The 120° "Y" workstation  increases space efficiency while providing a more open and comfortable work area. This workstation cluster is designed for three or more people who may share a common central area, enabling communication and ready access to common equipment, supplies or reference materials.  

 

Personal space is created for each user while allowing for more application possibilities and easy adaptation to changing tasks and work styles. Modular privacy panels vary the degree of privacy desired.

 

Based on a double-sided columnar system, these workstations can be sized to suit the application through the selection of module sizes ranging from 36 to 72" and column heights of up to 84". 

 

 

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Stacked dies enable highly integrated systems in a single package. Modern microelectronics demand more functionality at chip level, smaller models, shorter time-to-market, greater reliability of design and lower cost. SOCs (system on chip) have made progress, but will soon come up against economic limits - particularly with embedded technologies for improved performance (such as when at least two different process technologies are to be integrated on the chip). This technology mix could be implemented through different chips in the most suitable technology for the respective functions, if not for the challenges connecting multi-pin chips at board or substrate level leads and complicated routing and interference. A possible solution: stacked dies made of ultra-thin silicon.

The thin, flexible silicon chips used are very demanding, highly fragile and also often warped. Suitable equipment for processing these thin dies must take account of these features.

The 2200 apm+ multi-chip die bonder features high-precision linear motors with dynamic servo-control and automatic compensation for temperature drift. High-res camera systems allow positioning precision at the xy level of ± 7 µm at 3 s and a maximum tilt of ± 0.15 ° at 3 s. Z-axis can be individually controlled for bonding functions and adhesive application. For assembly on warped substrates, an ultra-light tool's low bond force works in the 0 - 6 g ± 50 mg range.

The wafer transport system processes up to 25 different wafers with five ejection tools. Features material-protecting synchronous sequence of motions to pick the chip up from the carrier material with the help of a vacuum. Can handle small chips with edge length starting at 170 µm and, for flip-chip assembly, 500-µm chips. Automatic tool changer holds up to six different tools, including a bond head that can be heated to 350°C.

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Minneapolis, MN - Arranged by Dr. Ronald Lasky, Indium Corp of America/Dartmouth College, the SMTA Cost Estimating Guidelines with ProfitPro Software are intended to  model real-time cost estimating (RTCE) in the electronics industry.

 

While RTCE is simple in concept, manual calculations are tedious and cumbersome since they include production variables such as cycle time, hours/shift, shifts/day, days/week, set up time and unscheduled/scheduled downtime. Yield loss and cost of repair must also be considered, as well as inventory turns and interest rates.

 

Using these variables, ProfitPro, an Excel-based software application, can model RTCE for high-volume low-mix to low-volume high-mix lines. The software also has default values of cost metrics if the user does not know them, and can calculate:

- The amount of profit gained if setup time is reduced.

- The amount of profit gained if cycle time is decreased.

- The amount of profit gained if new equipment or materials increases productivity.

 

 

Visit the SMTA Bookstore on smta.org for more information.

A new phase change tape extends the line of Thermacool thermal management products for the computer assembly market. Provides high thermal transfer between microelectronic components on circuit boards and heat sinks, allowing the replacement of thermal grease in rapid microelectronic assembly operations.

 

Available in many customized die cut formats for a range of applications.

 

The new line of phase change products include:

• C1055, with very high thermal conductivity; has been specified in many high performance processor applications.
• C1060, which has an integral reinforcement to provide more robust handling.
• C1095X01 thermally conductive polymeric interface material designed to avoid bondline adhesion between heat sink and the microprocessor metal surface for rework.
• C1100 phase change compound with room temperature self-adhering-properties and improved heat transfer that is said to rival the best thermal grease.

 

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