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NEWS

Sept. N. American Semi Equipment Billings Up 36%

Sept. N. American Semi Equipment Billings Up 36%

MILPITAS, CA — North America-based semiconductor equipment manufacturers posted $3.72 billion in billings worldwide in September, according ...  Read More...

GPV to Expand Manufacturing in Sri Lanka

GPV to Expand Manufacturing in Sri Lanka

NEGOMBO, SRI LANKA – GPV broke ground on a new manufacturing plant in Sri Lanka, according to reports.  Read More...

NAND Flash Contract Prices to Undergo ‘Marginal Drop’ in Q4

NAND Flash Contract Prices to Undergo ‘Marginal Drop’ in Q4

TAIPEI – Contract prices of NAND flash products are expected to undergo a marginal drop of 0-5% sequentially in the fourth quarter as demand...  Read More...

IDC: 58% of Orgs. Say Immediate Focus is on Supply Chain Visibility

IDC: 58% of Orgs. Say Immediate Focus is on Supply Chain Visibility

SINGAPORE — Fifty-eight percent of organizations recently surveyed indicate their immediate focus is on increasing supply chain visibility t...  Read More...

Kitron Reported Q3 Revenue Down 21%

Kitron Reported Q3 Revenue Down 21%

ASKER, NORWAY – Kitron reported third quarter revenue of NOK 831 million (US$99.5 million), down 21.2% year-over-year.  Read More...

Mycronic Posts Q3 Net Sales Down 8%

Mycronic Posts Q3 Net Sales Down 8%

STOCKHOLM – Mycronic reported third quarter net sales decreased 8% year-over-year to SEK 986 million (US$114.7 million). Based on constant e...  Read More...

Note Reports Q3 Sales Up 58%

Note Reports Q3 Sales Up 58%

STOCKHOLM – Note reported third quarter sales increased 58% year-over-year to SEK 685 million (US$79.5 million). Adjusted for acquisitions ...  Read More...

Neways Reports Q3 Sales Fall 4.2% YoY

Neways Reports Q3 Sales Fall 4.2% YoY

SON, THE NETHERLANDS – Neways Electronics reported third quarter sales of €116 million, up 1.3% sequentially but down 4.2% from a year ago, ...  Read More...

Flex Acquires Anord Mardix for $540M

Flex Acquires Anord Mardix for $540M

DUNDALK, IRELAND – Flex acquired Anord Mardix in a $540 million all-cash transaction. The acquisition adds to Flex's power products and expa...  Read More...

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FEATURES

Understencil Wipe Cleaning Yield Improvements

Understencil Wipe Cleaning Yield Improvements

A study of the behavior of flux-stencil interactions. Understencil wiping has gained increased interest over the past several years. Changes in circuit design ...  Read More...

Will ECAs Finally Stick?

Will ECAs Finally Stick?

A new study reveals emerging applications for attaching very-fine-pitch parts using low-temp methods. Electrically conductive adhesives (ECAs) have been toute...  Read More...

BGA Removal Using Focused IR

BGA Removal Using Focused IR

By concentrating heat onto the part, the BGA avoids excessive temperature. Recently, a customer asked if we could remove a valuable BGA from an existing circu...  Read More...

Volthub: Connecting the Supply Chain

Volthub: Connecting the Supply Chain

A new platform for streamlining procurement takes shape. Supply chain has been the story of the past year, and a new face to the industry proposes to help res...  Read More...

State-of-the-Art Technology Flashes

State-of-the-Art Technology Flashes

Updates in silicon and electronics technology. Ed.: This is a special feature courtesy of Binghamton University. IBM announces 2nm GAA-FET technology. IBM ann...  Read More...

Conformal Coating Challenges: Detection, Rework and Failure Analysis

Conformal Coating Challenges: Detection, Rework and Failure Analysis

A DoE shows optimal removal strategies with various package styles.  Read More...

Using Cross-Sectioning for PCB Assembly Qualification

Using Cross-Sectioning for PCB Assembly Qualification

While destructive, slicing can best x-ray for failure detection and analysis.  Read More...

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

Overcoming charges and decreasing risks introduced by humans or machines.  Read More...

New Requirements for SIR Measurement

New Requirements for SIR Measurement

Requirements for no-clean solder paste to increase device chemical, thermal and electrical reliability.  Read More...

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PRODUCTS

Balver Zinn Introduces REGI-007 VOC Flux

Balver Zinn Introduces REGI-007 VOC Flux

REGI-007 VOC is an alcohol-based, no-clean flux with organic activation system.  Read More...

Fujipoly Offers 2 to 7W/m-K Thermal Interface Gap Fillers

Fujipoly Offers 2 to 7W/m-K Thermal Interface Gap Fillers

Two to 7W/m-K dispensable thermal interface gap fillers are suitable for thin bond line and gap filler applications.  Read More...

Rohde & Schwarz Extends R&S Spectrum Rider FPH Spectrum Analyzers

Rohde & Schwarz Extends R&S Spectrum Rider FPH Spectrum Analyzers

R S Spectrum Rider FPH handheld spectrum analyzers now include base models with frequencies up to 44GHz.  Read More...

Hirose Offers C.FL Series Coaxial Connector

Hirose Offers C.FL Series Coaxial Connector

C.FL series coaxial connector serves 5G device market.  Read More...

Vishay Intertechnology Updates Vishay Techno CDMM Chip Divider

Vishay Intertechnology Updates Vishay Techno CDMM Chip Divider

Vishay Techno CDMM high-voltage chip divider is now offered in a ribbed molded package with compliant surface-mount leads.  Read More...

Vishay Rolls Out IHVR-4025JZ-3Z Vertical-Mount Inductor

Vishay Rolls Out IHVR-4025JZ-3Z Vertical-Mount Inductor

IHVR-4025JZ-3Z vertical-mount inductor comes in 10.25mm x 6.4mm x 10mm 4025 case size.  Read More...

Saki Upgrades 3Xi-M110 AXI Software

Saki Upgrades 3Xi-M110 AXI Software

New software on 3Xi-M110 inline 3D-AXI system for printed circuit board inspection reduces cycle time up to 50%.  Read More...

Omron Automation Americas Launches VT-S10 3D AOI

Omron Automation Americas Launches VT-S10 3D AOI

VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect dete...  Read More...

Koh Young Launches Meister D+ True3D Inspection System

Koh Young Launches Meister D+ True3D Inspection System

Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.  Read More...

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