Aquanox product family consists of aqueous chemistries for cleaning electronics assemblies. Superior solvency, mild pH and robustness make them suitable in a range of cleaning applications. Safely clean under low standoffs to remove tough surface-mount residues. Said to be easy to use, biodegradable, completely water-soluble and residue-free.
 
All products are RoHS compliant and designed with the environment in mind.
 
A4630 cleans Pb-free materials while providing low cost of ownership. This 6^th-generation product brings ambient temperatures and low concentrations while exceeding industry standards for both people and environmental safety. Typically used in aqueous spray-in-air equipment at 10 to 20%, from ambient temperatures. Said to provides brilliant joints, pass after pass, without the use of sump side additives and throughout an extended bath life.
 
A4520T aqueous chemistry for flush mounted and fine-pitch components cleans under low standoffs and in the tight spaces caused by smaller and more heavily populated devices. The 8^th generation chemistry has proven effective on Pb-free, no-clean and eutectic materials. Works at low temperatures and low concentrations while exceeding industry standards for people and environmental safety.
 
A4520, a cleaning agent designed for reflowed no-clean flux residues, has been tested on more than 100 leading solder pastes, tacky fluxes and wave solder fluxes. Is effective on reflowed solder paste as well as uncured SMD solder adhesives. The concentrated cleaning solvent for aqueous batch or in-line spray machines is subjected to thorough screening of leading solder pastes prior to release. Is aqueous, non-hazardous, non-regulated and environmentally safe.
 
Kyzen Corp., kyzen.com
Booth G62

BP Microsystems will display the 4710 automated programming system, in Adaptsys’ booth at Nepcon UK .

Is designed for high density devices and longer programming times, making it the fastest at programming Flash, while also programming Microcontrollers, FPGAs, PLDs and other device types.
 
Has improved site hardware to program devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications. By combining fast universal programming technology — 64 Mb in 15 sec. — and FX4 socket modules, which can program up to four devices simultaneously, it can program up to 44 devices at the same time.
 
BP Microsystems, www.bpmicro.com

Zestron, a supplier of high precision cleaning processes and services, will be exhibiting at Nepcon East on May 10 – 11. 
 
The company will be feature its latest products and services for:
PCB Defluxing: Effectively removing all flux residues ranging from rosin-based to synthetic no-clean and from eutectic or lead-free based formulation.
Stencil Cleaning: MPC-based and solvent-based cleaning agents for the removal of solder pastes and SMT-adhesives in a single process.
MPC Technology: Water-based cleaning technology combining the benefits of traditional water as well as solvent-based cleaning agents.
 
Zestron America
Nepcon East Booth  2040

Huntsman Advanced Materials has introduced two halogen-free laminating resins that comply with regulatory requirements for PCB manufacturing.
 
AZYRAL one- and two-component laminating systems combine versatile processing capabilities with good electrical characteristics and physical properties. Multilayer PCBs and other electrical components fabricated with the materials can withstand exposure to tough operating conditions.
 
Halogen-free AZYRAL XU8282-1 resin is RoHS compliant for Pb-free soldering operations.  This and two-component AZYRAL XTW8291/XTW8293 laminating systems feature easy-to-process, low viscosities for use with FR4 processing. Are nondicy-curing products, meet UL 94 V-O specifications.
 
Said to produce PCBs with a low dielectric constant, low dissipation factor, good surface resistivity and good volume resistivity.
 
Resins are high-temperature resistant materials with low moisture absorption, good thermal stability with glass transition temperatures from 320-482ºF, low coefficient of thermal expansion  and low shrinkage. 
 
Huntsman, huntsman.com/electronics