PALO ALTO, CA-- Agilent Technologies Inc. (agilent.com) has developed bead probe methodology for in-circuit test of high-speed and high-density printed circuit boards (PCBs). Bead probe technology addresses the needs of electronics contract manufacturers for accurate testing of increasingly complex PCBs, such as those used in communications and computing.

 

As board circuitry gets smaller, traditional bed-of-nails test solutions become problematic. Because on-board test target sizes are shrinking, this approach is no longer capable of reliably contacting hyper-small test targets, which have an unacceptable performance impact on high-frequency signals. Likewise, boundary-scan cannot solve this problem because it does not offer 100% coverage of defects.

 

Bead probe technology circumvents these issues by placing very small, hemi-ellipsoid beads of solder directly onto a board's copper traces. A bead probe, only a few mils tall, protrudes above the solder mask. When partially flattened by a fixture-based, flat-faced target probe, it gives low-contact resistance needed for testing.

 

Bead probes are easily fabricated, using the same steps as solder masking/stenciling.

 

"Bead probes are particularly well suited for highly dense layouts or gigabit signals and, according to our tests, have a negligible impact on circuit performance during normal operation," said Kenneth Parker, engineer/scientist for Agilent's Electronic Manufacturing Test Division. "Bead probes let us approach an ideal of layout-independent, test-point placement -- a great benefit in high-density, high-frequency design that will revolutionize the normally adversarial relationship between board designers and test engineers."

 

Currently being tested by Agilent's high-volume manufacturing partner, full licensing of the technology is expected to be available by mid-2005.

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SwifTest-AQ ("Active Quality") software features real-time parts average testing (PAT) capabilities, designed to enable IC manufacturers to meet increasing safety standards and specifications for automotive electronics.

 

Performs PAT in real-time by calculating PAT limits from baseline data and binning out PAT outliers in real time, avoiding post-processing and subsequent delays in wafer processing.

 

Industry guidelines for semiconductor quality and reliability have been developed by the Automotive Electronics Council (AEC) to meet increasing safety standards for automotive electronic devices that drive the zero-defect goal for electronic parts.

 

Meets AEC-Q001 Part Average Testing standards during both wafer probe and final test. The AEC guideline presents a statistically based method for removing parts with abnormal characteristics— those parts that historically contribute significantly to

quality and reliability problems.

 

Jeff Bibbee, founder and CTO of Pintail Technologies, said, "Instead of post-processing large data files from all testers before calculating the PAT limits from the entire dataset for each test, SwifTest-AQ customers can increase quality dynamically, in real-time, and avoid delays in downstream manufacturing while also optimizing test time and capacity."

 

www.pintail.com

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Praveen Gupta's The Six Sigma Performance Handbook gives results-oriented help with Six Sigma initiatives. Readers will learn how to simplify Six Sigma methods for cost-effective implementations and how to implement DMAIC for improved performance of Six Sigma projects

 

Written with managers, not statisticians in mind, this book shows readers how to statistically evaluate a Six Sigma program, identify problems and make tailor-made adjustments to get desired results and revitalize a program.

 

A long-time Six Sigma educator and Master Black Belt, Gupta details:

·  The challenges of implementing Six Sigma in a real world environment.

·  The role of innovation in the Six Sigma Process.

·  A step-by-step roadmap to prevent false starts and avoid common implementation mistakes.

·  Forms to simplify DMAIC implementation of DMAIC.

·  Tools for solving key implementation problems in the service or manufacturing environment.

·  Scorecard and processes to sustain Six Sigma improvement.

·  Key factors to maximize, based on the Six Sigma SIPOC and application of theory of constraints.

·  Vital Lean tools for speeding up Six Sigma.

 

Praveen Gupta has been involved with Six Sigma since its origin in 1986. His first project, completed at Motorola under the guidance of Bill Smith, the inventor of Six Sigma, was published in Quality Engineering magazine in 1990. Praveen has continued to publish articles, monthly columns and books on Six Sigma, including Six Sigma Deployment and Six Sigma Business Scorecard.

 

Available through Amazon.com.

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Caster Cleaner said to improve performance and extend life of conductive wheels to reduce ESD risks caused by ungrounded carts. Enhances wheel performance by continually cleaning the wheel, reducing the build-up of dirt, wax and residue that may insulate the wheel from the floor. Extends the life of floor finishes, leaves less marking on the floor and keeps floors cleaner.

 

Provides an additional electrical path from the wheel to the stem of the caster, bypassing potentially insulative grease in caster bearings and wheel bushings that may cause an unreliable path to ground.

 

Install without tools in about 5 seconds to fully assembled and loaded carts; provide visual indication that the carts are grounded.  

 

www.Static-Dynamics.com

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