Products
Eunil H.A. Americas has added the PARMI SPI 3-D paste inspection system to its product line.
The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.
Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.
Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.
The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.
Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.
Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.
Eunil H.A. Americas, parmi.com
440-R SMT Detergent is available in a ready-to-use spray bottle for safe, effective manual cleaning of SMT stencils and related tooling. The stencil-cleaning chemistry is verified for specific parameters of environmental safety, user safety and cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program.
While ultrasonic technology is effective for removing solder paste from SMT stencils, manual cleaning continues to be common. Stencil cleaning has been identified as the most hazardous process with the greatest potential environmental impact associated with SMT assembly. Flammable and VOC solvents such as alcohol and acetone are commonly used for manual cleaning and poisonous heavy metals such as lead often come in contact with the user. This safe water-soluble detergent cleans effectively, improves print production and eliminates noxious odors and hazards associated with solvent cleaning.
Smart Sonic Corp., smartsonic.com
AT Expo booth 6027
While ultrasonic technology is effective for removing solder paste from SMT stencils, manual cleaning continues to be common. Stencil cleaning has been identified as the most hazardous process with the greatest potential environmental impact associated with SMT assembly. Flammable and VOC solvents such as alcohol and acetone are commonly used for manual cleaning and poisonous heavy metals such as lead often come in contact with the user. This safe water-soluble detergent cleans effectively, improves print production and eliminates noxious odors and hazards associated with solvent cleaning.
Smart Sonic Corp., smartsonic.com
AT Expo booth 6027
Speedline Technologies has added a chemical
isolation option to its Accel MicroCel S2 centrifugal cleaning system. This platform enhancement improves existing
zero-discharge systems and extends the life of mixed-bed deionizing
resins.
The open programming platform and interface are said to make the chemical isolation option simple to set up. The system can be configured as a complete on-board, internal closed-loop recycle system, and as such the option can reduce operating costs.
The chemical isolation option will help minimize the amount of residual chemistry carried from the process chamber to the rinse vessel. The system can then reprocess the used rinse water through the internal closed-loop recycle system without contaminating the mixed bed deionizing resins, then recharge the rinse water to its previous deionized state.
Speedline Technologies, speedlinetech.com
FEINFOCUS HDCT-FOX 2-D/3-D x-ray inspection system combines high-resolution 2-D X-Ray technology and enhanced 3-D computed tomography techniques with Feinfocus HDX-Ray technology for inspection and analysis of complex electronic devices in the third dimension. For thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects and hybrids.
Versatile, combines functionality of a standard microfocus x-ray system with the ability to generate 3-D imagery.
Utilizing HDX-Ray technology, it instantaneously captures high-resolution 2-D images and reconstructs 3-D volume models, providing insight into design and manufacturing processes. Modular hardware- and software-based CT interface accommodates a variety of imaging chains, with automatic configuration of the detector for optimal CT resolution.
Designed for integration with iView technology developed by TeraRecon, allowing instantaneous uploading of sets of 3-D images to a secure Website. This allows F/A service labs to transmit 2-D and CT imagery instantly using a high-speed internet connection. X-ray scanning process can be centralized while the image analysis is decentralized, and vice-versa.
COMET, comet.ch
Versatile, combines functionality of a standard microfocus x-ray system with the ability to generate 3-D imagery.
Utilizing HDX-Ray technology, it instantaneously captures high-resolution 2-D images and reconstructs 3-D volume models, providing insight into design and manufacturing processes. Modular hardware- and software-based CT interface accommodates a variety of imaging chains, with automatic configuration of the detector for optimal CT resolution.
Designed for integration with iView technology developed by TeraRecon, allowing instantaneous uploading of sets of 3-D images to a secure Website. This allows F/A service labs to transmit 2-D and CT imagery instantly using a high-speed internet connection. X-ray scanning process can be centralized while the image analysis is decentralized, and vice-versa.
COMET, comet.ch
UV40 UV curable conformal coating is for high-volume automotive and consumer electronics manufacturers who want the rapid cure of UV products, but require the processing ease of their current coatings. Maintains the speed of cure and environment-friendly chemistry required for electronic fabrication.
Adheres to many commonly used solder resists and offers high resistance to a range of solvents. Provides higher insulation resistance, moisture insulation resistance and a reliable moisture activated secondary cure mechanism. Provides flexibility over a range of temperatures and does not become brittle at lower ranges.
Is 100% solids and meets all ISO 14001, IPC-CC-830 and major H&S/hazardous chemical regulatory requirements.
HumiSeal, humiseal.com
Adheres to many commonly used solder resists and offers high resistance to a range of solvents. Provides higher insulation resistance, moisture insulation resistance and a reliable moisture activated secondary cure mechanism. Provides flexibility over a range of temperatures and does not become brittle at lower ranges.
Is 100% solids and meets all ISO 14001, IPC-CC-830 and major H&S/hazardous chemical regulatory requirements.
HumiSeal, humiseal.com
DEK has developed an equipment and tooling package that coats wafers with ultra-thin die attach materials down to 25 microns in thickness with tolerances of +/- 7 microns using a printing process.
Using a Micron-class Galaxy mass imaging system, an ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee, the backside wafer coating process enables ultra-thin, precise deposits of die attach adhesive at high speed with an accurate, flexible screen printing platform. Bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20-30% higher cost, UPH is higher than that of dispensing and the coated wafer can be pre-manufactured and stored until required. Ultra-flat pallet provides stability and uniformity required to process wafers as thin as 100 microns and up to 300 mm in diameter; specially engineered squeegee delicately applies the adhesive paste to the backside of the wafer.
Other advantages include the elimination of the fillet and subsequent reduction of paste adhesive volume (potentially by a factor of ten on die less than 0.5 x 0.5 mm), improved inventory control by concentrating the application of wet adhesive in the facility’s dedicated print area and streamlining the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films. Can be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings as well.
Is run on a flexible mass imaging platform, can also re-deployed for other packaging applications such as wafer bumping, DirEKt Ball Placement, thermal interface material (TIM) processing and encapsulation.
Using a Micron-class Galaxy mass imaging system, an ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee, the backside wafer coating process enables ultra-thin, precise deposits of die attach adhesive at high speed with an accurate, flexible screen printing platform. Bondline thickness can be controlled to customer specifications, fillet control is consistent with that of traditional film products without the 20-30% higher cost, UPH is higher than that of dispensing and the coated wafer can be pre-manufactured and stored until required. Ultra-flat pallet provides stability and uniformity required to process wafers as thin as 100 microns and up to 300 mm in diameter; specially engineered squeegee delicately applies the adhesive paste to the backside of the wafer.
Other advantages include the elimination of the fillet and subsequent reduction of paste adhesive volume (potentially by a factor of ten on die less than 0.5 x 0.5 mm), improved inventory control by concentrating the application of wet adhesive in the facility’s dedicated print area and streamlining the supply chain by requiring only one paste formulation for various process needs as opposed to the multiple thicknesses and widths necessary with films. Can be used for all wafer-level coating processes including epoxy and wafer-level protective backside coatings as well.
Is run on a flexible mass imaging platform, can also re-deployed for other packaging applications such as wafer bumping, DirEKt Ball Placement, thermal interface material (TIM) processing and encapsulation.
DEK, dek.com
Press Releases
- 4FRONT Solutions Invests in Seica’s PILOT V8 NEXT Flying Probe Tester to Enhance Test Capabilities at DeLand, FL Facility; Mike Sementelli Comments
- FRANK Elektronik invests in high-precision SMT line with ASYS machines; Robert Both Comments
- SASinno Americas Opens State-of-the-Art Facility in Washington, Missouri to Support North American Manufacturers; Mike Young Comments
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”