LANDSHUT, GERMANY – Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General Manager. With a career spanning over three decades in business management and sales leadership, Wagner brings not just a wealth of experience, but also a proven track record of transformative leadership that is set to drive positive change at Indium Corporation Advanced Materials GmbH.

Wagner's career is distinguished by his roles in significant international markets, including strategic management positions at DuPont, where he demonstrated formidable skills in turning around operations and significantly enhancing profitability and market position. His background is marked by extensive work in both the automotive and industrial B2B sectors, where he has been instrumental in driving innovation and operational excellence.

In his new role at Indium Corporation Advanced Materials GmbH, Wagner is expected to leverage his deep expertise in sales management, business development, and turnaround management to spearhead growth and enhance the company's presence in the market. His appointment is poised to fortify Indium’s commitment to leading-edge technology and sustainable industry practices.

"We are excited to welcome Werner Wagner to our team," said Brian Craig, Managing Director of Indium’s Operations in Europe, the Middle East, and Africa. "His appointment comes at a crucial time as we look to redefine our market position and drive forward our strategic goals. Werner's leadership is expected to bring vital energy and direction to our efforts, particularly in enhancing the Solder Chemistry brand within our portfolio. We are confident that his leadership will be invaluable as we continue to innovate and meet the evolving needs of our customers worldwide."

Wagner’s appointment also brings with it a global perspective, honed through extensive work in international settings such as the USA and Mexico. His approach to business is characterized by a strategic focus on customer retention, market expansion, and embracing future-oriented technologies.

Moreover, Wagner is an author with three books to his credit: "Social Selling," "The B2B Sales Dive," and "Yes, Salespeople Do Have Rights." These works reflect his deep understanding and innovative approaches to sales and business strategy, further establishing him as a thought leader in the field.

Wagner holds a degree in chemical engineering from Universidad Nacional Autónoma de México, supplemented by advanced training in sales management, finance, and machine learning from top institutions, including Stanford University and St. Gallen Management & Business School.

He has also contributed to academia as a university lecturer in sales and sales management.

POOLE, UK – Europlacer, a leading provider of SMT assembly solutions, is pleased to announce the appointment of Richard Timms as the new International Channel Manager. In this role, Timms will oversee sales operations in the UK, manage distributors worldwide, and drive growth in Germany and the APAC region.

Timms joins the Europlacer family with more than three decades of expertise in the SMT industry. His respected career spans pivotal roles at leading companies where he led the UK business including senior management positions in sales and marketing, with a strong international B2B focus in electronics and electronics assembly.

Timms began his career as an electronics engineer, gaining comprehensive experience across all facets of electronics assembly. He has consistently demonstrated an ability to adapt and capitalize on major industry innovations, with a focus on business growth, change management, and Customer Relationship Management (CRM) efficiency.

Holding an MBA from Henley Business School, with a specialization in strategic and applied marketing, Timms has a proven track record of formulating and executing effective business strategies. His expertise extends to implementing CRM systems and managing wide-ranging change management projects. Although primarily based in the UK, Timms has also worked extensively in the Netherlands and Munich, Germany, where he held several key roles with global impact.

Reflecting on his new role, Richard Timms stated, “I am excited to join Europlacer and contribute to the company’s continued success. Europlacer’s commitment to customer satisfaction aligns perfectly with my own professional values. I look forward to working with the team to enhance our sales strategies and deliver exceptional value to our customers worldwide.”

For more information about Europlacer, visit www.europlacer.com 

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the promotion of Chris Matthews to the role of Business Development Manager for the Americas. This strategic move aligns with AIM’s ongoing efforts to expand its business development team and enhance its market presence.

Chris Matthews has been an integral part of AIM Solder since joining the Customer Service team in 2010. Most recently, Matthews served as the Northeast Regional Manager, where he provided outstanding support to AIM’s extensive customer base in the northeast region of the United States. His ability to foster strong relationships and deliver superior customer service has been a key factor in AIM's growth and customer satisfaction.

“Chris’s journey with AIM has been marked by impressive achievements and unwavering commitment to our customers,” said Andy Dolan, AIM’s Vice President of Sales. “As he steps into the role of Business Development Manager, we are confident that his leadership and strategic vision will drive further success for our company.”

In his new position, Matthews will be responsible for driving business growth and development across the Americas, leveraging AIM’s superior products and unmatched technical support. His promotion is part of AIM’s broader strategy to expand its business development capabilities and enhance its service and support offerings to meet the evolving needs of the electronics industry.

AIM Solder remains committed to delivering innovative and reliable product solutions backed by exceptional customer service. The promotion of Chris Matthews underscores AIM’s dedication to nurturing talent within the organization and maintaining its position as a market leader.

Chris Matthews can be reached at: cmatthews@aimsolder.com 

MILTON, NY – Sono-Tek Corporation (Nasdaq: SOTK), a leading manufacturer of precision ultrasonic coating solutions, is excited to announce its participation in SEMICON West 2024, taking place July 9-11 in San Francisco, CA. Visit the company at booth 6186 to explore advanced ultrasonic coating solutions designed for precision and efficiency in semiconductor manufacturing.

Highlighted Products and Innovations:

SPT200 Photoresist Coating Machine: The SPT200 is designed to provide uniform photoresist coverage on deep well topographies, ensuring optimal performance for MEMs and other intricate applications. Capable of handling 100, 150, 200, and 300mm wafers, this machine leverages ultrasonic technology to form highly controlled droplets, delivering superior coating uniformity.

Wafer Handling System: Sono-Tek’s new Wafer Handling System is tailored for higher automation and throughput, accommodating 4-8” wafers with automated wafer loading. This system enhances efficiency and precision in semiconductor manufacturing processes.

Flexicoat System for EMI Shielding: The Flexicoat system, equipped with ultrasonic coating technology, is ideal for EMI (electromagnetic interference) shielding at the packaging level. This system replaces the costly sputtering process, uniformly applying coatings over various structures while maintaining a clog-free environment through our ultrasonic nozzle.

Additional Coating Applications:

• Polyimide Coatings and Protective Films for Dicing: Sono-Tek’s ultrasonic technology ensures uniform application of polyimide coatings and protective films, essential for semiconductor manufacturing.
• Flux Dispensing for Flip Chip Applications: Sono-Tek’s precise flux dispensing solutions enhance the reliability and performance of flip chip assemblies.
• Thin Film Solar and Display Applications: Sono-Tek provides advanced coating solutions for thin film solar cells and display technologies, including TCO layers, nano suspensions (CNT, graphene, nano-wires), OPV polymers, AR, and Perovskite layers.

Visit Sono-Tek at booth 6186 to learn more about the company’s cutting-edge ultrasonic spray coating solutions and how they can enhance your semiconductor manufacturing processes. For further details, visit www.sono-tek.com/industry/semiconductor/mems-semiconductor/ 

Sono-Tek Corporation is a leading provider of precision ultrasonic coating solutions for a wide range of industrial applications. The company’s advanced technology helps customers increase efficiency, reduce costs and improve product quality.

For more information about Sono-Tek Corporation and its products, please visit www.sono- tek.com