Products
FLX2010-LCV flexible pick-and-place system features a large board size and feeder capacity with a small footprint.
Offers changeover without downtime. Has intelligent feeders, large feeder capacity (310) and offline programming and job planning. Starts at 5,000 CPH, with 150 feeders inline and can be expanded to 15,000 CPH with over 470 feeders.
MIS software offers production planning, inventory control, quality control through bar code verification and traceability of lots. Requires only 110 V of power.
User-friendly Windows programming with complete graphical interface shows operators or engineers images of the library, feeders, PCB and the overall machine. All corrections can be done on the fly, saved and continued on the same PCB. All parts are accessible for replacement, cleaning and calibrations. All parts to the bare frame can be exchanged in the field.
Is equipped with a combination of different alignment systems ¾laser and vision. Vision systems can be upgraded at the customer site if production requirements change.
Essemtec, essemtec.com
Nepcon East booth 2031
Offers changeover without downtime. Has intelligent feeders, large feeder capacity (310) and offline programming and job planning. Starts at 5,000 CPH, with 150 feeders inline and can be expanded to 15,000 CPH with over 470 feeders.
MIS software offers production planning, inventory control, quality control through bar code verification and traceability of lots. Requires only 110 V of power.
User-friendly Windows programming with complete graphical interface shows operators or engineers images of the library, feeders, PCB and the overall machine. All corrections can be done on the fly, saved and continued on the same PCB. All parts are accessible for replacement, cleaning and calibrations. All parts to the bare frame can be exchanged in the field.
Is equipped with a combination of different alignment systems ¾laser and vision. Vision systems can be upgraded at the customer site if production requirements change.
Essemtec, essemtec.com
Nepcon East booth 2031
Fineplacer CRS 10 compact rework system is designed for customers needing a fixed configuration. Said to have quick set up and easy operation. Most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large SMD boards. Applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components (such as 0201, 0402, 0603 and connectors), RF-shields, shielding frame, flip-chip rework as well as customized applications.
Features a Plug-and-Work design, Vision Alignment System with stationary beam splitter, controlled z-height during reflow, proven soldering head technology, Pb-free compatible rework and an automated component place and lift-off function. Also equipped with a Controlled Mixed Soldering System (COMISS) reflow module for top heating and full-area bottom heating.
High accuracy (better than 10 µm placement accuracy) allows use with components with pitches down to 100 µm. Large field of view can align large components, e.g. super BGAs with side lengths of up to 45 mm, without additional optics.
Finetech, finetechusa.com
Features a Plug-and-Work design, Vision Alignment System with stationary beam splitter, controlled z-height during reflow, proven soldering head technology, Pb-free compatible rework and an automated component place and lift-off function. Also equipped with a Controlled Mixed Soldering System (COMISS) reflow module for top heating and full-area bottom heating.
High accuracy (better than 10 µm placement accuracy) allows use with components with pitches down to 100 µm. Large field of view can align large components, e.g. super BGAs with side lengths of up to 45 mm, without additional optics.
Finetech, finetechusa.com
Nepcon East booth 2001
A-Tek has added the Drytech range of controlled humidity storage systems for electronics packages and sensitive devices. Drytech manufactures systems for all components and sensitive devices storage demands. A large range of standard products are available, customization is available. Meet IPC/JEDEC Standard J-STD-033A. Sizes vary from 100 to 1700 L in capacity.
During packing, shipping and storage, parts are often exposed to many fluctuations in temperature and humidity; an ideal environment for the hygroscopic nature of plastic encapsulants to take effect, and moisture to be absorbed into the device. Moisture will directly impact product quality, final product reliability, customer satisfaction and manufacturing costs. The smallest amount of moisture, when subject to elevated temperatures, creates vapor pressure that can induce stress cracks and fractures in devices. These may show as failures in test or in a worse case, as field failures. Storing sensitive devices in an environment of less than 5% relative humidity will protect the parts and assist in stabilizing the devices prior to manufacture.
A-Tek, atekllc.com
During packing, shipping and storage, parts are often exposed to many fluctuations in temperature and humidity; an ideal environment for the hygroscopic nature of plastic encapsulants to take effect, and moisture to be absorbed into the device. Moisture will directly impact product quality, final product reliability, customer satisfaction and manufacturing costs. The smallest amount of moisture, when subject to elevated temperatures, creates vapor pressure that can induce stress cracks and fractures in devices. These may show as failures in test or in a worse case, as field failures. Storing sensitive devices in an environment of less than 5% relative humidity will protect the parts and assist in stabilizing the devices prior to manufacture.
A-Tek, atekllc.com
SEFAR PCF is a pre-coated mesh engineered for the stencil parameters and frame sizes of the CD/DVD market segment. Said to provide consistent coating tolerances, stencil durability, wide exposure window and optimal emulsion thickness (EOM) to surface roughness (Rz) combination.
Sefar is now launching a fully-coated version, “SEFAR PCF FC” (Pre-Coated Fabric, Fully-Coated). The addition allows additional screen printing market segments access to the benefits of the stencil system. In addition to improving print quality, it also offers process improvement by removing degreasing, coating, block-out and multiple drying steps that are required to prepare a screen.
By providing a fully-coated mesh, customers with virtually any size frame can use it: bottle and container manufacturers, pen printers, tube manufacturers, ad specialty companies, membrane switch or industrial product printers, and any small format graphics printer concerned with image quality. Currently available in fine mesh specifications (ie. 305 threads/in. and higher). The coated fabric can be purchased as a roll to stretch in-house, or as a stretched screen from a screen fabrication location.
Sefar Printing Solutions, sefar.us
Sefar is now launching a fully-coated version, “SEFAR PCF FC” (Pre-Coated Fabric, Fully-Coated). The addition allows additional screen printing market segments access to the benefits of the stencil system. In addition to improving print quality, it also offers process improvement by removing degreasing, coating, block-out and multiple drying steps that are required to prepare a screen.
By providing a fully-coated mesh, customers with virtually any size frame can use it: bottle and container manufacturers, pen printers, tube manufacturers, ad specialty companies, membrane switch or industrial product printers, and any small format graphics printer concerned with image quality. Currently available in fine mesh specifications (ie. 305 threads/in. and higher). The coated fabric can be purchased as a roll to stretch in-house, or as a stretched screen from a screen fabrication location.
Sefar Printing Solutions, sefar.us
Aqueous Technologies will exhibit StencilWasher-ECO semi-automatic stencil cleaner for solder paste removal at the upcoming Nepcon East exhibition and conference on May 10-11 in Boston.
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils.
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils.
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
JPSA has begun shipping IX-1100 C2C UV 193nm excimer laser wafer processing systems equipped with cassette to cassette automated wafer loading/unloading systems and JPSA advanced factory automation software. These systems can process more than 80 wafers per hour, and are suited for a variety of materials such as: GaAs, silicon and sapphire.
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC.
Available with optional SQL database connectivity. Typical applications include tracking of process data by part number.
JPSA, www.jpsalaser.com
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
IX-1100 is an industrial excimer workstation, a compact integrated UV processing system with a built-in high- power excimer laser. Features automated mask control, step and scan and high-resolution imaging and workpiece viewing using the Chromacel line. Optional modules include beam attenuators and homogenizers and dielectric laser masks.
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC.
Available with optional SQL database connectivity. Typical applications include tracking of process data by part number.
JPSA, www.jpsalaser.com
Press Releases
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