ROSEMONT, IL – Dr. Jennie Hwang, Chair of AI Committee of National Academies/DoD AI study, Chair of Review Panel of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course. A pioneer and long-standing leader in SMT manufacturing and lead-free implementation, the course provides working knowledge to all who are interested in acquiring pragmatic perspectives of the present and future of AI.

Monday, October 21 – 8:30AM -12:00PM

PDC9: “Artificial Intelligence Era – Opportunities, Challenges, Possibilities”

As moving into Artificial Intelligence (AI) era, the new AI tools and platforms are remaking our daily lives and every aspect of workplace including design, research, engineering, manufacturing and management across all industries - from semiconductor and printed circuit board design to life sciences and new material design. Even not being an AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. This course will bring an up-to-date and a holistic overview of AI with the goal to spur innovative ideas and inspire new vistas to timely capitalize the sound benefits of AI to maximize on-job efficiency and effectiveness as well as business profitability and productivity. The recent emergence of ChatGPT and Generative AI makes use cases and “possible” future become more crucial to the on-job performance. The ability to balance between the AI’s omnipotent power and its downsides is key to leveraging AI as virtuous tools. Businesses will distinguish themselves by how well they use the tools and how reliable and safe the designed tools can deliver. This course maps out AI landsacpe including the current and future of AI development/deployment, demystifies prevalent notions, and outlines the prerequisite to win “AI game.” The key components behind AI technology including machine learning (ML), deep learning (DL), Neural Networks (NN), Internet of Things (IoT), digital twins, Large Language Model (LLM), AI with justified confidence/trust, ChatGPT industry use-cases will be highlighted along with tips and recommendations. No pre-requisite is required.

Topics:

• Background & diverse perspectives of AI
• Current state of AI
• AI – justified confidence
• AI – machine learning, deep learning, neural network, digital twin, IoT & use cases
• Generative AI, OpenAI – ChatGPT-4+
• Generative AI – prompt engineering - tips and recommendations
• Enterprise opportunities – jobs, examples
• Edge AI, private AI, data
• Global leaders & competitiveness – examples
• AGI - Artificial General Intelligence
• Brain, mind à intelligence
• Future of AI – near-term, mid-term, long-term
• Concluding remarks

Instructor – Brief Biosketch International Hall of Famer of Women in Technogy, the author and co-author of ten (10) internationally-used textbooks and 700+ publications, a speaker at innumerable international and national events, she is Chair of Artificial Intelligence Committee of National Academies/DoD; Chair of Review Panel of National Artificial Intelligence Institute of NSF; Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF; Chair of National Laboratory Assessment Board; Chair of Assessment Board of Army Research Laboratory; Chair of Assessment Board of Army Engineering Centers; has also served on the Board of NYSE Fortune 500 companies and on various civic, government and university boards and committees (e.g., DoD - Globalization Committee, DoD - Forecasting Future Disruptive Technologies Committee, National Materials & Manufacturing Board, Board of Army Science and Technology, and Technical Assessment Board of NIST). She has received numerous honors and awards including International Hall of Fame of Women in Technology, National Academy of Engineering inductee and named R&D-Stars-to-Watch. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry & Liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., among others, and CEO of International Electronic Materials Corp. She is also an invited distinguished adj. professor of engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees. Further Info: www.JennieHwang.com

CLINTON, NY – Indium Corporation® will feature a range of industry-leading, high-reliability solder products at the Guadalajara Expo & Tech Forum in Guadalajara, Jalisco, Mexico, September 11-12.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
• Indium8.9HF Solder Paste Series is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• CW-818 is a flux-cored wire is designed to meet the demanding requirements of today’s manual and robotic soldering processes. CW-818 provides fast wetting speeds, allowing users to minimize cycle times. The spatter control technology minimizes flux spattering while the heat-resistant nature of the formula reduces flux build-up on the soldering iron tip as well as leaves a clear, non-tacky residue post-soldering (even when using a high iron tip temperature). The superior soldering performance, improved cleanliness, and excellent visual appearance post-soldering deliver a truly no-clean flux-cored wire.

To learn more about Indium Corporation’s solutions, visit our experts at booth #430 at the show.

BANGALORE – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce its participation at productronica India 2024, one of the premier trade events for the electronics manufacturing industry in the region. The event will be held from September 11 to 13, 2024, at the India Expo Centre in Greater Noida, India.

As the demand for higher quality and precision in electronic assembly continues to grow, the demand for advanced inspection technologies has become more critical than ever. With its wide range of high-speed, high-precision inline automated inspection solutions that help manufacturers reduce costs, streamline processes, and enhance production quality, Saki is leading this transformative change in the industry.

At productronica India 2024, Saki will be showcasing its total inspection solutions at Booth H014.A011. Visitors will witness live demonstrations of the latest 2D/3D Automated Optical Inspection (AOI) systems, alongside advanced X-ray Inspection (AXI) and Solder Paste Inspection (SPI) equipment presentations. Saki’s state-of-the-art software systems with enhanced programming features that further boost inspection accuracy and efficiency will also be a key highlight. In addition, Saki’s M2M (machine-to-machine) solutions designed to optimize quality and productivity across the entire production line will be demonstrated in collaboration with selected pick-and-place machines from partner SMT companies.

The show line-up on booth H014.A011 will feature:

3D-AOI
The industry’s most powerful inspection capability will be demonstrated by Saki’s 3D-AOI machine model 3Di-LS2, which is equipped with the innovative Z-axis control head and offers a height measurement range of up to 40mm in 3D mode. It also raises the focus height to 40mm in 2D mode. These unique capabilities enable Saki’s 3Di-AOI series to accurately, quickly and easily perform inspection tasks with significantly greater flexibility and precision than standard SMT inspection processes.

Software Solutions
Saki's software suite & line control systems demonstrate the company's data-driven approach to continuous productivity improvement. Visitors to the Saki booth will experience the full line control enabled by Saki’s Offline Teaching station (BF2-Editor), Verification station (BF2-Monitor / MPV), and SPC/Process Quality and Traceability Tool (QD Analyzer).

"Saki will offer booth visitors an up-close and personal look at the unique features of the latest hardware and software releases with an emphasis on total inspection line solutions that deliver reliability, speed, quality, and value for applications across key sectors including automotive, EMS, and industrial markets. We look forward to welcoming visitors to our booth H014.A011 at productronica India 2024. Join us to explore how our latest innovations can support your manufacturing processes and elevate your production quality," said Anusorn Wiriyapongpibool, Technical Sales Manager Saki Asia Pacific.

For more information about Saki visit www.sakicorp.com/en/ 

CARLSBAD, CA – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.

On display will be the ASYMTEK Forte® fluid dispensing system, configured for high productivity and accuracy for many semiconductor packaging and microelectronics manufacturing applications. The Forte system is ideal to tackle high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.

Other featured technologies include developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP), and handling the challenges of warpage during fluid dispensing operations. Presentations will be available to show different configurations for WLP and PLP on the ASYMTEK Vantage® fluid dispensing system, and how these systems can successfully ensure precise dispense results with high throughput.

Experts will be ready to discuss how Nordson can support your manufacturing of reliable semiconductor products. SEMICON Taiwan will be held at TaiNEX, Taipei Taiwan, September 4-6, 2024.