PRO 6 series robotic soldering system reportedly provides multiple technologies built into a single work cell. The PRO 6Td is a dual-head soldering robot that may be configured with both iron tip and diode laser soldering heads. May be independently controlled for progressive assembly or used in sequence for high output.
The soldering head and automatic solder feeder are said to be dynamically independent and adjustable from one another. May be programmed to look for known fiducial points, analyze them and automatically center for a reported 100% pinpoint accuracy.
IS620 laminate now comes with enhanced electrical attributes. Reportedly offers 25% lower dielectric loss and improved thermal performance. Dielectric loss at 10 GHz are said to be in the 0.007 range using the stripline test method and in the 0.005 range with the split post method. Isola, www.isola-group.com
The YTX-3000 x-ray inspection system now comes with 3-D tomography. Is said to be ideally suited for analysis of interconnections for stacked die, MEMS, package-in-package and package-on-package.
PolarChip SF3000 is a soft silicone-free, thermally conductive material suited for filling air gaps between heat-generating devices on PCBs. The highly compressible thermal gap pad is a fluoropolymer composite that consists of an expanded polytetrafluoroethylene matrix filled with boron nitride particles. The reinforcing nature of the ePTFE matrix results in a composite that is said to be physically robust, easy to handle and does not require additional reinforcement. Produced in continuous rolls with a pressure sensitive adhesive on one side. Comes in sheets or rolls of precision die-cut parts suitable for high-volume automation assembly.
The 8311M-76G permanent/removable mounting adhesive comes on double-coated polyester film and is said to bring a clean, permanent/removable bond to digital imaging, electronics, medical devices and graphic arts industries for temporarily mounting foams, polycarbonates, plastics to glass and other hard surfaces.
Has a 76 gloss-gloss liner polycoated and is moisture-resistant. Repositioning and removability of less than 1 lb. for many surfaces.
Available up to 54 wide; one-year shelf life when stored under cool, dry conditions.
The High-Speed Cable Guide details cable assemblies, cables, and custom capabilities. Data Rate cable assemblies include 50ÿ and 75ÿ coax and 100ÿ Twinax cable assemblies on a variety of pitches along with a high-density cable assembly, featuring a signal integrity optimizing contact system. Custom and mix-and-match Data Rate cable capabilities are also featured. New to the guide is the Data Rate Cable Selector that includes specifications for high-speed cables, including 20ÿ Quiet Power, 100ÿ Twinax, and an assortment of 50ÿ and 75ÿ coax options. High-speed I/O cable assemblies include V-Port and HDMI 100ÿ differential pair cable assemblies and Edge Rate cable assembly.
XJTAG Professional is for debugging and testing PCBs with high pin count BGA devices. The interconnect test is said to exercise 5,000 nets in less than a second because of improvements to algorithms. It can also identify a higher proportion of faults and accurately report their locations. XJEase has added language features added to make the whole test script writing process more intuitive. Test code is now separated from configuration files. A COM Interface has been added to integrate with test executives such as LabVIEW, Visual Basic and other Windows-based custom applications.
The TestStation ICT now has UltraPin II 121 and 121a pin boards, options that include multiplexed or pure pin, analog-only or hybrid, and low pin-count or high pin-count. Offer non-multiplexed operation with unrestricted pin assignments for both analog and digital test applications and flexibility for programming driver/sensor logic levels, sense thresholds, slew rates and backdrive limits. Come with 15 mV drive and sense accuracy, 2.3 mV programming resolution, low driver impedance and ability to monitor and program backdrive currents. The 121 version has 128 real digital/analog pins per board and supports a maximum of 2,048 high-performance pins when configured in a TestStation LH, or 3,840 when installed in TestStation LX. The 121a version has 128 analog pins. Pricing starts at less than $100,000.
Debug Pro debugging software for TestStation in-circuit testers is said to feature intuitive graphical user interface, comprehensive tools, simplified command menus, and operational displays for debugging and qualifying ICT programs. Features include a label navigator that graphically displays each of the program’s tests; a statement editor that displays specified parameters available in user-selected tests and permits parameter selection and modification using a mouse or keystrokes; a guard editor that displays test instrument connections and in-circuit interconnections; a charting tool that displays measurement results using run or histogram charts and reports test statistics; component and property information windows that display information about board components, nets and other tester resources, and a customizable toolbar providing access to debug tools.
SL101 air-controlled dispenser is CE-certified and RoHS-compliant. Features three modes of operation (manual, timed and cycle) and 10 memory positions for dispensing control and flexibility. Available in 110V and 220V versions and is said to be suitable for use with a wide range of liquids. Equipped with suck-back control. Comes with accessory kit.
The PS588 high-volume offline programmer now features ICOS 3D inspection. Is said to combine programming and 3D inspection into one high-speed process. Robotic head picks and presents device to the ICOS inspection module, where x, y and z axes are visually inspected for flaws or damage. Post-programming inspection reportedly ensures all passed devices fall within the coplanarity tolerances before output to media. Also inspects lead pitch and slant. Designed for OEM/ODM or programming centers producing in high volumes for small or large batches.
Thermofilm heat-activated films are said to resist heat, solvents and plasticizers and provide high-cohesive strength for long-term performance. Have a relatively low bonding temperature, for use on temperature-sensitive substrates.
Thermofilm heat-activated films form permanent bonds to metal, plastic, ceramic and woven materials. Can be used for assembly of memory cards, mobile phones, smart cards, flex circuits and print cartridges.