3M Wafer Support System for ultra-thin semiconductor wafer backgrinding is an alternative to conventional tape processes and is capable of producing wafers as thin as 20 microns. Permits manufacturers to use existing grinding equipment to produce thinner wafers, at faster grinding speeds, with increased yields. Includes both equipment and consumables for a comprehensive approach to wafer backgrinding support challenges.

Features include: 

• A wafer mounter to attach the wafer to the glass plate with liquid adhesive.
• A wafer demounter to separate the glass and adhesive from the wafer after the backgrinding process. 
• A glass cleaner/coater.

Consumable materials include 3M ultra-clean UV curable spin-on adhesive and a light-to-heat conversion coating. The LTHC layer enables separation of the adhesive from the glass after the backgrinding process.

Unlike tapes used in other systems, the liquid adhesive used in the 3M system flows into the topography of the wafer, providing even support over the entire surface and providing a rigid, uniform base. The system minimizes stress put on the wafer, resulting in less cracking and increased yields.

www.3M.com

KIC announces new software for its SlimKIC 2000 oven.

Features include:

• Temperature vs. time feature, for profiling a variety of processes. Allows running of profiles and and experiments for practically any thermal process (batch processes for cure, environmental temperature cycling, rework, high-temperature processes and more).
• Measures temperatures from -150º to 1,050ºF.
• Permits use of SlimKIC 2000 over a broader range of applications.
• User-defined process window; software calculates PWI .

The software is free of charge on the machine.

KIC provides thermal process development and control software.

www.kicthermal.com

Bliss chip tube carts are ergonomically designed for convenient chip tube storage and easy positioning. Constructed of steel, the carts incorporate four bin rows that can be subdivided on ½" centers. Using available slide-in dividers, the rows can be configured into various sizes. The presentation angle of the storage bins can be adjusted for operator comfort and for ease of access during manual component assembly. Gas lift springs assist in raising and lowering the unit.

Standard features of the carts include:

• Built-in ESD protection.
• Adjustable bin size.
• Ergonomically correct.
• Easily adjustable height via gas springs.
• Easily adjustable tilt.

www.blissindustries.com

XiDAT XD7500 PCBA x-ray inspection system provides for oblique angle views of up to 70° for any position 360° around the 18 x 16" (458 x 407 mm) inspection area. Inspects BGA and CSP devices. Viewing is enhanced with a filament-free, sub-micron x-ray tube that provides feature recognition to 950 nanometers.

Incorporates the latest revision of Dage's ‘point and click' x-ray operating system.

The machine will be exhibited at Booth 5811 during Assembly Technology Expo, Sept. 28-30.

www.dageinc.com