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30 May 2023 ― Maharashtra, India – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of ACD Renaissance LLP as its manufacturers’ representative in India.

ACD Renaissance is an end-to-end solutions provider for PCB, SMT, and through-hole assembly. Located in Ambegaon Bk, Pune, Maharashtra, India, ACD Renaissance will provide sales and technical support for AIM Solder’s complete line of products and services in the states of Maharashtra and Gujarat.

“We are pleased to announce this new partnership with ACD Renaissance,” said David Suraski, AIM’s Executive Vice President, AMD. “The company’s proven commitment to providing the highest level of service coincides with AIM’s value-added philosophy of providing top-notch support to its customers worldwide and in this important region.”

ACD Renaissance can be reached at +91 8411935923 or visit them at https://acd-renaissance.com/.

AIM Solder’s Technical Sales Manager for the region, Sudhir H.R, can also be reached at sudhir@aimsolder.com.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.

Indium Corporation Strategic Advisor Dr. Dongkai Shangguan is scheduled to deliver a keynote presentation at NordPac, hosted by IMAPS, June 12-14, in Oslo, Norway.

The presentation, titled Interconnect Reliability: From the Chip to the System, examines the importance of interconnect reliability to the overall integrity of semiconductor packaging and electronic systems. As newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. The growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms.

“As an international gathering of microelectronics packaging experts, from both academia and industry, NordPac is a tremendously valuable forum for discussing the groundbreaking research taking place throughout the field,” said Dr. Shangguan. “I am honored that IMAPS has invited me to deliver a keynote presentation to my esteemed colleagues at this important event.”

Dr. Shangguan is a Strategic Advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also served as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books, more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 30 U.S. patents and several foreign patents.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

Minneapolis, Minnesota, USA, May 30, 2023 – ITW EAE, the Electronic Assembly Equipment division of Illinois Tool Works, announces a new partnership agreement with Macon to represent and distribute Vitronics Soltec soldering equipment beginning May 26, 2023, in Argentina. This agreement is an expansion of Macon’s representation of ITW EAE’s product line which already included MPM printers, Camalot dispensers, and Electrovert soldering and cleaning equipment.

“We are excited to add the Vitronics Soltec product line into Macon’s business model. With this, Macon is expanding our offerings and consolidating the ITW EAE product line in Argentina. This move allows Macon to provide sales, service, spare parts, and general customer communication and satisfaction in a more streamlined manner,” said John Fanning, ITW EAE Sales Director. “With Macon's proven viability in the South American market and their history of growth and relationship building representing ITW EAE's other products like MPM, Camalot, and Electrovert, they are well-positioned to successfully integrate Vitronics Soltec into their operations.”

“Our history with ITW EAE (formerly Speedline) began in Argentina back in the 90’s when our well-remembered Juan Gonzalez Pena and Carlos Gomez sold and provided technical support to the first Camalot 1414 and 1818 machines, and SPM printers in the incipient national electronics industry”, said Emiliano Herrero, Sales Director of Macon. “Over many years, people and projects have passed, but the spirit of work has passed from generation to generation, and today you find us again representing this great company, which has more than 30 years of success in our industry.”

Macon's focus on ITW EAE's products and their deep technical understanding allows them to provide customers with detailed engineering-level presentations. This level of expertise is valuable in helping customers make informed decisions about ITW EAE's products and how they can meet their specific needs.

Vitronics Soltec is a brand of ITW EAE, a division of Illinois Tools Works, Inc. They specialize in the design and manufacturing of mass soldering equipment for the global circuit board assembly market, and includes Reflow, Wave and Selective Soldering technologies. ITW EAE brings together world-leading brands of electronics assembly equipment including MPM, Camalot, Electrovert, Vitronics Soltec, and Despatch. For more information visit www.itweae.com.

GUADALAJARA – Pemtron Technology, an inspection equipment developer and supplier, is pleased to announce plans to exhibit at the SMTA Aguascalientes Expo and Tech Forum, scheduled to take place Thursday, June 1, 2023 at the Aguascalientes Marriott Hotel in Aguascalientes, Mexico.

Jaime Arreola, Pemtron’s MX General Manager, will be available to meet with customers to discuss the Athena 3D Automated Optical Inspection System and TROI 8800 CI Series Conformal Coating Inspection System.

The Athena 3D Automated Optical Inspection (AOI) System uses 12-way projection for 3D measurements on all models to minimize errors due to shadow effects, and performs 100 percent of 2D & 3D inspection concurrently in all FOV areas. This significantly reduces false calls while providing near-perfect detection. The system offers 10/15 or 18um resolution, a 10MP camera (optional 12MP) and a three-stage conveyor.

Pemtron’s TROI 8800 CI Series Conformal Coating Inspection System with optional inline Coating Thickness Measure provides the most reliable conformal coating inspection. With simple programming, the machine can inspect defects like cracks, coating voids, wrong coating thickness (too-thin or too-thick).

For more information about Pemtron, visit https://pemtron.com/ 

WARMINSTER HEIGHTS, PA – ThermOmegaTechⓇ is proud to mark 40 years as one of the industry's most trusted designers and manufacturers of thermostatic valves and thermal actuators. This exciting milestone is furthered by a recent merger with TJM Electronics and an expansion of its manufacturing capabilities to include PCBA (Printed Circuit Board Assembly), one of the latest advancements in the electronics field.

ThermOmegaTech'sⓇ thermal actuator technology is used in a wide variety of industries, including aerospace, defense, railroad, industrial, and commercial plumbing, all of which rely heavily on sustained temperature control. Applications for ThermOmegaTechⓇ technology include freeze and scald protection, mixing and diverting, steam tracing control, thermal bypass, tepid water delivery, washdown, thermal balancing, drain tempering, and more.

With the TJM Electronics merger and the addition of PCBA capabilities, ThermOmegaTechⓇ has deepened its investment in supplying industries with the products they need to maintain superior processes and controls. They've also opened the door to new and expanded opportunities in the aerospace and defense markets. With an AS9100D certification, they demonstrate their dedication and compliance with strict aspects of the production process, including design, development, manufacturing, testing, and servicing.

TJM Electronics has been providing high-quality PCB assemblies since 1987. Their experience will be crucial to the expansion of ThermOmegaTech'sⓇ capabilities, particularly in terms of PCB assembly solutions for aerospace, defense, medical, industrial, LED lighting, and non-commodity consumer electronic products. PCBAs offer advanced functionality to electronics products that perform in extreme conditions and require the skill, speed, accuracy, and flexibility that the ThermOmegaTechⓇ and TJM Electronics merger provides.

Additional advantages of the merger include streamlined processes and improved communication channels. This is due in large part to TJM Electronics moving to the ThermOmegaTechⓇ facility in Warminster, PA, where all of the company's R&D, manufacturing, assembly, testing, inspection, sales, and customer service departments are located. The state-of-the-art Warminster facility is uniquely designed to support high-density, low-to-high-volume orders and is 75% powered by rooftop solar panels in order to help reduce greenhouse gas emissions.

Interested readers are encouraged to visit www.thermomegatech.com to learn more or to contact ThermOmegaTechⓇ directly.

CLINTON, NY – Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch is set to deliver a presentation at EPP InnovationsFORUM on June 29 in Leinfelden-Echterdingen, Germany.

The topic of energy consumption within the electronics assembly industry has never been more relevant. In this presentation, titled Energy Efficient Reflow Soldering Through Advanced Solder Materials, Andreas examines the increasing importance of reducing energy consumption while simultaneously maintaining high quality electronics. This requires the development of advanced solder materials which enable stable, low-temperature soldering processes.

“I am looking forward to presenting University of Rostock’s test results for this new solder material technology,” said Andreas. “The EPP InnovationsFORUM is an ideal platform to share this exciting data with my colleagues.”

Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.

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