Goepel’s JTAG/Boundary Scan includes VarioCore. Reportedly allows the reconfiguration of Scanflex I/O modules with special intellectual property to support a range of test capabilities in the same hardware setup.  

Goepel, www.goepel.com  

The Opto-Bonder Femto handles various assembly technologies, including power laser/laser bar bonding, flip chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass and simple die attach. Said to combine accuracy (+/-0.5 micron) and flexibility in a small footprint (1270 x 900 mm). Reported features: a 25% larger table, motorized x, y, z and theta movements, maximum die size up to 4" diameter, and substrate size up to 6" diameter. Bonding processes automatically controlled.
 
Finetech, www.opto-bonder.com
 

PowerStrip interconnects are rated for applications up to 28A at 80°C and have up to eight blade style contacts. Forty signal pins are standard and are said to handle up to 3A of current at 80°C. Available for parallel board spacings of 19 mm, and for perpendicular and coplanar board interface applications. These polarized through-hole connectors are for rugged applications; right-angle versions have screw-down features. Are RoHS-complaint and suitable for lead-free processing. 
 
Samtec, www.samtec.com

 

 

The Q2 high-speed connector options have been expanded with integrated power pins, RF connectors and retention pins. Come with positive alignment features, edge-mount and right-angle design variations, single-ended and differential signal routing, and optional EMI shielding. In 10 or 11mm mated height and signal pins on 0.635 mm pitch.  Available with up to 156 I/Os per connector set in single-ended configuration and up to 64 pairs in a differential pair configuration. Pricing begins at 0.08¢ per line at 5,000 interconnects.

Samtec, www.samtec.com
 

Software upgrades are being offered for CBT6000, model 8000 automatic wire bonders and the model 3500 component placement work cell. Included are the latest operating software, improved vision systems for pattern recognition and Bond Data Miner, which monitors machine and process trends. Reportedly can track and archive traceability data; automatically adapt its process parameters; capture and analyze process and machine trends; and report its own uptime and statistics to any computer in the world.
 
Palomar Technologies, www.palomartechnologies.com
 

SMX Series surface mount DC to 18 GHz packages reportedly have low insertion loss and good return loss and thermal properties. Designed to provide good electrical transition performance for die. Made to provide wideband electrical performance and incorporate copper composite bases for thermal dissipation. Sealed with cup-shaped liquid crystal polymer lids with B-stage epoxy preforms.
 
StratEdge, www.stratedge.com
 
 
 

QTEK Adhesive Remover reportedly eliminates misprinted adhesives and pastes before they cure and attach themselves to screens or PCBs. Is an isoparaffinic hydrocarbon, and reportedly contains no ozone-depleting substances, and is RoHS and WEEE compliant. Is available in tubs of 100 pre-saturated wipes, 500 ml spray bottles, 5 liter containers and more.

QTEK, www.qtek.com

 

The X7056 features parallel AOI and automatic 3-D x-ray inspection with top and bottom optical views. Microfocus x-ray tube has a reported resolution of 15 µm per pixel. Iterative Easy3D software yields highly accurate image quality. Includes 6 MP sensors, and can be equipped with AOI cameras for simultaneous top- and bottom-side PCB inspection. Simultaneous inspection and double-track loading lower handling times. Is fully modular, and can be used as a combination AOI/AXI or pure AXI system.