Products
EDAConnect offers electronic design engineers an intuitive, easy-to-use connection from their EDA environment to their enterprise PLM system.
Provides an out-of-the-box software solution that protects the user from changes in either their EDA environment or enterprise PLM system. Its initial release provides integration for Mentor Graphics DxDesigner, Cadence Allegro and Agile. Additional EDA clients and PLM systems will be released as developed. Provides engineering with integrated library synchronization, design check-in and check-out, BOM extraction and comparison,
template driven design publishing and archiving, as well as an integrated view of the ECO process.
Offered in both site and enterprise licensing models to serve the needs of large and small organizations.
Perception Software, perceptionsoftware.com
A.C.E. Production Technologies introduces its KPH Series infrared (IR) preheat modules for the KISS102 Series Selective Soldering machine. KPH-10 and KPH-20 are simple to set up and use, and feature thermocouple ports to facilitate thermal profiling. KPH-10 offers a 10 x 24” heating area divided into two 10 x 12” individually-controllable zones of 750-watts each. KPH-20 offers a 20 x 24” heating area divided into four 10 x 12” zones.
Preheating drives out volatiles or moisture from the circuit board, minimizing the potential for delamination; it raises the overall temperature of the assembly and prevents thermal shock to the board, allows for faster processing, and reduces the potential for thermal shock and stress to the PCB.
Can operate in two separate modes: ‘Timer’ (times out at a specific setpoint) or ‘Ramp and hold’ (ramps to setpoint and holds that temperature). Following the preheat cycle, the operator manually advances the circuit board through the preheater into the KISS machine, where fluxing and soldering proceeds on a pre-heated board.
Available in benchtop or stand-alone configuration, product support rails line up with the rails of the solder wave.
Preheating drives out volatiles or moisture from the circuit board, minimizing the potential for delamination; it raises the overall temperature of the assembly and prevents thermal shock to the board, allows for faster processing, and reduces the potential for thermal shock and stress to the PCB.
Can operate in two separate modes: ‘Timer’ (times out at a specific setpoint) or ‘Ramp and hold’ (ramps to setpoint and holds that temperature). Following the preheat cycle, the operator manually advances the circuit board through the preheater into the KISS machine, where fluxing and soldering proceeds on a pre-heated board.
Available in benchtop or stand-alone configuration, product support rails line up with the rails of the solder wave.
A.C.E., www.ace-protech.com
LPKF Laser & Electronics has installed an LPKF UV laser processing system at Fine Line Stencil/A-Laser in Beaverton, OR.
LPKF MicroLine 600D is a next-generation UV laser capable of addressing a variety of tasks, including: cutting of flex circuits, cover layer cutting and skiving. It is also used for the machining of micro mechanical parts made of organic materials, such as polyimide and polyester.
LPKF Laser & Electronics, www.lpkfusa.com
FCT Assembly, fctassembly.com
LPKF MicroLine 600D is a next-generation UV laser capable of addressing a variety of tasks, including: cutting of flex circuits, cover layer cutting and skiving. It is also used for the machining of micro mechanical parts made of organic materials, such as polyimide and polyester.
LPKF Laser & Electronics, www.lpkfusa.com
FCT Assembly, fctassembly.com
Dual Rail Conveyor J204-53 optimizes manufacturing process equipment utilization, especially pick-and-place machines and high-volume, low- or medium-mix production. Production planning flexibility increases when the same process equipment can be used for both sides in double-sided SMD assembly or when two different products can be produced in single-sided production.
Transports and buffers PCBs between process machines, offers multiple-drive technology, eliminates contact between boards during transfer and features a safe, clean design with no visible motors or wiring. Sturdy structure offers reliable operation in demanding production conditions, and easy mechanical connection to other equipment.
Features steel frame construction, up to four individually driven conveyor segments on both conveyor rails, automatic indexing and inspection modes, Pb-free process compatible, PLC controller, start/stop/reset/emergency stop/inspection/send switches in membrane terminal, four standard frame lengths: 500, 1000, 1500, 2000 mm, SMEMA electrical interface, ESD-safe design and CE-safety compliant.
Transports and buffers PCBs between process machines, offers multiple-drive technology, eliminates contact between boards during transfer and features a safe, clean design with no visible motors or wiring. Sturdy structure offers reliable operation in demanding production conditions, and easy mechanical connection to other equipment.
Features steel frame construction, up to four individually driven conveyor segments on both conveyor rails, automatic indexing and inspection modes, Pb-free process compatible, PLC controller, start/stop/reset/emergency stop/inspection/send switches in membrane terminal, four standard frame lengths: 500, 1000, 1500, 2000 mm, SMEMA electrical interface, ESD-safe design and CE-safety compliant.
Elektrobit, elektrobit.com
Photo Stencil announces the results of Universal SMT Laboratories’ independent, extensive study, conducted in February 2006. The print-process study isolated the stencil alone to determine performance differences among a group of stencils manufactured by other stencil suppliers. Photo Stencil’s AMTX E-FAB stencil performed the best out of 12 stencils tested, provided by five different stencil manufacturers. The Xerox-authorized stencil manufacturer usse the AMTX Electroform stencil technology, licensed under U. S. Patents owned by Xerox and acquired by Photo Stencil in 1998.
The study included five electroform stencils and seven laser stencils, including Photo Stencil’s proprietary NicAlloy stencil. The report contains extensive data on the solder volume data for a range of SMT devices and aperture designs. Solder paste deposit heights, area and volume were measured for over 154,000 solder paste bricks. Solder paste volume and paste volume repeatability were measured for 16 SMT components in all 12 stencils. Both Pb-free and SnPb solder paste were used in the study. Stencils were ranked in paste volume delivery performance as well as paste volume repeatability. Photo Stencil’s E-FAB stencil provided the best paste transfer for both solder pastes among all stencils tested. NicAlloy was in second place for paste transfer.
The yield analysis program was used to determine the yield loss due to open defects of BGA and microBGA packages directly attributed to the stencil. The results show that compared to the best stencil, the increase in repair costs vary from an additional $658 for the second best to an additional $10,122 for the last place stencil. E-FAB provided the lowest rework cost for both solder pastes among all 12 stencils tested, with NicAlloy again coming in second.
The study included five electroform stencils and seven laser stencils, including Photo Stencil’s proprietary NicAlloy stencil. The report contains extensive data on the solder volume data for a range of SMT devices and aperture designs. Solder paste deposit heights, area and volume were measured for over 154,000 solder paste bricks. Solder paste volume and paste volume repeatability were measured for 16 SMT components in all 12 stencils. Both Pb-free and SnPb solder paste were used in the study. Stencils were ranked in paste volume delivery performance as well as paste volume repeatability. Photo Stencil’s E-FAB stencil provided the best paste transfer for both solder pastes among all stencils tested. NicAlloy was in second place for paste transfer.
The yield analysis program was used to determine the yield loss due to open defects of BGA and microBGA packages directly attributed to the stencil. The results show that compared to the best stencil, the increase in repair costs vary from an additional $658 for the second best to an additional $10,122 for the last place stencil. E-FAB provided the lowest rework cost for both solder pastes among all 12 stencils tested, with NicAlloy again coming in second.
For a copy of the full report, contact Dr. Coleman at 719-535-8528 or bcoleman@photostencil.com.
BEST Inc. has developed a simpler process for reworking or hand-placing high lead count connectors. The StencilQuik polyimide stay-in-place stencil helps rework high-density connectors by preventing bridging of neighboring solder joints while allowing technicians to “fit” connector contacts into the stencil.
Available in both 4 and 8 mil (0.10 to 0.20 mm) thickness. The stay-in-place feature means no compromising in solder paste volume. Each stencil is custom engineered to the application at hand. Deliveries are five business days with 24 to 48 hr. expedites available.
Business Electronics Soldering Technologies (BEST), www.solder.net
The process of placing or reworking the connector has been simplified. After preparing the site, the stencil is peeled from its release liner. It is then aligned on the circuit board. Solder paste is then squeegeed into the apertures of the stencil with the remaining material wiped away with a lint-free cloth. The connector is “fitted” into the loaded apertures and then reflowed. Any mask damage ensuing from device removal is repaired by placing the device onto the board.
“Repair depots and rework operations of electronic assemblers are raving about the time that they save and the quality of the rework using StencilQuik™ on hard to rework 50 plus pin connectors. In addition, hardware developers like the fact that to can easily place the more complex connectors on their development board on their own.” said Bob Wettermann of BEST Inc.
Available in both 4 and 8 mil (0.10 to 0.20 mm) thickness. The stay-in-place feature means no compromising in solder paste volume. Each stencil is custom engineered to the application at hand. Deliveries are five business days with 24 to 48 hr. expedites available.
Business Electronics Soldering Technologies (BEST), www.solder.net
ENDICOTT, NY— Endicott Interconnect Technologies has been awarded several new contracts for fabrication of wire bond PBGA substrates resulting from alliances with Silicon Valley-based companies Singulated Technology and CORWIL Technology Corp.
EI will provide wire bond PBGA substrates per Singulated Technology’s design specifications and CORWIL will provide the module assembly. End customers for these semiconductor modules use them in military, commercial and wireless electronics applications.
“This unique approach aligns best-in-class suppliers of substrate design, fabrication and assembly to produce superior finished products for low to mid volume applications where time-to-market is a critical factor in winning the business,” said James J. McNamara Jr., president and CEO of EI. “The EI team is very excited about the opportunity to partner with industry innovators, Singulated and CORWIL, and to provide substrates that add differentiating value.”
“This unique approach aligns best-in-class suppliers of substrate design, fabrication and assembly to produce superior finished products for low to mid volume applications where time-to-market is a critical factor in winning the business,” said James J. McNamara Jr., president and CEO of EI. “The EI team is very excited about the opportunity to partner with industry innovators, Singulated and CORWIL, and to provide substrates that add differentiating value.”
BP Microsystems has released BP Win 4.60, which features increased throughput on all 7th Generation automated programming systems.
By altering the site sequence prioritization routine to allow the autohandler to pick and place parts more efficiently, the 4710 and 4700 programmers can now program up to 1,400 devices/hr. (dph), an increase from 1,200 dph. On-the-fly vision system is helpful when handling fine-pitched devices and VSP devices.
The 3710 and 3700 programmers can now program up to 1,100 dph, up from 950 dph.
All 4710, 4700, 3710 and 3700 customers with a current software support contract can download the new software through the Web site.
BP Microsystems, bpmicro.com
By altering the site sequence prioritization routine to allow the autohandler to pick and place parts more efficiently, the 4710 and 4700 programmers can now program up to 1,400 devices/hr. (dph), an increase from 1,200 dph. On-the-fly vision system is helpful when handling fine-pitched devices and VSP devices.
The 3710 and 3700 programmers can now program up to 1,100 dph, up from 950 dph.
All 4710, 4700, 3710 and 3700 customers with a current software support contract can download the new software through the Web site.
BP Microsystems, bpmicro.com
Leica EZ4 StereoZoom can achieve sharp, clear images with light as bright as fiber optic illumination. Five integrated LEDs can be switched individually, dimmed and combined with transmitted light. Daylight 6500°K color temperature remains constant; true colors are preserved. Three-way incident light technology provides illumination to view samples from strongly structured objects to flat probes. LEDs have a 25,000-hour service life, which means no more bulbs to replace. The LEDs stay cool; microorganisms and plant samples are protected.
Other features include:
Image transfer is easy; PC connection is not required. Insert an SD card to record images, then upload to a PC via a card reader, projector or video recorder.
4.4:1 zoom ratio provides magnification range from 8-35X (with 10X eyepieces).
3 EZ4 versions are available: Integrated 10X/20 high eyepoint eyepieces; integrated 16X/15 high eyepoint eyepieces; and open eyetubes.
Eyetube angle of 60°.
100 mm working distance for easy access to specimens.
No removable parts.
100V to 240V integrated universal power supply.
The complete E-Series product line is designed to provide high-quality image, color and detail fidelity combined with mechanical precision for decades of maintenance-free functionality.
Leica Microsystems Inc., leica-microsystems.us
Other features include:
Image transfer is easy; PC connection is not required. Insert an SD card to record images, then upload to a PC via a card reader, projector or video recorder.
4.4:1 zoom ratio provides magnification range from 8-35X (with 10X eyepieces).
3 EZ4 versions are available: Integrated 10X/20 high eyepoint eyepieces; integrated 16X/15 high eyepoint eyepieces; and open eyetubes.
Eyetube angle of 60°.
100 mm working distance for easy access to specimens.
No removable parts.
100V to 240V integrated universal power supply.
The complete E-Series product line is designed to provide high-quality image, color and detail fidelity combined with mechanical precision for decades of maintenance-free functionality.
Leica Microsystems Inc., leica-microsystems.us
Promation is offering an enhanced option on all of its PCB handling equipment that tracks and displays the operational sequence of the station through its various functions. The option also includes automatic width adjustment, offset width adjusting, password protection and error tracking.
Additional features of the Signature Series include: manual mode operation (can operate independent features of the system with the press of a button), PCB counter (tracks the number of products passed) and Auto mode(for production run).
Promation, pro-mation-inc.com
The 15th version of GerbTool has a host of new features and technology, such as HyperNETLIST generation, that have been handed down from VisualCAM. It increases netlist generation performance over competitive tools by 5 to 10X.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
This release contains a series of enhancements to help users increase throughput.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
Universal Instruments will demonstrate its latest platform placement system, the AdVantis XS, at Semicon West. Designed for the convergence of semiconductor and standard surface-mount assembly, the system deploys Universal’s VRM linear motors for accuracy and repeatability.
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
Universal Instruments, uic.com
Semicon West Booth 7039
AdVantis XS evolved from the GSMxs, delivering similar accuracies of +/-9 microns at +/- 3 sigma, but with a 25% increase in feeder capacity for on-machine inventory and a 15% speed improvement. Advanced materials engineering and optimized design offers customers a price some 25% lower than its predecessor, with backward compatibility, shared resources and common interfaces.
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
Universal Instruments, uic.com
Semicon West Booth 7039
