SEOUL, KOREA – PEMTRON, an inspection equipment developer and supplier, is pleased to announce its participation in NEPCON Nagoya 2024, where it will showcase its cutting-edge equipment designed for precision inspection in semiconductor and electronics manufacturing.

From October 23-25, visitors to PEMTRON’s booth will experience demonstrations of the JUPITER 3D X-ray Inspection System, POSEIDON Wafer Warpage Measurement and FC-BGA Bump Inspection System, APOLLON Package Inspection System, and the 8800WIR Wafer Inspection System.

The JUPITER 3D X-ray Inspection System offers both 3D and 2D capabilities through advanced PCT reconstruction- based processing. Equipped with a high-resolution optical camera and integrated with PEMTRON’s proven AOI defect detection algorithms, JUPITER provides manufacturers with an exceptional tool for comprehensive in-line inspection and process quality analysis. Its seamless integration with SPI and AOI systems enables data sharing, delivering valuable insights into the production process and enhancing overall efficiency.

The POSEIDON System offers a cutting-edge solution for wafer warpage measurement and FC-BGA bump inspection. Leveraging 3D data, POSEIDON precisely measures warpage, flatness, and coplanarity, while its high-resolution imaging identifies fine defects like missing bumps, bridging, and more. Designed to support advanced processes such as wire bonding and Micro LED applications, POSEIDON delivers swift, accurate mapping and profiling data essential for high-precision manufacturing.

PEMTRON’s APOLLON Package Inspection System is engineered for real-time defect detection across a wide variety of packages, including BGA, LGA, QFN, QFP, CSP, and SOP. With its automated reporting capabilities, APOLLON significantly enhances production efficiency and minimizes downtime, ensuring high-quality results for manufacturers.

Also on display will be the 8800WIR Wafer Inspection System, which utilizes 2D and 3D imaging technologies to inspect micro bumps and other types of wafer components. This system plays a critical role in detecting and addressing quality issues early in the semiconductor manufacturing process, ensuring optimal production quality.

Join PEMTRON at NEPCON Nagoya 2024 for live demonstrations and discover how these revolutionary systems are shaping the future of semiconductor and electronics manufacturing.

For more information about PEMTRON, please visit www.pemtron.com 

SHIPPENSBURG, PA – Niche Electronics, a leading electronics manufacturing services company, announced today the opening of its new location in Bedford, Massachusetts. The completely renovated production space replaces a phased-out smaller facility Niche had operated in nearby Waltham.

Niche Electronics crafts high-complexity circuit boards, wire harness and cable assemblies for many industries, providing services from new product introduction to volume production. The company’s new 11,000 square-foot location offers significant advantages to customers and employees. Among the significant upgrades:

• Space: Niche designed a new configuration that enables optimal production, with single-level manufacturing and equipment placement that maximizes efficiency.
• Environment: Niche’s larger, climate-controlled building offers an electro-static dissipative environment — incredibly important for reducing static electricity during manufacturing. State-of-the-art LED lighting will lower costs while improving visibility.
• Technology: The new location includes upgraded production equipment and RFID perimeter tagging that provides a secure environment. Newly installed IT infrastructure creates fast, secure connections to corporate servers, and an updated phone system improves communication.

Frank Bowman, CEO of Niche, said the new facility offers vastly improved workflow that benefits employees and significantly boosts production capacity.

“Our move into the clean, modern production space is a huge step up for our team and our customers,” Bowman said. “This is just the latest signal that Niche is committed to our program of expansion and continuous improvement.”

Bowman added that Niche will be adding to that location’s sales force, which will enable Niche to build on its reputation of responsiveness to customers and prospects.

The new facility enables Niche to maintain redundant sites in three geographical locations in Massachusetts, Pennsylvania, and Florida. This advantage enables the company to shift production in the event of service interruptions from machine outages, natural disasters, fires, or other unforeseen circumstances.

These three strategically located facilities also give Niche an optimal geographical reach, enabling personalized service to hundreds of high-tech customers within a three-hour drive.

SAN DIEGO – KIC, the leader in smart thermal process technologies for electronics manufacturing, is pleased to announce that Miles Moreau, General Manager, will be presenting at SMTA International 2024. The presentation, titled "Thermocouple Tactics: A Comparative Study of Attachment Methods," will take place on Wednesday, October 23 from 2-3:30 p.m. during Session RHE6 of the Reliability and Harsh Environments track at the Donald E. Stephens Convention Center in Rosemont, IL.

This session will explore various thermocouple attachment techniques for PCB thermal profiling, a critical aspect of ensuring high-quality printed circuit board (PCB) assembly. Accurate monitoring and control of the time-temperature profile during reflow soldering are essential for maintaining product integrity and minimizing rework and scrap.

However, the accuracy of temperature measurements is highly dependent on the method used to attach thermocouples to the PCB assembly. Miles Moreau, alongside Chrys Shea of Shea Engineering and Martin Anselm of Rochester Institute of Technology (RIT), will present findings from a series of experiments designed to evaluate different methods of affixing thermocouples to circuit boards. The study, conducted at RIT, involved testing various attachment techniques, including polyimide tape, aluminum tape, high-temperature solder, and thermally conductive adhesives, on SMTA test boards subjected to multiple reflow cycles.

"We're excited to share the results of our comprehensive study on thermocouple attachment methods," said Miles Moreau. "This research is vital for the industry as it highlights the impact of attachment techniques on the accuracy of temperature measurements, ultimately contributing to higher-quality PCB assemblies."

The presentation will provide detailed insights into the test methods, statistical analysis, and conclusions drawn from the study, offering valuable guidance for manufacturers looking to optimize their thermal profiling processes.

For more information about KIC, visit https://kicthermal.com 

CZECH REPUBLIC – PBT Works s.r.o., (in cooperation with MaRC Technologies) a leading manufacturer of cleaning technology for electronic assemblies and tooling, is excited to announce its participation in SMTA International 2024, where it will highlight the HyperSWASH and SuperSWASH cleaning systems. Attendees are invited to visit Booth 3062 to learn more about these advanced cleaning systems.

SuperSWASH III: Precision Cleaning for Complex Assemblies

The SuperSWASH III system is specifically designed for high-density SMD assemblies and is ideal for customers seeking superior cleaning results without the necessity for automation or high throughput. This system excels in handling medium to low quantities of complex products, offering unmatched flexibility to adjust for cleaning various sizes and shapes of parts.

Key Features of SuperSWASH III:

• Designed for high-density SMD assemblies
• Optimal for medium to low quantities of complex products
• Easily adjustable for cleaning any size and shape of parts
• Delivers outstanding cleaning results

HyperSWASH III: The Pinnacle of Automation and Data Management

For customers demanding both high-quality cleaning results and high throughput, the HyperSWASH III is the top-end solution. This system focuses on data management and automation, ensuring maximum data output with minimal human interaction, making it the ultimate choice for efficient and effective cleaning.

Key Features of HyperSWASH III:

• Ideal for high-density and standard SMD assemblies
• High throughput with a focus on automation
• Comprehensive data management capabilities
• Minimal human interaction required

Join us at Booth 3062 during SMTA International to learn more about the innovative PBT Works HyperSWASH and SuperSWASH cleaning systems.

PBT Works is EN ISO 9001 and EN ISO 14001 certified. For more information, visit www.pbt-worksusa.com