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SAN JOSE – Worldwide sales of semiconductors reached $19.6 billion in April, up 8.1% from April 2005’s sales of $18.1 billion, the Semiconductor Industry Association reported today. SIA reported a nominal decline of 0.4% from March, when total sales were $19.7 billon.
 
“More intense competition led to a sequential decline of 6.1% in sales of microprocessors, offsetting modest growth in the rest of the microchip market,” said SIA president George Scalise. Read more ...
SANTA CLARA, CA -- Sun Microsystems will lay off 11 to 13% of its workforce and shut down some of its North American campuses as it seeks to regain profitability.

The server OEM said it would lay off between four and five thousand employees and sever its Newark campus and Sunnyvale, CA, leases. The moves are expected to save as much as $590 million in annual operating expenses.
Read more ...
JACKSON, MI -- EMS services provider Sparton Corp. has completed its acquisition of Astro Instrumentation for approximately $26.15 million, the company said today.

Privately owned Astro had audited sales for the year ended Dec. 31 of $33 million.

Additional consideration may be paid to the sellers over the four years following the closing based on a percentage of earnings before interest and taxes.

Astro designs, manufactures and sells a variety of specialized medical laboratory test equipment. It operates a 40,000 sq. ft. facility in Strongsville, OH, and has a 20,000 sq. ft. addition under construction.

Sparton's intent is to operate the business as a wholly-owned subsidiary at its present location and with the current operating management and staff.

Munich – SUSS MicroTec successfully completed initial reliability testing with IBM for 300 mm Pb-free C4NP solder bumped wafers. SUSS is currently building a high-volume manufacturing C4NP tool set for IBM in preparation for production use.
 
C4NP, a wafer-bumping technology developed by IBM, stands for Controlled Collapse Chip Connection - New Process. It is an alternative to the electroplating process. Bulk solder is injection-molded into glass molds and subsequently transferred from mold to wafer in a single step.
 
In the reliability testing, 300 mm wafers were bumped with SnCu and SnAg solders using a 200 micron pitch with 1.3 million bumps per wafer test vehicle. Chips measuring 14.7 mm² were joined to organic buildup chip carriers and subjected to the following tests:
 
JEDEC moisture level 3 preconditioning
Shock and vibration
Deep thermal cycling (-55 to + 125°C)
HAST and THB moisture stressing                                                                                                          
High temperature storage
Electromigration
Wettability
Construction analysis
Alpha emissions
 
No failures were attributed to the C4NP process.

Pittsburgh, PADesignAdvance Systems, a developer of design automation software for users of EDA and MCAD tools, has entered the European PCB design market with its appointment of CADLOG as a distribution partner.
 
Based in Rome, the distributor will provide PCB designers in Italy, Spain, Portugal and Switzerland with DesignAdvance products and technical support.


MANKATO, MN -- XATA Corp. has increased its purchase commitments to Winland Electronics by $3.3 million. The increase is anticipated to be consumed by the end of this year. Winland manufactures products used in XATA's onboard GPS tracking and wireless communications system marketed to the fleet trucking industry.
 
Lorin Krueger, Winland CEO, said in a press release, "This significant order follows the original $4.5 million purchase order we received from XATA Corp. in September of 2005. We have a multi-year agreement with XATA and look forward to being a part of their long-term growth."
ATLANTA UP Media Group (UPMG) today named respected industry veteran Kathy Nargi-Toth as editor of Printed Circuit Design & Manufacture magazine.
 
Nargi-Toth has more than 20 years experience in the PCB industry, most recently as global business director at Technic Inc., a supplier of precious and non-precious metal plating chemistry and equipment for electronic component manufacturing.
 
“We wanted a world-class leader and in Kathy we have one,” said Mike Buetow, editorial director of UPMG’s electronics division and Circuits Assembly’s editor-in-chief. “Kathy is known the world over for her knowledge, insight and sensitivity to the issues that matter most to our readers. I can’t think of anyone better to continue PCD&M’s 20-year history as a vital industry journal.”
 
“I am excited to bring my expertise to the industry from a different vantage point as editor of PCD&M,” said Nargi-Toth. “I look forward to the opportunity to be able to guide the publication in innovative ways that continue to support our goal of delivering a comprehensive source of information that is relevant in today’s rapidly evolving printed circuit board design and manufacturing environment. My objective is to ensure that our publication provides unparalleled value to our over 35,000 readers in every issue.”
 
Nargi-Toth replaces Andy Shaughnessy, editor of PCD&M since 2004, who has been tapped by UPMG to head up a new, music-oriented online media product. He will continue to serve as an editor at large for PCD&M  and Circuits Assembly.
 
Prior to Technic, Nargi-Toth was technical marketing manager, HDI materials and metallization at Enthone. She also has experience as a multilayer process engineer for a major supplier of printed wiring boards.
 
Nargi-Toth has authored numerous papers on PWB metallization and high density interconnect structures (HDIS) techniques. She has been a featured contributor to PCD&M, Circuits Assembly, HDI, Electronic Packaging & Production and numerous other trade journals for the PWB industry. She has also presented dozens of training seminars and technical sessions at the world’s leading PWB fabrication, assembly and OEM companies worldwide.
 
Active in the IPC, she has contributed to numerous industry standards and on marketing committees, including committees for HDIS, the Technical Marketing Research Council and the PCB Suppliers Council.
TOKYODenso Corp. in July will begin construction of new facility on the premises of its Agui Plant located in Japan. Denso Elecs Co. Ltd. will transfer its headquarters and electronic product manufacturing plant from its Takatana Plant to the new facility, expected to be completed in March 2007.
 
The company expects to invest around $19 million (USD) in the 12,800 sq. m. building.
 
Production of electronic products including bar-code readers, IC card readers, and programmable controllers is scheduled to start in May 2007.
 
The company also announced future plans to move the development division of Denso Wave to the Agui plant.

Atotech introduces StannoPure HSB Bright Tin Plating and Stannopure HSM Matte Tin Plating Products in the U.S. 
 
The range of pure tin processes have been developed to meet the EU directives WEEE and RoHS, which ban the use of lead in the electrical and electronic industries. While matte tin has become a favored SnPb alloy replacement option in plating connectors, bright pure Pb-free tin has not yet gained market attention in electronic applications.
 
“With StannoPure HSB, your customers can now benefit from a ‘whisker-mitigated’ bright tin electrolyte, complying with JESD 22A121.01 requirements,” said Gene Barlowe, U.S. functional electronics coatings manager.
 
Atotech, atotech.com
 
Boston, MA -- Innov-X Systems has joined with GoodBye Chain Group and NSL Analytical to present a series of online webinars to build awareness and provide information and knowledge on RoHS/WEEE Directives.
 
An hour-long meeting on June 15 at 2 p.m. EST will enable discussions with legal, technical and business experts regarding Pb-free due diligence.
 
For more info, visit goodbyechain.com/content/view/46/61/ 
Dimatix has added software capabilities to its DMP-2800 materials deposition system. Aimed at providing increased flexibility for designing printed patterns, Dimatix Drop Manager software adds the capability to print standard Windows bitmap (BMP) image files with an optional Gerber File Import (GFI) feature.
 
Martin Schoeppler, VP, strategic business development, saic, “This software release dramatically increases the complexity of patterns that technology professionals can print. Developers of jetted electronics in particular will benefit from the easy-to-use Gerber converter.”
 
The new capability allows designers to utilize image editors, such as Adobe Photoshop or Microsoft Paint, to directly edit files for precise single drop placement. Third-party conversion programs can be used to create BMP files from AutoCAD, PDF or other vector-based applications.
 
With the GFI option, DMP-2800 users can print Gerber files from all popular PCB layout packages at resolutions up to 5080 dots per inch (5 µm droplet pitch). The GFI option also includes a copy of GerbMagic, a popular Gerber file viewer and manipulation tool. GerbMagic allows rotations, mirroring, panelization and compositing of multiple Gerber images into one.
 
 
The Dimatix DMP-2800 series printer is a bench-top precision digital materials deposition system for high-precision patterned jetting of functional fluids – including nanoparticle-based metallic and organic materials – on any type of surface, such as plastic, glass, metal sheets, silicon, membranes, gels and paper.
 
The system is an easy-to-use tool to quickly develop and test processes and prototypes, as well as to conduct low-volume manufacturing of a broad range of products – from PCBs, RFID tags and flexible or rigid displays to DNA arrays, optical microlenses and wearable electronics.
 
By directly printing on their substrates, customers can develop prototypes and keep process technology in-house. Customers can fill the single-use cartridges with any type of fluidic material to perform print and deposition functions without having to become fluid jet experts.
 
Dimatix, www.dimatix.com
Cognex has added new features to its VisionPro machine vision systems to accelerate development of PC-based machine vision solutions for automated inspection and quality assurance applications.
 
“VisionPro’s new interactive tools make it fast and easy to evaluate, implement, and deploy multi-camera applications completely without programming,” said Marilyn Matz, senior VP, PC Vision. “With VisionPro, customers can maintain the power and flexibility of a fully programmable PC vision system, yet significantly reduce setup time and development cost. VisionPro provides a vision development environment with something for everyone…interactive drag and drop, .NET scripting, and a full programming toolkit.”
 
The system now offers a set of interactive tools for creating vision applications without programming:
QuickBuild environment quickly defines image acquisition, vision tools, and accept/reject criteria.
Communications Explorer sends inspection results to input/output lines and communication devices, such as PLCs or reject mechanisms.
Optional Scripting extends QuickBuild without programming the entire application.
Application Wizard automatically generates a runtime application with an operator interface in minutes.
 
Cognex Corp., cognex.com

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