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DX-200 Series of Digital Dispenser/Controllers are affordable, accurate and repeatable micro-air dispensing systems.
 
DX-200 offers an operating pressure of 0 to 100 Psi, (0 to 6.9bar), and is configured for general dispensing applications; DX-215 has an operating pressure of 0 to 15 Psi, (0 to 1 bar), and is designed for specific low viscosity fluids. Applications range from the precision deposition of surface-mount solder paste and adhesive to semiconductor under-fill.
 
The units are supplied with a power adapter, air hose, sample tips, barrel, syringe adapter and syringe stand. Operating from a 24V DC supply, the CE-certified dispensers feature a timer range of 0.008 to 99.99 sec.
 
Specified for manufacturing environments where accuracy and repeatability take priority, features a digital timer and adjustable vacuum for controlling drips between dispense cycles.
 
The contemporary, robust housing is designed with a small footprint to conserve workspace, and can be easily carried between work locations. Units can also be stacked and fastened on top of each other for further bench top efficiency.
 
OK International, okinternational.com

Polymer System Supreme 10HTFL is a one-component, flexible, high-performance, epoxy resin-based adhesive/sealant with a service temperature range of -300° to +300°F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250° to 300°F and above. Features extended ambient temperature storage capability and does not require refrigeration for extended storage before use. Said to exhibit high physical strength properties and excellent adhesion to a wide range of metallic and nonmetallic substrates even upon prolonged exposure to hostile environmental conditions.
 
Adhesive and sealing properties to aluminum, steel and other metals, as well as fiber reinforced composites, most plastics, ceramics, glass, wood, etc. are high. Tensile lap shear strengths of more than 2000 psi and T-peels in excess of 60 pli are obtained for aluminum bonding.
 
Has high resistance to severe thermal and mechanical shock and vibration. Pertinent physical strength properties including flexibility are retained when bonded assemblies are subjected to demanding service conditions. Performance properties are impressive when bonding substrates with wide differences in their thermal expansion coefficients. Reportedly has superior chemical resistance to water, salts, oils, fuels and many organic solvents. Is an excellent electrical insulator. Does not require mixing prior to use.
 
Master Bond Inc., masterbond.com
Pittsburgh, PA -- On Tuesday, June 6, Dr. Jonathan Cagan, chief technologist and co-founder of DesignAdvance and professor of Mechanical Engineering at Carnegie Mellon University, will give a keynote address at the Pittsburgh Technology Council’s “Innovation Day.” His topic will be “Pragmatic Innovation – Understanding Innovation in the 21st Century.”
 
Dr. Peter Boatwright, professor at the Tepper School of Business of Carnegie Mellon University, will also speak at the event. Dr. Cagan and Dr. Boatwright are co-authors of the book The Design of Things to Come.
                     
The Drs. will then moderate a panel on the same topic. Participants include:  Tom Bonnell, director of design at Repironics; Randy Eager, CEO of DesignAdvance; Eric Close, CEO of RedZone Robotics; and Todd Summe, manager of new product innovation at Alcoa.
    
The event will take place at the Westin Convention Center in Pittsburgh. For more info., visit pghtech.org/events/innovation.asp.
 

El Segundo, CASpansion LLC in the first quarter retained its position as the world’s leading supplier of NOR-type flash memory, according to preliminary market-share data from iSuppli Corp.
 
The U.S.-based company achieved NOR sales of $562 million in the first quarter, down 6.5% sequentially. Intel held onto second place with revenue of $537 million, down 10.5% from $600M in the fourth quarter. Europe’s STMicroelectronics remained in third place with revenue of $327 million, a 2.4% decline from Q4.
 
 
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Woodinville, WA – PCB manufacturer UMC (Universal Manufacturing Corp.) has acquired additional advanced technology processing equipment, including two Pluritec auto loading CNC drilling machines, a Lohr Herman CNC jump scoring machine, an X-ray registration/ verification system, a thin core/fine line copper etching system, an advanced fine line laser photo plotter and an RoHS-compliant immersion silver/gold plating line.
 
UMC also announced that Ken Stowers, former owner of Velie Circuits Inc. (Costa Mesa, CA), joined UMC as VP of marketing. Rob Newton and Shaun Salas, also formerly of Velie Circuits, joined as direct sales people.

PHOENIX, AZFlipChip International and Engent have formed an alliance to accelerate the development and deployment of 3-D Wafer Level CSP (WLCSP) technologies for highly integrated stacked die packaging applications. This technology may enable packaging solutions that are quicker to market and lower cost than system-on-chip alternatives.

The partnership couples FCI’s high-volume, ultra-fine pitch wafer bumping capabilities and 2-D Wafer Level CSP package portfolio with Engent’s abilities in advanced surface-mount and flip-chip assembly technology. The flexible technology platform emerging from this partnership supports a range of ultra-high volume IC packaging applications including Silicon on Silicon, GaAs on Silicon and SiGe on Silicon as well as 3-D integration of emerging integrated passive device technologies and MEMS devices for System in a Stack solutions.

SUZHOU, CHINA -- Kemet will add a third tantalum capacitor manufacturing facility in the Suzhou area within the next two years, the company said.

The company has already invested a total of $70 million on two plants in the area, and its two factories total 20,000 sq. m. and employ 940 workers.

Kemet's customer base in Asia accounted for 37.9% of sales in fiscal 2006.
MILPITAS, CA -- Marc Onetto, executive vice president for worldwide operations of Solectron Corp., has resigned to pursue other interests.

His duties will be assumed by chief executive and president Mike Cannon on a temporary basis.

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SALT LAKE CITY -- CirTran Corp., an electronics contract manufacturer, today announced that a $1 million investment in the company has been made by a private California company.

ANAHOP, an Anaheim, CA-based company, has contracted to purchase 14,285,715 shares of CirTran's restricted common stock for $.07 per share without any registration rights.

The initial payment of $500,000 was made on May 24, and additional payments of $250,000 each scheduled to be completed on or before June 2 and June 30, 2006, respectively.

ANAHOP's principals will receive warrants to purchase additional shares of CirTran common stock, up to 15 million shares, at an exercise price of $0.15 per share, up to 5 million shares at $0.25 per share, and up to 10 million shares at an exercise price of $0.50 per share. 
Solderite, a provider of Pb-free soldering solutions, introduces the Solderite 3500 Lead-free Soldering Station. The patents incorporated in the station were filed and granted to design a superior lead-free soldering station.
 
Features remote-controlled temperature programming; pre-set temperature settings can be varied for specific temperatures. Comes standard with automatic tip temperature compensation, standby mode and automatic off functions. Includes a quick calibration mode that allows operators to test the true soldering tip temperature and calibrate temperature, if needed.
 
The company’s "power on demand per demand" technology reportedly ensures that the specially designed electroplated tips deliver an outstanding life cycle.
 
Solderite, solderite.com      
SAN FRANCISCO - Inventories throughout the high-tech food chain are under control and look unlikely to balloon out of control over the sluggish summer months ahead of the key year-end holiday season, industry executives reported at the JPMorgan Technology Conference this week.

 
The comments made by chief executives and CFOs come amid growing concerns that an inventory glut in the face of potentially flagging demand will weigh on profits.

 
While the fourth quarter is great for electronic gadget sales because of Christmas, and firms often spend more on technology toward the end of the year to pad out annual budgets, unsold output can pile up in the intervening months.

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March Plasma Systems has release of an improved version of its AP-1000 plasma system for high-volume plasma processing of semiconductor and microelectronics devices. The current system has a large installed base at customer sites worldwide, with over 200 systems currently in the field. The redesigned version provides the same production-proven plasma technology and performance in a smaller, more compact and easier-to-service design.
 
"Every square inch of clean room and manufacturing space is valuable," said Peter Bierhuis, president. "We have improved the new AP-1000 system to consume 24% less actual floor space than before, and 45% less effective floor space when you include all of the required maintenance areas. We have also moved key components to make them more accessible and easier to service. An added benefit for large-scale manufacturing facilities is that more AP-1000 systems can be placed side-by-side in a smaller area because now the chassis is smaller, there are no required maintenance areas at the sides of the system, and the plasma chamber door has been redesigned."

 
The system is capable of a variety of plasma modes and can handle a range of plasma gasses. March specifically designed the new system with existing customers in mind so that process re-qualification is not required when switching to the improved system. Accordingly, new system process performance is guaranteed for customers with copy-exact requirements.


March Plasma Systems, marchplasma.com

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