Press Releases
WALTHAM, MA – Essemtec is exhibiting at SMTconnect booth 4.209.
We invite you to SMTconnect, Booth 4.209, from June 11 - 13 in Nuremberg, Germany. Discover Essemtec's solutions with all-in-one combined dispensing & pick-and-place processes and integrated inspection systems.
We are presenting the latest product advancements and SMTconnect premieres:
- Tarantula Underfill
- Fully Integrated PCB Inspection
- BGA Dispensing and Reballing
Tarantula Underfill is our latest addition to our machine lineup. Our new solution will meet your underfill process needs while also performing all other traditional dispensing operations in the same machine, thanks to the 5 different valve options from Essemtec. These valves cater to a wide range of dispensing applications such as Solder Paste, SMT Glue, LED Encapsulation, Silver Epoxy, and Dam, among others.
Furthermore, we will showcase our flagship equipment Puma All-in-One with multiple functionalities:
- High-Speed Solder Paste Jetting Solution with our Jet-on-the-fly
- Integrated Inspection System for PCB inspection
- EVO feeder 4mm, 08004 Pick-and-Place
The All-in-One platform with dispensing and pick-and-place functionalities will demonstrate live the highest standards in electronics assembly on flexible substrates, jetting multiple fluids three times faster, and efficient rework on populated boards.
On our production line, we will demonstrate the reballing and flux dispensing with pick-and- place in one go, as well as our line change preparation using our Smart Manufacturing Solution.
Under the motto “Our Focus - Your Solution,” we also focus on proven solutions in various segments for electronics production, such as NPI, High-mix / Low-Volume, High-speed Dispensing, Printed Electronics, and Complex repair.
More information on our latest solutions:
Integrated Inspection System – for all product platforms
For the first time in the industry, an Integrated Inspection System (I2S) in the Pick-and-Place and dispensing solutions will be shown. The Integrated Inspection System is available for dispensed and jetted material as well as placed SMD components right after the process.
Thus, only good, inspected products are entering the reflow ovens. The process also includes an automated repair function. The system is already integrated in production sites by various companies.
Smart Material Management - integrated solution for factory 4.0
The affordable material management solution is a fully integrated end-to-end solution for electronics manufacturing factories and covers all different storage locations. The solution enables right material placement at the right time. The traceability is precise down to individual components. The solution is expandable and flexibly controlled by an intuitive eStorage software, from simple barcode-labelled storage locations to fully automated storage cabinets. The solution offers high ROI and is fully integrated with the production machine and the ERP systems.
Our team of engineers will share the best tips on SMT topics to help you increase the flexibility of your production line and optimize your manufacturing costs. Visit us in Hall 4 at booth 209 and be inspired by our solutions!
HANOVER, GERMANY – Viscom AG is excited to announce its participation in PCIM Europe 2024, the leading international exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management. From June 11th to 13th, visitors are welcome at Booth 6-437 to explore Viscom’s latest innovations in inspection tailored for power electronics.
Viscom is particularly proud to introduce its brand-new AOI inspection system, the iS6059 Wire Bond Inspection. This cutting-edge system is a reliable partner for precise inspection, ensuring the highest quality in wire bond verification. The iS6059 Wire Bond Inspection offers unparalleled accuracy and efficiency, making it an essential tool for any production line demanding stringent quality control.
In addition to the iS6059, visitors can experience Viscom’s iX7059 Heavy Duty Inspection live on-site. This advanced X-ray system, which Viscom has developed for particularly heavy and large inspection objects weighing up to 40 kg, sets new standards in fast and highly precise inline X-ray inspections. The iX7059 Heavy Duty Inspection is engineered to handle the most challenging inspection tasks with versatile transportation options, providing superior accuracy and speed to maintain the highest quality in production processes.
“Our participation in PCIM Europe 2024 underscores our commitment to providing innovative inspection solutions for the power electronics industry,” said Torsten Pelzer, VP Sales of Viscom AG. “The iS6059 Wire Bond Inspection system and the iX7059 Heavy Duty X-ray system represent the forefront of inspection technology, offering our customers the precision and reliability they need.”
Viscom’s presence at PCIM Europe 2024 is an excellent opportunity for industry professionals to see firsthand how state-of-the-art inspection solutions can enhance their production quality and efficiency. A team of Viscom experts will be available to provide live demonstrations and discuss how the products on show can meet very specific inspection needs.
PCIM visitors therefore should not miss this special opportunity to experience the future of inspection technologies. Viscom looks forward to welcoming all interested parties at Booth 6-437!
MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is proud to announce the participation of Andres Turrubiates, LATAM Application Engineer, in the upcoming SMTA Queretaro Expo & Tech Forum. This event, a significant gathering for electronics manufacturing professionals, will occur on June 6th, with the round table discussion scheduled for 4 PM.
The focus of the discussion will be on "Cleaning Optimization," a critical topic for enhancing the reliability and performance of electronic assemblies. Mr. Turrubiates will bring his extensive expertise in precision cleaning processes, sharing insights on best practices, innovative solutions, and the latest advancements in cleaning technologies. His contribution is expected to provide valuable guidance on optimizing cleaning procedures to meet the stringent demands of modern electronic manufacturing.
Join us at the SMTA Queretaro Expo & Tech Forum to learn in-depth from industry leaders and explore cutting-edge developments in electronic cleaning optimization. Register for the expo HERE.
CAMBRIDGE, UK – With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly useful for human-machine interfaces (HMIs).
In-mold electronics
Streamlined automotive interiors are a large market for 3D electronics, where the technology can incorporate electronic functions into new form factors with aesthetic appeal and modern design features. There are many possibilities for 3D electronics on a number of surface materials. The IDTechEx report, “3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets”, explores these further, alongside market predictions for the future of the technology.
Touch-sensitive interfaces are an example of a component that could use in-mold electronics (IME), using screen printing with conductive inks and adhesives. IME can make components completely functional and built-in with no excess materials and are most suited to HMIs in automotive interiors.
Higher outputs with lower production costs are a benefit of IME technology and are cheaper to install than touch screens. There are lots of surface opportunities for 3D electronics within automotive displays and dashboards, where buttons might otherwise look bulky and not conform to the desired aesthetic. IME can also be suitable for mass production, with its use of simple and trusted technology and very few process restrictions.
Partially additive electronics
Partially additive electronics, or applying electronics to a surface, include methods like laser direct structuring (LDS), aerosol, or inkjet printing. The technology uses conductive inks or LDS-compatible thermoplastics to create electronic capabilities over 3D structures, adding a circuit to a surface rather than integrating it, and also removing the need for a PCB. LDS is currently the most popular, allowing electronics to be incorporated into a number of surfaces quite easily, and it is commercially used in the automotive industry. Other methods of additive electronics are still in the prototyping stages.
Film-insert molding and capacitive switches with foils are other new alternative manufacturing technologies for automotive interiors and have already been launched into the market. They could work alongside IME and LDS technologies to produce modern, high-tech hardware.
3D printed electronics
3D printed electronics or fully additive electronics are known for being hard-wearing and can provide reliable quality with electronics embedded within products. The technology allows for mass customization and minor changes to be made and can create the most complex of designs, including medical devices such as prosthetics and hearing aids.
Rapid prototyping is also possible with fully additive electronics, using materials from conductive inks to thermoplastics. It could also be used to make spare parts, highlighting versatility in a number of sectors. However, this method is still in the semi-commercial prototyping stage for the automotive industry, just behind in-mold and 3D additive electronics, so it could soon make progress to be a top contender for HMI opportunities, especially with its possibilities of prototyping and spare part manufacturing.
The report highlights that the sales of 3D electronics are increasing rapidly and that overall, IME technology appears to be better for human-machine interfaces than additive electronics. IDTechEx does identify some challenges for this technology within the report, which include the speed at which 3D electronics can be produced, product reliability, and acceptability within the market as various sectors and consumers adjust to this new technology.
Drivers for 3D electronics include reduced shipping volume, cost, and material consumption. In a market as large as the automotive industry, these new technologies will be hugely beneficial for new vehicle designs. With reduced materials, new components could promise to be simpler to assemble and, therefore, simpler to fix or replace.
To find out more, please see the IDTechEx report, “3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets”, by visiting www.IDTechEx.com/3DElec. Downloadable sample pages are available.
DENVER – Governments around the world are pursuing a growing number of co-investment programs with the microelectronics packaging and semiconductor industries, in order to build and expand infrastructure in their own jurisdictions. In a special session at the 2024 IEEE Electronic Components and Technology Conference (ECTC), representatives from Canada, the European Union, India, Korea and the U.S. described the differing goals, frameworks, challenges and achievements of their efforts to increase advanced packaging technology and infrastructure development.
Interest in advanced packaging is surging, because without new packaging approaches it is unlikely the electronics industry will be able to achieve the performance gains and energy savings needed to support fast-growing, demanding applications like artificial intelligence (AI), high-performance computing, wireless and high-speed communications, and quantum computing.
The annual ECTC conference is the world’s leading forum for advancements in microelectronics packaging and component science and technology. The growing momentum for advanced packaging solutions can be seen in the attendance figures for the 74th annual ECTC, held here from May 28-31. Registered attendance at ECTC 2024 hit an all-time high of more than 2,000, up from 1616 in 2023, and higher than the previous record of 1,738 in 2018.
“Governments are striving to find ways to build their own semiconductor ecosystems in order to gain access to leading-edge technologies, to secure their supply chains, and to open up educational and employment opportunities for their populations,” said Przemyslaw Gromala, co-Chair of the ECTC special session, Exploring the Impact of Industry-Government Co-Investments for the Advanced Electronics Sector in North America, Asia and Europe, along with fellow co-Chair Erik Jung.
“The introduction of the CHIPS and Science Act in the United States has been inspiring similar programs elsewhere. The speakers in our lively special session detailed their programs and co-investments, and also discussed the prospects of global collaborations and partnerships between national semiconductor and microelectronic packaging centers and industry leaders. They also outlined mechanisms for knowledge exchange, joint research initiatives, and mutually beneficial outcomes,” he said.
Highlights from the panelists:
Canada
CMC Microsystems is a non-profit founded in 1984 as a Canada-wide collaboration between 69 universities/colleges. It connects 10,000 academic participants with 1,200 companies to design, build and test advanced prototypes. At ECTC, David Lynch, CMC’s Vice President of Technology, discussed FABrIC, a proposed 5-year $200M-plus project to be led by CMC and 14 other founding organizations to accelerate the development of made-in-Canada microchip manufacturing processes, Internet of Things (IoT)-based products and services, and quantum technologies.
FABrIC would build on Canada’s strengths in compound semiconductors, micromechanical systems (MEMS), photonics and superconductors. It would work with subject matter experts in these technologies to commercialize products, and would create and share IP resources to help build a national semiconductor ecosystem, including relevant packaging approaches.
Europe
The European Chips Act, passed in July, 2023 and funded by the European Union, member states and the private sector, has enabled significant investments in first-of-a-kind fabs in Europe, but it hasn’t focused specifically on packaging. At ECTC 2024, Elisabeth Steimetz, Office Director of the European Association on Smart Systems Integration, known as EPoSS, gave an outline of the major activities taking place and under consideration in Europe. One is the evolving Pack4EU initiative, whose objective is to create a pan-European network for advanced packaging, and a roadmap to boost packaging in Europe.
EPoSS is an international non-profit organized under German law that leads the development and integration of intelligent and green smart-systems technologies and solutions for a sustainable society. It comprises major industrial companies and research organizations from more than 20 European Member States, with the goal of developing a vision and setting up a strategic research agenda to coordinate their activities in these areas.
India
At ECTC 2024, Rao Tummala, Advisor to the Government of India, described the semiconductor industry landscape in India and the tremendous potential for industry development there, in the context of the large size and growth of India’s economy; the many partnership opportunities among academia, industry and government; India’s skilled, highly educated and large technical workforce; the potential for collaboration with academic experts globally, who are from India and elsewhere; and the India Semiconductor Mission (ISM) a government-led strategic initiative to bolster India’s semiconductor ecosystem.
He said the strategic R&D focus in India is to develop integrated semiconductors and systems packaging to serve large, fast-growing markets.
Korea
Korea’s Chips Act, passed in March, 2023, provides significant tax breaks and deductions for investments in Korea’s semiconductor industry. Kwang-Seong Choi, from Korea’s Electronics and Telecommunications Research Institute, described a packaging initiative that will concentrate on technology segments where South Korean companies have demonstrated prowess, such as 2.5D package-based high-bandwidth memory (HBM) optimization, 10-40 µm bonding, and hybrid bonding.
United States
In the U.S., the CHIPS for America Act which passed in 2022 authorized $39 billion to attract large-scale investments in facilities, equipment and manufacturing capacity for advanced technologies such as leading-edge logic and memory, and for advanced packaging as well. It also authorized $11 billion in R&D programs that would, among other things, lead to more advanced semiconductor assembly, packaging and test capabilities.
Among these are the National Advanced Packaging Manufacturing Program, to develop innovations that will help realize the ambitious goals for U.S. technology leadership in advanced packaging for the American semiconductor industry.
At ECTC 2024, Eric Lin, R&D Director in the CHIPS for America Research and Development Program, described these programs in the context of the international landscape for advanced packaging. He outlined U.S. R&D goals and detailed the tremendous engagement the U.S. has with international partners in Asia, Europe and the Americas to help advanced its strategic goals.
Looking Forward
Przemyslaw Gromala, co-Chair of the ECTC special session, said, “The worldwide semiconductor and packaging landscape is complex and dynamic. Our attendees had a unique opportunity to hear the differing perspectives of existing and up-and-coming participants in the worldwide advanced packaging industry, what their goals are, and the different ways in which they plan to meet them.”
Further information about ECTC 2024
Please visit https://www.ectc.net/index.cfm
TORONTO – Bittele Electronics Inc., a Toronto-based PCB manufacturer specializing in prototype and low-to-mid volume printed circuit board assembly, announced that it has completed the expansion and improvements of its Markham, Ontario, PCB manufacturing facility.
These improvements have improved lead times, inventory management and production capacity, while maintaining a commitment to quality and responsiveness.
“The improvements we’ve made to our Markham facility have achieved better inventory accuracy, expanded our storage capacity, and increased our production capacity with the new Soltec wave soldering machine we’ve installed,” said Ben Yang, CEO of Bittele Electronics. “These improvements demonstrate Bittele’s commitment to offering high quality services that guarantee customer satisfaction."
The improvements of the Markham PCB facility can benefit a customer in three important ways:
• Inventory Accuracy: We can now store consigned parts for ongoing and upcoming orders. Upon request, we can also purchase and stock critical items in a customer’s Bill of Materials (BoM).
• Storage Capacity: By expanding the Markham facility, we are positioned to serve a customer’s needs in a prompt and accurate manner.
• Production Capacity: We have invested in a new Soltec wave soldering machine for larger-volume, through-hole assembly orders. This means we can meet a customer’s delivery deadlines more effectively.
In addition to the improvements of Bittele’s Markham facility, it has improved its online ordering process as well. By utilizing Bittele’s state-of-the-art online ordering engine, a customer can place a turnkey PCB fabrication and assembly order in less than 20 minutes while also obtaining exclusive discounts.
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