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Press Releases

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Wisconsin Expo taking place on May 16th at the Crowne Plaza Milwaukee Airport in Milwaukee, Wisconsin. AIM will highlight their newest halogen-free no clean solder paste, H10.

H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.

H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.

To discover all of AIM’s products and services, visit the company at the SMTA Wisconsin Expo on May 16th for more information and to speak with one of AIM’s knowledgeable staff members, or visit www.aimsolder.com

MUNICH – ASMPT SMT Solutions has named Josef Ernst as its new CEO, succeeding Guenter Lauber, who will now focus more on his duties as the Chief Strategy and Digitalization Officer for the entire ASMPT Ltd. Group.

With Josef Ernst, an excellent leader and a proven SMT expert will be taking the helm. Together with CFO Mike M. Moehlheinrich Möhlheinrich, the new COO Dr. Martin Kruessmann and the proven core team, he will lead the SMT segment in the future.

"It has been a great pleasure and honor to be allowed to lead the SMT Solutions segment for so many years, and I thank the entire team of ASMPT SMT Solutions for their commitment and support," said Lauber. "We had to overcome some difficult obstacles together, but in the end we were very successful as a team. My thanks also go to our customers, suppliers and partners in the electronics manufacturing industry for their trust, cooperation and collaboration, which has made us successful – all together.

"Even though I will surely miss the operational collaboration with all of you, I am glad that I will be able to support the entire ASMPT group and I am looking very much forward to strengthen our strategic collaboration," he said.

HANOVER, GERMANY – At this year's Control, the many advantages of Viscom AG's X-ray inspection technologies are combined into a central theme. Visitors to booth 9314 in hall 9 of this international trade fair in Germany will learn more about the versatile uses of microfocus X-ray tubes as well as quality assurance for battery cells and final assembled products.

The right technology and related equipment are needed if demanding testing and digitalization functions are to be reliable, efficient and non- destructive. In this regard, X-rays are the perfect choice for comprehensive quality assurance in many manufacturing processes. At the same time as showcasing its high-end optical inspection systems as well as ultra-modern X-ray solutions for electronic assemblies at SMTconnect and PCIM in Nuremberg, Viscom is also featuring its X-ray technologies for a wide spectrum of further areas of application at Control 2023 from May 9 to 12 in Stuttgart.

One innovative component about which detailed information can be obtained is, for example, the XT9320 D open microfocus X-ray tube from Viscom. With its high acceleration voltage of up to 320 kV, it can easily penetrate mechanical parts made of particularly dense materials. Its large target power of up to 640 W makes rapid inspection possible even if complex CT with very many single exposures is needed. The tube is ideally suited for use in computer tomography systems designed for the quality control of industrial products. Flexible use with smaller outputs for delicate inspection objects is also possible. Viscom offers both direct beam as well as transmission and rod anode tubes for different tasks.

Specialists from Exacom GmbH are presenting details of the special features of automated X-ray inspection of battery cells at the Control trade fair. The subsidiary of Viscom has developed many innovative solutions for this increasingly important product range. At the Viscom booth, the special requirements for an X-ray inspection after final assembly will also be addressed in detail. In this context, the company's iX7059 inspection systems can be integrated into production lines or alternatively used as an island concept. Foreign objects that may lead to short circuits or missing components that later affect proper functionality are reliably detected. High- performance handling enables a high throughput – with workpiece carriers and precise fit.

TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials, and engineering services, introduces a page-flip Sawa Cleaner Catalog that includes the latest products. To view the catalog, visit http://books.seikausa.com/books/jcca/#p=1 

From portable, manual stencil cleaners to fully automatic systems like the Sawa Ecobrid cleaner that can clean and dry in just six minutes, there is a solution for any cleaning application including removal of particulates from nozzles, squeegees, pallets, misprints and other parts.

Sawa Stencil Cleaners are widely used in the electronics industry to ensure high yields when screen printing solder paste onto printed circuit boards. Normal cloth wipe cleaning of stencils cannot completely remove solder paste especially in fine-pitch applications. Sawa Stencil cleaning machines are able to completely remove solder paste utilizing ultrasonic vibration.

Seika offers technical support for all of its equipment and repairs for the portable SC- 500HE and SC-5000GUS cleaners are conducted in its Los Angeles demo center.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com

CAZENOVIA, NY – Knowles Precision Devices, a premier global source for Multilayer, High Reliability, Single Layer and Precision Variable Capacitors; EMI Filters; and RF/Microwave Components including RF Filters, Splitters and Couplers, is pleased to announce their attendance at PCIM Europe 2023. At PCIM Europe 2023, Knowles will showcase their high-performance Multi-Layer Ceramic Capacitors (MLCCs) and components that are designed for systems that cannot fail or operate at extremely high voltages, temperatures, or frequencies across military, medical, electric vehicle (EV), and 5G market segments. Learn more about Knowles Precision Devices capacitors here.

  • MLCCs- Knowles Precision Devices’ Multi-Layer Ceramic Capacitor (MLCC) product lines are available in standard surface mount packages as well as ribbon and radial lead packages. SMD case sizes range from 0402 to 8060. Knowles MLCCs support voltages to 12kV and high level application specific screening such as AEC-Q200 for automotive, MIL-PRF-55681 for medical implantable and much more.
  • Trimmers- Knowles Precision Devices is the world's leader in the design and manufacture of precision trimmer capacitors. The portfolio includes air, glass, sapphire, and PTFE dielectrics that can be used from 1 MHz to over 2 GHz and at voltages up to 20,000 VDC. Trimmers are available in precision Multi-Turn and Half/Single turn formats.

Knowles Precision Devices manufactures capacitors for some of the world’s most demanding applications, serving a variety of markets including medical implantable devices and medical equipment, military, aerospace/avionics, EV/automotive, and industrial electronics.

Taking place May 9-11, 2023, in Nuremberg, Germany, PCIM Europe is the leading international exhibition and conference for power electronics and its applications. At this exhibition and conference, experts from industry and academia meet and new trends and developments are presented to the public for the very first time.

Meet Knowles Precision Devices at Hall 7, Booth 576. To schedule a meeting with the team, contact knowles@castercomm.com 

CLINTON, NY – Indium Corporation R&D Manager, Alloy Group Dr. HongWen Zhang is scheduled to deliver a presentation at the 73rd Electronic Components and Technology Conference (ECTC), June 1, in Orlando, FL. The presentation will examine the findings from a technical paper titled A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application That Outperforms SAC305.

In the presentation, Dr. Zhang will examine the results of testing an indium-containing, low-temperature solder paste—Indium Corporation's Durafuse® LT—for wafer-level package (WLP) applications. During the test, Durafuse LT, regardless of reflow profiles, outperformed SAC305.

“By combining energy savings with high reliability, this innovative material can bring tremendous benefits to our customers and the industry at large,” said Dr. Zhang. “I would like to thank ECTC for giving me the platform to present this important data to my colleagues.”

Dr. Zhang is manager of the alloy group in Indium Corporation’s R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the new alloy technology to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability.

Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a master’s degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.

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