caLogo

LYON, France - July 3, 2025 | Yole Group today announces the release of its annual Status of the Advanced IC Substrates Industry report, a comprehensive market and technology analysis covering organic IC substrates, glass core substrates, substrate-like PCBs, and Embedded Die technologies.

After a challenging 2023, the IC substrate ecosystem is showing promising signs of recovery. According to Yole Group’s latest projections, the combined market for advanced substrate technologies is expected to reach $31 billion by 2030, driven by AI and HPC, as well as broader penetration into consumer, automotive, and defense segments….

Bilal Hachemi, PhD, Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group, comments: “This growth reflects sustained demand for larger, complex, high-ASP substrates capable of supporting generative AI, data center, and advanced package requirements, including finer interconnects, higher yield, and controlled lead times.”

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account