Products
The EVS 3000 and EVS 6000 systems are part of the EVS Series.
Offering capacities of 10 kg/20 lbs (EVS 3000) up to 20 kg/44 lbs (EVS 6000), the machines have (in most cases) the facility for single operation dedrossing of even large wave soldering machines. Large integrated hopper makes rapid transfer of dross simpler and safer, and reportedly speeds dedrossing times by up to 50%.
In the enclosed automated system, hot dross is loaded into the large hopper and sealed into the machine. The process recovers the solder into a solder tray in the form of ingots that are easily placed back into the solder pot and deposits the spent dross automatically through a chute to a covered dross bin. Air is extracted via a standalone, four-part filtration system.
A Hopper Extraction System prevents the escape of any fumes and dust that may be generated when loading. An automatic air-knife cools the molten solder ingots until they are safe to handle. Premature removal of the ingot tray is prevented by a safety lock. Handling and moving of dross is reduced to a minimum as it is contained until it is automatically ejected into the dross bucket.
Safety features are built into the machine to protect against misuse and abuse.
EVS International, solderrecovery.com
Nepcon UK Booth G5
Offering capacities of 10 kg/20 lbs (EVS 3000) up to 20 kg/44 lbs (EVS 6000), the machines have (in most cases) the facility for single operation dedrossing of even large wave soldering machines. Large integrated hopper makes rapid transfer of dross simpler and safer, and reportedly speeds dedrossing times by up to 50%.
In the enclosed automated system, hot dross is loaded into the large hopper and sealed into the machine. The process recovers the solder into a solder tray in the form of ingots that are easily placed back into the solder pot and deposits the spent dross automatically through a chute to a covered dross bin. Air is extracted via a standalone, four-part filtration system.
A Hopper Extraction System prevents the escape of any fumes and dust that may be generated when loading. An automatic air-knife cools the molten solder ingots until they are safe to handle. Premature removal of the ingot tray is prevented by a safety lock. Handling and moving of dross is reduced to a minimum as it is contained until it is automatically ejected into the dross bucket.
Safety features are built into the machine to protect against misuse and abuse.
EVS International, solderrecovery.com
Nepcon UK Booth G5
Speedprint Technology, a division of Blakell Europlacer Group, will display SP200avi inline stencil printer at the upcoming Nepcon trade show in Birmingham, U.K.
Designed for medium- and high-throughput, high-mix applications, the 23" inline stencil printer uses a patented “look down, look down” approach to vision alignment. Twin roving cameras mounted on independent X-Y gantries ensure precision alignment using fiducial marks or PCB/stencil features. The vision system facilitates a “paste on stencil” inspection feature that helps determine if there is adequate paste on the stencil before running the print cycle.
Selective Auto-Paste Dispense technology is fully programmable. The twin camera vision system analyzes the stencil to see where paste is required, and the dispenser deposits it accordingly. This reportedly guarantees consistent solder paste deposition onto PCBs.
The user interface runs under a menu-driven Windows XP application. The software incorporates self-diagnostic capabilities, including production logging and automatic fault report generation.
Data stored on the machine may be accessed remotely via a PC modem connection, allowing for “on the fly” troubleshooting. Automatic rail width adjust is standard to help with quick changeovers in a high-mix manufacturing environment. Stencil loading is automatic; it does not require adaptors for varying sizes of stencil frames.
Speedprint Technology, speedprint-tech.com
Nepcon Birmingham Stand No. C10
Aquanox A4520T Aqueous Chemistry for Flush Mounted and Fine-pitch Components is designed to clean under low standoffs and in the tight spaces caused by smaller, more heavily populated devices. The chemistry has reportedly proven effective on all Pb-free, no-clean and eutectic materials available today, while providing a low cost of ownership.
Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety. Easy to use, is effective without sump side additives and is said to provide brilliant joints. Features a long bath life, and is RoHS compliant.
Cleans numerous soils including lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides and polymerized soils. Is multi-metal safe for use on yellow metals, aluminum, ferrous, composites and most precious metals. The biodegradable aqueous solution contains no CFCs or HAPs. Is non-flammable and non-corrosive.
Available commercially in one, five and 55 gallon containers.
Kyzen Corp., kyzen.com
Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety. Easy to use, is effective without sump side additives and is said to provide brilliant joints. Features a long bath life, and is RoHS compliant.
Cleans numerous soils including lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides and polymerized soils. Is multi-metal safe for use on yellow metals, aluminum, ferrous, composites and most precious metals. The biodegradable aqueous solution contains no CFCs or HAPs. Is non-flammable and non-corrosive.
Available commercially in one, five and 55 gallon containers.
Kyzen Corp., kyzen.com
Nepcon East booth 2000
Optilia Flexia BGA/SMT Video Inspection Microscope is an ESD-protected video microscope for look-down or look-under visual inspection of solder joints on assembled PCBs components, solder/flux mixtures, bare circuit cards/pads, cables/connectors, wire bonds and stencils.
Can be set up in seconds with either a "look-down" macro zoom lens (1-60X) or "look-under" (4X zoom) side-viewing BGA lens. Can be connected directly to a hand held monitor, PC or Laptop via high speed USB 2.0 frame grabber (included). Imaging applications include digital image capture, video recording and optical measurements. Optimized for Pb-free inspection and provides data management and documentation tools.
The side viewing lens offers the capability to look-under and inspect BGAs, µBGAs, CSP and flip-chip packages with minimal package stand-off. The BGA lens captures sharp images of the soldered balls under the BGA package up to 12 mm deep (~15-20 rows) and down to a 0.05 mm stand off. The lens allows users to perform failure analysis and confirm solder ball shape, reflow compression, wetting and flux conditions, and other visual characteristics of SMT/BGA components.
Can be set up in seconds with either a "look-down" macro zoom lens (1-60X) or "look-under" (4X zoom) side-viewing BGA lens. Can be connected directly to a hand held monitor, PC or Laptop via high speed USB 2.0 frame grabber (included). Imaging applications include digital image capture, video recording and optical measurements. Optimized for Pb-free inspection and provides data management and documentation tools.
The side viewing lens offers the capability to look-under and inspect BGAs, µBGAs, CSP and flip-chip packages with minimal package stand-off. The BGA lens captures sharp images of the soldered balls under the BGA package up to 12 mm deep (~15-20 rows) and down to a 0.05 mm stand off. The lens allows users to perform failure analysis and confirm solder ball shape, reflow compression, wetting and flux conditions, and other visual characteristics of SMT/BGA components.
Focalspot, focalspot.com
Model 1550 features large board x-ray inspection with automated motion control, measurement and analysis. Has advanced solid-state detector-based inspection for Pb-free assembly, choice of Image Intensifier and CMOS-based high-resolution detectors, full programmability with integrated motion control and image measurement analysis, and simple set up of program using 1-2-GO Interface.
Offers a 130 kV X-ray source, with a continuously variable field of view (up to 1.8" with zoom). Is reportedly easy to learn, use and maintain. Features large-board handling area (18 x 24"), magnification 700X, high MTBF, fully integrated compact system and image archiving in popular file formats.
The set-up program allows users to characterize the entire process with one solution. Has onscreen representation of boards for easy maneuvering.
Incorporates three innovations:
A manipulator design provides fast, accurate, repeatable sample positioning;
Nexus 300 software with 1-2-GO interface offers maneuverability;
CMOS-based 12 bit solid-state detectors for high-contrast resolution x-ray inspection.
VJ Electronix Inc., vjelectronix.com
Offers a 130 kV X-ray source, with a continuously variable field of view (up to 1.8" with zoom). Is reportedly easy to learn, use and maintain. Features large-board handling area (18 x 24"), magnification 700X, high MTBF, fully integrated compact system and image archiving in popular file formats.
The set-up program allows users to characterize the entire process with one solution. Has onscreen representation of boards for easy maneuvering.
Incorporates three innovations:
A manipulator design provides fast, accurate, repeatable sample positioning;
Nexus 300 software with 1-2-GO interface offers maneuverability;
CMOS-based 12 bit solid-state detectors for high-contrast resolution x-ray inspection.
VJ Electronix Inc., vjelectronix.com
Nepcon East booth 5019
FLX2010-LCV flexible pick-and-place system features a large board size and feeder capacity with a small footprint.
Offers changeover without downtime. Has intelligent feeders, large feeder capacity (310) and offline programming and job planning. Starts at 5,000 CPH, with 150 feeders inline and can be expanded to 15,000 CPH with over 470 feeders.
MIS software offers production planning, inventory control, quality control through bar code verification and traceability of lots. Requires only 110 V of power.
User-friendly Windows programming with complete graphical interface shows operators or engineers images of the library, feeders, PCB and the overall machine. All corrections can be done on the fly, saved and continued on the same PCB. All parts are accessible for replacement, cleaning and calibrations. All parts to the bare frame can be exchanged in the field.
Is equipped with a combination of different alignment systems ¾laser and vision. Vision systems can be upgraded at the customer site if production requirements change.
Essemtec, essemtec.com
Nepcon East booth 2031
Offers changeover without downtime. Has intelligent feeders, large feeder capacity (310) and offline programming and job planning. Starts at 5,000 CPH, with 150 feeders inline and can be expanded to 15,000 CPH with over 470 feeders.
MIS software offers production planning, inventory control, quality control through bar code verification and traceability of lots. Requires only 110 V of power.
User-friendly Windows programming with complete graphical interface shows operators or engineers images of the library, feeders, PCB and the overall machine. All corrections can be done on the fly, saved and continued on the same PCB. All parts are accessible for replacement, cleaning and calibrations. All parts to the bare frame can be exchanged in the field.
Is equipped with a combination of different alignment systems ¾laser and vision. Vision systems can be upgraded at the customer site if production requirements change.
Essemtec, essemtec.com
Nepcon East booth 2031
Fineplacer CRS 10 compact rework system is designed for customers needing a fixed configuration. Said to have quick set up and easy operation. Most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large SMD boards. Applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components (such as 0201, 0402, 0603 and connectors), RF-shields, shielding frame, flip-chip rework as well as customized applications.
Features a Plug-and-Work design, Vision Alignment System with stationary beam splitter, controlled z-height during reflow, proven soldering head technology, Pb-free compatible rework and an automated component place and lift-off function. Also equipped with a Controlled Mixed Soldering System (COMISS) reflow module for top heating and full-area bottom heating.
High accuracy (better than 10 µm placement accuracy) allows use with components with pitches down to 100 µm. Large field of view can align large components, e.g. super BGAs with side lengths of up to 45 mm, without additional optics.
Finetech, finetechusa.com
Features a Plug-and-Work design, Vision Alignment System with stationary beam splitter, controlled z-height during reflow, proven soldering head technology, Pb-free compatible rework and an automated component place and lift-off function. Also equipped with a Controlled Mixed Soldering System (COMISS) reflow module for top heating and full-area bottom heating.
High accuracy (better than 10 µm placement accuracy) allows use with components with pitches down to 100 µm. Large field of view can align large components, e.g. super BGAs with side lengths of up to 45 mm, without additional optics.
Finetech, finetechusa.com
Nepcon East booth 2001
A-Tek has added the Drytech range of controlled humidity storage systems for electronics packages and sensitive devices. Drytech manufactures systems for all components and sensitive devices storage demands. A large range of standard products are available, customization is available. Meet IPC/JEDEC Standard J-STD-033A. Sizes vary from 100 to 1700 L in capacity.
During packing, shipping and storage, parts are often exposed to many fluctuations in temperature and humidity; an ideal environment for the hygroscopic nature of plastic encapsulants to take effect, and moisture to be absorbed into the device. Moisture will directly impact product quality, final product reliability, customer satisfaction and manufacturing costs. The smallest amount of moisture, when subject to elevated temperatures, creates vapor pressure that can induce stress cracks and fractures in devices. These may show as failures in test or in a worse case, as field failures. Storing sensitive devices in an environment of less than 5% relative humidity will protect the parts and assist in stabilizing the devices prior to manufacture.
A-Tek, atekllc.com
During packing, shipping and storage, parts are often exposed to many fluctuations in temperature and humidity; an ideal environment for the hygroscopic nature of plastic encapsulants to take effect, and moisture to be absorbed into the device. Moisture will directly impact product quality, final product reliability, customer satisfaction and manufacturing costs. The smallest amount of moisture, when subject to elevated temperatures, creates vapor pressure that can induce stress cracks and fractures in devices. These may show as failures in test or in a worse case, as field failures. Storing sensitive devices in an environment of less than 5% relative humidity will protect the parts and assist in stabilizing the devices prior to manufacture.
A-Tek, atekllc.com
SEFAR PCF is a pre-coated mesh engineered for the stencil parameters and frame sizes of the CD/DVD market segment. Said to provide consistent coating tolerances, stencil durability, wide exposure window and optimal emulsion thickness (EOM) to surface roughness (Rz) combination.
Sefar is now launching a fully-coated version, “SEFAR PCF FC” (Pre-Coated Fabric, Fully-Coated). The addition allows additional screen printing market segments access to the benefits of the stencil system. In addition to improving print quality, it also offers process improvement by removing degreasing, coating, block-out and multiple drying steps that are required to prepare a screen.
By providing a fully-coated mesh, customers with virtually any size frame can use it: bottle and container manufacturers, pen printers, tube manufacturers, ad specialty companies, membrane switch or industrial product printers, and any small format graphics printer concerned with image quality. Currently available in fine mesh specifications (ie. 305 threads/in. and higher). The coated fabric can be purchased as a roll to stretch in-house, or as a stretched screen from a screen fabrication location.
Sefar Printing Solutions, sefar.us
Sefar is now launching a fully-coated version, “SEFAR PCF FC” (Pre-Coated Fabric, Fully-Coated). The addition allows additional screen printing market segments access to the benefits of the stencil system. In addition to improving print quality, it also offers process improvement by removing degreasing, coating, block-out and multiple drying steps that are required to prepare a screen.
By providing a fully-coated mesh, customers with virtually any size frame can use it: bottle and container manufacturers, pen printers, tube manufacturers, ad specialty companies, membrane switch or industrial product printers, and any small format graphics printer concerned with image quality. Currently available in fine mesh specifications (ie. 305 threads/in. and higher). The coated fabric can be purchased as a roll to stretch in-house, or as a stretched screen from a screen fabrication location.
Sefar Printing Solutions, sefar.us
Aqueous Technologies will exhibit StencilWasher-ECO semi-automatic stencil cleaner for solder paste removal at the upcoming Nepcon East exhibition and conference on May 10-11 in Boston.
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils.
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils.
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
JPSA has begun shipping IX-1100 C2C UV 193nm excimer laser wafer processing systems equipped with cassette to cassette automated wafer loading/unloading systems and JPSA advanced factory automation software. These systems can process more than 80 wafers per hour, and are suited for a variety of materials such as: GaAs, silicon and sapphire.
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC.
Available with optional SQL database connectivity. Typical applications include tracking of process data by part number.
JPSA, www.jpsalaser.com
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
IX-1100 is an industrial excimer workstation, a compact integrated UV processing system with a built-in high- power excimer laser. Features automated mask control, step and scan and high-resolution imaging and workpiece viewing using the Chromacel line. Optional modules include beam attenuators and homogenizers and dielectric laser masks.
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC.
Available with optional SQL database connectivity. Typical applications include tracking of process data by part number.
JPSA, www.jpsalaser.com
The high-performance RC7M robot controller has a program processing speed five times faster than the previous RC5 model. Features user-friendly operation, light weight and compact size. Weighs under 50 lbs. and measures 440 x 425. x 157.5 mm.
Features an expanded range of communications interfaces, including 100 Base-T Ethernet, USB, RS-232C and Mini Parallel I/O. DeviceNet, Profibus and Parallel I/O ports are optional. The 3.25 MB memory (expandable to 5.5 MB) can hold up to 10,000 programming steps and 30,000 teach points. Fully compliant with the latest ISO, ANSI and CE safety standards.
Options include a new, improved teaching pendant with a large 7.5 in. color touchscreen and a lower-cost, high-functionality minipendant with a 128 x 64 pixel LCD display, as well as WINCAPS II 3-D simulation software, which allows offline programming and remote, real-time monitoring of robot operation.
DENSO Corp., densorobotics.com
Features an expanded range of communications interfaces, including 100 Base-T Ethernet, USB, RS-232C and Mini Parallel I/O. DeviceNet, Profibus and Parallel I/O ports are optional. The 3.25 MB memory (expandable to 5.5 MB) can hold up to 10,000 programming steps and 30,000 teach points. Fully compliant with the latest ISO, ANSI and CE safety standards.
Options include a new, improved teaching pendant with a large 7.5 in. color touchscreen and a lower-cost, high-functionality minipendant with a 128 x 64 pixel LCD display, as well as WINCAPS II 3-D simulation software, which allows offline programming and remote, real-time monitoring of robot operation.
DENSO Corp., densorobotics.com
Press Releases
- SMTXTRA Partners with Quantum Systems to Expand Representation in Key Territories
- KYZEN Announces Exclusive Partnership with Manufacturers’ Representative Restronics Florida
- Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225 on 11-13 June 2024 in Nuremberg, Germany
- Precision Automation & Assembly Appointed as New England Rep for Kubler US