Circuits Assembly Online Magazine - Current

Products

The new WaferRepair platform addresses the technology requirements associated with the reliable, cost-effective laser fuse processing of high density DRAM and other memory devices using redundancy, as well as laser programming for device customization and repair of non-memory devices. Delivers refinements in beam placement accuracy, laser spot size and ultra-fine, ultra-stable energy control that enable the processing of extremely tight-pitch fuse structures for yield enhancement. Feature the system precision required by 90-nm and smaller design rules.

Based on the new platform, the M450 fuse processing system features a laser spot size of 1.4 µm. The M455 has a laser spot size of 0.7 µm, enabling aggressive fuse pitch shrinks below 2 µm. Both process fuses at a rate of 60,000 Hz with beam-positioning accuracy of +/- 0.150 µm.

GSI Lumonics Inc., gsilumonics.com

ITT Industries, Cannon now offers many of its switch products in lead-free versions. Many also contain no cadmium, mercury or other toxic substances, such as hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers.

Switches such as the trackball navigation switch, and KMR, KMS, TPC, TPA and KSU tact switches are completely free of all chemicals mentioned above and are completely compatible with lead-free solder processes.

ITT Industries, Cannon, ittcannon.com

Following the adoption of the PumpPrint process from DEK printing machines and the installation of DEK Infinity printers, Tianjin-based OEM HEG has made significant improvements to its adhesive application process yields.

The company uses the machines to apply SMT adhesives for their automotive and consumer electronics products, replacing their SMT dispensers.

Since the installation of the printers, overall production defect rates have dropped to 20-30 ppm, as confirmed by HEG's quality assurance measures, which include 2-D inspection, visual inspection, AOI and electrical test. The company also reports that throughput for boards that require adhesive application has increased to more than 135 PCBs/hr, and over 81,000 adhesive dots/hr.

According to HEG, a major advantage of the PumpPrint process is its ability to operate even in harsh environmental conditions, as the process can adapt to quite a range of temperature and humidity conditions and glue viscosity levels.

HEG currently operates 21 automatic insertion machines, seven fully automatic SMT lines and nine manual assembly lines, reportedly achieving 8.16 million SMD placements/day and 8.68 million insertions/day.

Board-Lok ESD-safe molded tooling is designed to support PCBs in a firm, locked position parallel to the stencil.

The customized tooling can eliminate problems seen with conventional stencil printer tooling because it does not require vacuum to support the board. If the PCB is held by vacuum cups, the solder paste can be drawn through the via holes, contaminating the board and vacuum system.

Transition Automation Inc., www.transitionautomation.com

EasyTurn is a modular ‘T'- shaped junction that will send a board, on command, in either of two different directions, depending on need. When integrated with an AOI system, it can send defective PCBs to a magazine loader or to a rework station, while failure-free boards move directly to the reflow oven. Automatically adjusts to the specific width of each incoming board to prevent dropping or damage.

CAN-Bus controlled unit with full SMEMA compatibility for easy integration into any conveyor line. Can also be used as a linking unit from two conveyor lines into one reflow oven.

MIMOT, www.mimot.com

VISULA 7.0 enterprise-wide PCB design suite now features an embedded Place and Route Editor, P.R.Editor XR, and the Hot-Stage virtual prototyping tool. The Place and

Route Editor delivers improved routing functionality for faster completion of dense and complex PCBs, while the Hot-Stage tool facilitates a constraints-driven design process where potential signal integrity, EMC and manufacturing problems can be identified and corrected early in the design flow.

Ease of use improvements include damage repair, additional INI file settings for the layout editor and the addition of switchable toolbars with on-screen tool help, as well as improved Windows font support. The library tools support Windows XP as a database server. Design Technology Editor now features pad copy enhancement and automatic removal of legacy analysis data.

Introduces Activ-45, an automated 45-degree routing function, to the suite. The embedded router eliminates the need for a separate tool. P.R.Editor XR 1.4 allows batch checks to be made in embedded mode, can check against actual copper text vectors and can locate errors by code.

The Hot-Stage constraints-driven virtual prototyping tool facilitates ‘what if' analysis of design changes at the schematic stage. It ensures that design constraints can be maintained throughout the workflow.

Zuken USA Inc., www.zuken.com