DAYTON, OH – Libra Industries, a privately-held systems integration and electronics manufacturing services (EMS) provider, is excited to announce the opening of its new manufacturing clean room at the Dayton facility. This state-of-the-art clean room is set to enhance their capabilities, reflecting their commitment to technological advancement and operational excellence.

The ribbon-cutting ceremony, which was held on August 15, was not just a celebration of Libra's expansion but also a testament to the resilience and innovative spirit of our team. "Many manufacturing and tier 1 & 2 manufacturing supply companies struggled during COVID, and Libra was no exception," remarked Julie Sullivan, Executive Vice President of Regional Development at the Dayton Development Coalition. "However, the unique opportunities in the semi-conductor/lithography industry allowed the talented local team here at Libra to immediately pivot, giving way to new R&D processes with streamlined procedures in this industry. We’re grateful they were willing to work with DDC and JobsOhio to explore these opportunities."

"The opening of our new manufacturing clean room in Dayton marks a significant milestone in our commitment to advancing semiconductor fabrication capabilities in the region,” commented Andrew Williams, CEO of Libra Industries. “This investment not only reflects our dedication to innovation and growth but also underscores our role in contributing to the local economy. By creating new jobs and bringing cutting-edge technology to Dayton, we are reinforcing our long- standing tradition of excellence while looking forward to a bright future in the semiconductor industry. We’re proud to continue our journey with the support of our incredible team and the Dayton community."

This new facility marks a significant milestone in Libra Industries' strategy to support growth fueled by the burgeoning demands of the semiconductor sector.

With an investment of $2.1 million and the creation of 31 new jobs, this project not only amplifies our manufacturing capacity but also solidifies our presence in Dayton's tech-driven landscape.

Libra Industries continues to invest to provide customized manufacturing solutions for its customers’ complex product requirements. Through its broad range of capabilities, Libra offers its customers the most capable manufacturing team in the industry. For more information about Libra Industries, visit www.libraindustries.com  

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

In addition, AIM Technical Sales Manager for Southeast Asia, Mhanny Aguillo will be giving a presentation titled High Reliability: The Challenges of Soldering for Extremely Harsh Environments:

High reliability in electronics pertains to the quality of solder joints themselves as well as the electrochemical properties of the flux residue.​ Key characteristics of reliable solder joints include strength and ductility. These joints are often tested via thermal cycling, drop shock and more. Exact testing requirements are dependent on application. When it comes to flux, industry standards such as IPC and JIS define the electrochemical requirements of flux residues, which is particularly important in no clean processes. This presentation outlines the trends and challenges of high reliability application sin automotive, military & aerospace, and LED sectors. Test data comparing specially formulated high reliability alloys with SAC305 are presented along with a discussion of how key elements of the alloys aid in improved reliability.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Penang Expo & Tech Forum September 25-26th, or visit www.aimsolder.com

CLINTON, NY – As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
• Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices.
• Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.

Some of the additional products featured will include:

• Indium8.9HF Solder Paste Series, an industry-proven solder paste series, delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• Indalloy®301 LT Alloy for Preforms/InFORMS® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
• SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.
• Heat-Spring® solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes.
• NC-809 is Indium Corporation’s first no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.

  To learn more about Indium Corporation’s solutions, visit our experts at Productronica India in hall 14, booth H14.B65.

CONKLIN, NY – Universal Instruments will join parent company Delta, a global leader in power and thermal management technologies and a world-class provider of industrial automation solutions, on booth S7542 at the SEMICON Taiwan trade show on September 4–6. The booth will feature a seamless integration of semiconductor solutions, including Delta’s Wafer Edge Profile Measurement Machine for front-end processing and Universal’s FuzionSC™ and High-Speed Wafer Feeder back-end multi-die placement solution. Delta will also showcase its Digital-Twin (DlA-Twin) simulation software and adoption of the SEMI E187 cybersecurity practices, surpassing current industry standards.

The Wafer Edge Profile Measurement Machine measures the notch, flat length and edge shape of the ground wafer while also detecting wafer quality and defects. It employs non-destructive AOI optical technology to take these measurements with micro-scale repeatability, which achieves a high throughput of approximately 60-120 wafers per hour. The system supports automated robotic loading/unloading and AGV transport systems, combining diverse functions into a single machine. Delta also offers additional front-end processing solutions including Wafer Edge Grinding, Sorting and IR Pinhole Inspection.

DIATwin is an intelligent design and development tool that can precisely simulate loading points and paths in a virtual environment, enabling the evaluation of production cycle times and reducing the trial-and-error costs in new product introduction. Integrating the DIATwin Virtual Machine Development Platform with front-end equipment to create virtual environments greatly improves efficiency of new product introductions.

The FuzionSC Platform combined with the HSWF is the ultimate solution for challenging multi-die package applications. It’s capable of placing passives and multiple die types in a single cell, eliminating the need to move product between cells and maximizing accuracy and efficiency.

Universal Instruments Vice President of Global Customer Operations and Corporate Marketing, Glenn Farris stated, “The complementary semiconductor solutions we’re able to offer put our customers at the forefront of this fast-moving target. Tying front-end and back-end equipment and processes together, leveraging AI and digital twin technologies to streamline NPI and production, and protecting assets with advanced cybersecurity are all integral advantages.”

Along with visiting the booth, Universal encourages attendees to join a technical presentation by Universal Instruments VP of Global Customer Operations and Corporate Marketing, Glenn Farris. On Friday, September 6 at 11:20 am CST at the HITECH Smart Manufacturing Forum he will present “Accelerating Innovation: Smart Manufacturing for Advanced Semiconductor Packaging”.

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com