8%

STOCKHOLM – Mycronic reported third quarter net sales decreased 8% year-over-year to SEK 986 million (US$114.7 million). Based on constant e... Read More...

Note Reports Q3 Sales Up 58%

STOCKHOLM – Note reported third quarter sales increased 58% year-over-year to SEK 685 million (US$79.5 million). Adjusted for acquisitions ... Read More...

Neways Reports Q3 Sales Fall 4.2% YoY

SON, THE NETHERLANDS – Neways Electronics reported third quarter sales of €116 million, up 1.3% sequentially but down 4.2% from a year ago, ... Read More...

Flex Acquires Anord Mardix for $540M

DUNDALK, IRELAND – Flex acquired Anord Mardix in a $540 million all-cash transaction. The acquisition adds to Flex's power products and expa... Read More...

FEATURES

Understencil Wipe Cleaning Yield Improvements

A study of the behavior of flux-stencil interactions. Understencil wiping has gained increased interest over the past several years. Changes in circuit design ... Read More...

Will ECAs Finally Stick?

A new study reveals emerging applications for attaching very-fine-pitch parts using low-temp methods. Electrically conductive adhesives (ECAs) have been toute... Read More...

BGA Removal Using Focused IR

By concentrating heat onto the part, the BGA avoids excessive temperature. Recently, a customer asked if we could remove a valuable BGA from an existing circu... Read More...

Volthub: Connecting the Supply Chain

A new platform for streamlining procurement takes shape. Supply chain has been the story of the past year, and a new face to the industry proposes to help res... Read More...

State-of-the-Art Technology Flashes

Updates in silicon and electronics technology. Ed.: This is a special feature courtesy of Binghamton University. IBM announces 2nm GAA-FET technology. IBM ann... Read More...