Products
Tyco Electronics’ Global Application Tooling Division (GATD) designed a customized RFID inlay assembly system for Graphic Solutions International (GSI). The equipment will assemble semiconductor chips, surface-mount devices and printed batteries onto a continuous web of printed antennas, adding RFID capability to tags and labels.
Working closely with GSI to meet their specifications, Tyco provided a reel-to-reel system that allows GSI to mount flip-chips, SMDs and printed batteries onto printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ roll of 20" wide material. After conductive printing, the roll is fed into the machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip, and a printed antenna. The speed of this machine allows for production levels up to 26 million inlays per year.
The line can accommodate printed substrates from 0.002" (50 mm) to 0.005" (125 mm) thick, mount on continuous rolls with a repeat pitch of 0.8" (20 mm) and position chips to micron accuracy.
Tyco Electronics, tycoelectronics.com
Graphic Solutions International LLC, graphicsolutionsinc.com
Working closely with GSI to meet their specifications, Tyco provided a reel-to-reel system that allows GSI to mount flip-chips, SMDs and printed batteries onto printed antennas and conductive traces. The system is capable of the high-speed mounting of electronic components on a 6,000'+ roll of 20" wide material. After conductive printing, the roll is fed into the machine where components are added along with one or two printed batteries. Upon completion, the roll can be slit into individual streams and rolled, or supplied in production web width rolls for delivery. A typical circuit is inlaid with batteries, an RFID chip, and a printed antenna. The speed of this machine allows for production levels up to 26 million inlays per year.
The line can accommodate printed substrates from 0.002" (50 mm) to 0.005" (125 mm) thick, mount on continuous rolls with a repeat pitch of 0.8" (20 mm) and position chips to micron accuracy.
Tyco Electronics, tycoelectronics.com
Graphic Solutions International LLC, graphicsolutionsinc.com
The Feinfocus Cougar-SMT with CT can image complex components in 2-D and 3-D for quality assessment and process improvement.
Featuring a Feinfocus GUI, it includes a microfocus x-ray tube up to 160 kV, HDX-Ray real-time 16-bit image processing, digital flat panel detector and accelerated CT reconstruction and visualization. Provides feature recognition down to 1 µm, with total magnification up to 10,000X and True X-Ray Intensity (TXI) Control.
Users may add features such as BGA and die-attach void calculation modules, a more sophisticated manipulator system and a multifocus x-ray tube up to 160 kV. CT functionality is an available upgrade for existing systems.
Features a small footprint (approx. 1 x 1 m), low system weight (approximately 1,450 kg) and convenient front- and side-door service access.
COMET, comet.ch
Featuring a Feinfocus GUI, it includes a microfocus x-ray tube up to 160 kV, HDX-Ray real-time 16-bit image processing, digital flat panel detector and accelerated CT reconstruction and visualization. Provides feature recognition down to 1 µm, with total magnification up to 10,000X and True X-Ray Intensity (TXI) Control.
Users may add features such as BGA and die-attach void calculation modules, a more sophisticated manipulator system and a multifocus x-ray tube up to 160 kV. CT functionality is an available upgrade for existing systems.
Features a small footprint (approx. 1 x 1 m), low system weight (approximately 1,450 kg) and convenient front- and side-door service access.
COMET, comet.ch
LF-4300 is an RoHS-compliant Pb-free solder paste with multi-process capabilities, a single product for no-clean applications that is also water washable. Compatible with Pb-free, SnPb and high-temperature alloys, the versatile and forgiving solder paste can be cleaned using standard aqueous cleaning systems without saponification.
Manufactured using a proprietary formula, including synthetic materials for good printing characteristics, lot-to-lot consistency and long stencil life. Is VOC and halide-free, and is classified as REL0. When used as a no-clean with either SnPb and Pb-free alloys, flux residue remains clear and meets S.I.R. requirements per IPC-TM-650.2.6.3.3.
Features include:
· Complies with RoHS directive 2002/95/EC for lead-free
· Suitable for high temp. alloys up to 300oC
· No mid-chip beading
· Low voiding
· 12-hour stencil life
· 24-hour abandonment time
· Pin Probable for ICT inspection
· Compatible with AOI inspection
· Works well in a vapor phase process
AMTECH, amtechsolder.com
ALPHA OM-338 PT lead-free no-clean solder paste is said to offer unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.
“Lead-free pastes have an inherent difficulty with pin test yields… [but] OM-338 PT has proven to be a very promising innovation,” said Mitch Holtzer, global product manager. “Alpha OM-338 PT is targeted to both EMS and OEM customers using in-line circuit testing. It was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield.”
In addition to excellent pintestability with virtually no residue on pins, it offers high print speeds (up to 150 mm/sec., on 12 mil squares and 10 mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding excellent joint appearance, and low voiding and anti-slumping characteristics.
Cookson Electronics, newalphaproducts.com
“Lead-free pastes have an inherent difficulty with pin test yields… [but] OM-338 PT has proven to be a very promising innovation,” said Mitch Holtzer, global product manager. “Alpha OM-338 PT is targeted to both EMS and OEM customers using in-line circuit testing. It was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield.”
In addition to excellent pintestability with virtually no residue on pins, it offers high print speeds (up to 150 mm/sec., on 12 mil squares and 10 mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding excellent joint appearance, and low voiding and anti-slumping characteristics.
Cookson Electronics, newalphaproducts.com
BP Microsystems will highlight the Helix, the latest addition to its automated device programmer family, at the upcoming SMT/Hybrid/Packaging exhibition in Nuremberg, Germany. Also on display: ISP-PRO socket module and manual programming systems.
The Helix desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two 7th Generation programming sites with FX socket module capability. This allows for programming up to four devices simultaneously per site. Can handle MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
ISP-PRO socket module was designed to provide in-circuit programming solutions. Manual programmers can be connected to the board via a cable interface using the socket module.
The latest manual device programmers feature high-speed USB 2.0 standard bus for improved communication speed.
BP Microsystems, bpmicro.com
SMT/Hybrid/Packaging Hall 9, Stand 9-532
The Helix desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two 7th Generation programming sites with FX socket module capability. This allows for programming up to four devices simultaneously per site. Can handle MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
ISP-PRO socket module was designed to provide in-circuit programming solutions. Manual programmers can be connected to the board via a cable interface using the socket module.
The latest manual device programmers feature high-speed USB 2.0 standard bus for improved communication speed.
BP Microsystems, bpmicro.com
SMT/Hybrid/Packaging Hall 9, Stand 9-532
ESSEMTEC will display the HLX Series, a high-performance placement system series for flexible SMT manufacturing at SMT/Hybrid/Packaging on May 30 to June 1.
The series features production speeds up to 22,000 cph and a large feeder capacity (192 tape and stick feeders). 16 JEDEC trays can be used without loss of any feeder space. The series is comprised of the HLX8100 and HLX8200. Can be changed over during operation-- without standstill. On-the-fly setup modification ensures maximum machine load even with small productions series. Linear drives are maintenance-free, fast and precise. They position the placement heads precisely in the x- and y-axes. During placement, the board is fixed.
“Collect & Place” method enables high-placement performance. HLX8100 comes with one placement head with four vacuum nozzles and HLX8200 has two placement heads with a total of eight nozzles working in parallel. Cognex Vision (SMD4) enables precise, fast alignment, and checking of components. With transparent lighting, illumination is independent of component type and image analysis is reliable.
All feeders are exchangeable and refillable during operation. The systems are optimized immediately after every feeder change.
Are laid out for rugged, long-term operation at three-shift workdays. The chassis and wear-resistant linear drives allow for high acceleration of placement heads. The gantry system permits the simultaneous operation of two placement heads in parallel. While one head retrieves four components, the other uses this time slot for placement.
ESSEMTEC, essemtec.com
SMT/Hybrid/Packaging Hall 7, Stand 203
The series features production speeds up to 22,000 cph and a large feeder capacity (192 tape and stick feeders). 16 JEDEC trays can be used without loss of any feeder space. The series is comprised of the HLX8100 and HLX8200. Can be changed over during operation-- without standstill. On-the-fly setup modification ensures maximum machine load even with small productions series. Linear drives are maintenance-free, fast and precise. They position the placement heads precisely in the x- and y-axes. During placement, the board is fixed.
“Collect & Place” method enables high-placement performance. HLX8100 comes with one placement head with four vacuum nozzles and HLX8200 has two placement heads with a total of eight nozzles working in parallel. Cognex Vision (SMD4) enables precise, fast alignment, and checking of components. With transparent lighting, illumination is independent of component type and image analysis is reliable.
All feeders are exchangeable and refillable during operation. The systems are optimized immediately after every feeder change.
Are laid out for rugged, long-term operation at three-shift workdays. The chassis and wear-resistant linear drives allow for high acceleration of placement heads. The gantry system permits the simultaneous operation of two placement heads in parallel. While one head retrieves four components, the other uses this time slot for placement.
ESSEMTEC, essemtec.com
SMT/Hybrid/Packaging Hall 7, Stand 203
Press Releases
- Kubler US Corp. Expands to Texas and Surrounding States with FHP Reps
- Indium Corporation Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
- Altus Adds PVA's Game Changing PathMaster X Software to Portfolio
- TRI Opens New Manufacturing Facility