TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is gearing up to showcase its latest advancements at Booth 4012 during the 2024 IPC APEX EXPO, slated to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to excellence and technological innovation, Seika Machinery will present an array of state-of-the-art equipment and systems designed to optimize production processes and enhance manufacturing efficiency.

Among the offerings featured at the expo is the Hioki Flying Probe Tester, renowned for its ability to evaluate solder joints between lands and leads through resistance testing. With a measuring rate of 40 steps per second, this advanced tester incorporates an AOI function to verify component presence, polarity and displacement, while soft-landing probes prevent damage to boards and components. Additionally, the Hioki Flying Probe Tester boasts a minimum probing pitch of 0.15mm, facilitating fast fixture-less setup and optional Gerber data-based programming, all operated through a user-friendly Windows® 10 interface.

Seika Machinery will also showcase the Hitachi Giken Neoview, a revolutionary visual inspection support system that transcends human limitations, ensuring accuracy and consistency in inspection results. Designed to accommodate global expansion, the Neoview system addresses critical questions surrounding visual inspection, providing comprehensive solutions supported by international patents.

Additionally, the expo will feature the Malcom RCX Profiler, offering comprehensive profiling of reflow ovens, and the Malcom Spot Viscometer for Paste Printer – PCU02V, designed to measure the viscosity of solder paste for optimal soldering results.

Attendees will have the opportunity to explore the new Sawa Pallet Cleaner – SCPA2, offering all-in-one assembly, flux, wave soldering, and final product cleaning, as well as the McDry dry cabinet with Ethernet Data Logger, providing secure cloud-based data storage and monitoring capabilities.

Rounding out the exhibition are the Unitech PCB Cleaner, featuring a dual dust removal system for superior cleaning results, and the Sayaka 34XJ Inline/Stand-alone Router, delivering precise PCB depaneling and routing with exceptional accuracy and efficiency.

Seika Machinery invites attendees to visit Booth 4012 at the 2024 IPC APEX EXPO to experience firsthand the latest advancements in electronics manufacturing technology.

BOCA RATON, FL – Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is gearing up for a strong presence at the upcoming 2024 IPC APEX EXPO. The company is poised to showcase its cutting-edge product lineup, promising to redefine inventory management and enhance production efficiency in Booth 1808. The 2024 IPC APEX EXPO is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.

LS700 Series Smart Racks: Revolutionizing Feeder Loading and Replenishment

At the heart of Inovaxe’s exhibition are the LS700 Series Smart Racks, meticulously engineered to elevate efficiency in feeder loading and replenishment processes. The LS700 model, renowned for its remarkable capacity, accommodates up to 320 7", 8mm reels within a compact 2.5 square feet of floor space. The LS700-1 model extends this capacity further, providing space for 368 7", 8mm locations. Both models feature an integrated display running the InoAuto software, optimized for lineside usage, and an integrated 1D/2D barcode scanner for enhanced usability and traceability. These racks can be used independently or seamlessly integrated into a complete InoAuto system, facilitating streamlined production interactions.

SREX Racks: Elevating Inventory Management to Unprecedented Efficiency

Inovaxe’s showcase includes the cutting-edge SREX Racks, setting new standards for inventory management efficiency. These state-of-the-art racks boast an impressive storage capacity of up to 880 7" reels or 480 13" reels. Equipped with intelligent sensors, integrated lighting for part identification, and lightning-fast retrieval and return times, SREX racks transform kitting processes, reducing time from hours to mere seconds. These racks seamlessly integrate with MRP software, providing real-time inventory visibility, and are available in various sizes and widths. ESD-compliant and equipped for Wi-Fi and internet connectivity, Inovaxe's SREX racks offer a typical ROI realized in just 3 to 6 months, making them a vital investment in efficiency for manufacturers.

MODI INCOMING GOODS 5.0: Increase Efficiency with Integrated Barcode Printing

The seamless communication between Inovaxe’s Smart Racks and the MODI incoming goods system WES V5 marks a significant advancement in operational efficiency. This integration facilitates a streamlined process for incoming inspection and UID label generation, allowing customers to enhance their workflow. With the MODI system's capability to print barcode labels, the process of applying labels to reels becomes effortlessly integrated with Inovaxe’s innovative material handling solutions. This eliminates the need for additional scans, simplifying the material handling process and saving valuable time.

The MODI incoming goods system WES V5 combines intelligent information processing from captured images and data administration into a fundamental building block of Industry 5.0. Goods receipt is the most popular scenario for the MODI system.

Video: https://youtu.be/jJ0ZW0m_sY0?si=YLNmF76aNpRFOaLV 

VisiConsult X-ray Counter Solutions: Precision and Efficiency Redefined

In collaboration with VisiConsult, Inovaxe presents cutting-edge X-ray Counter solutions, including the XRHCount and XRHCount Inline. These solutions represent a paradigm shift in inventory management and counting processes, offering unprecedented precision and efficiency. With game-changing advantages for companies seeking operational streamlining, the VisiConsult X-Ray Counter solutions are poised to reshape how industries approach inventory management.

Visit Inovaxe at Booth 1808 during the 2024 IPC APEX EXPO to experience these revolutionary solutions firsthand.

To learn more about Inovaxe and their advanced material handling solutions, visit their website at www.inovaxe.com 

PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to showcase its latest advancements and a range of cutting-edge soldering machines at the 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Attendees can visit Kurtz Ersa at Booth #2320, with additional machinery available for viewing in Booth 2620.

This year, Kurtz Ersa will debut several new products, making their first appearances in the Americas:

1. HOTFLOW THREE – Ersa Reflow Soldering Machine The Ersa HOTFLOW THREE, manufactured in Mexico starting in 2024, utilizes patented Ersa heating technology for optimal heat transfer with minimal energy and nitrogen consumption. Setting the industry standard for productivity to footprint ratio, this reflow soldering system offers double to quadruple transport options, enabling remarkable throughput increases without additional floor space. With up to four transport speeds and precisely adjusted transport widths, a wide variety of assemblies can be efficiently processed.
2. VERSAFIT 500 – Press-Fit Technology The Ersa VERSAFIT 500 is a highly flexible inline system designed to significantly enhance the competitiveness of press-fit technology in electronics production. This alternative connection technology reduces production costs and improves assembly quality. At its core is the servo- electric press cylinder, offering precise control and monitoring of force and travel.
3. VERSAFLOW ONE X-Series – Enhanced Selective Soldering Building on the success of the VERSAFLOW ONE, the X-Series introduces variability, optimizing throughput, economic efficiency, and soldering quality. This compact in-line selective soldering system features a dual-pot soldering module, providing exceptional flexibility and performance.
4. ERSA MK2 Soldering Stations The new ERSA MK2 line of soldering stations boasts the patented Tip’n’Turn concept for quick and secure tip exchanges, coupled with a remarkable performance increase of 20%. These stations, starting at 150 Watts, ensure optimum performance for manual applications. With advanced soldering tip technology, precise temperature control, and rapid heating and reheating capabilities, the MK2 series sets new standards for soldering stations.

In addition to these groundbreaking products, Kurtz Ersa will present its comprehensive range of equipment, including selective soldering, reflow soldering, wave soldering, stencil printers, rework systems, optical inspection devices, hand tools, and additive manufacturing solutions.

Visit Kurtz Ersa at Booth #2320 to explore the latest soldering technology advancements. For more information about Kurtz Ersa Inc., visit www.ersa.com

CLINTON, NY – Indium Corporation Senior Area Technical Manager Jason Chou will present at the SMTA Taiwan Tech Forum on March 26 in Taoyuan City, Taiwan. Chou’s presentation will highlight the growing demand for high reliability and low-temperature solder solutions brought on by the rapidly developing electric vehicle (EV) and artificial intelligence (AI) industries.

The growing EV market is fueling demand for more sensors and power moderators. Devices used under the hood now require service temperatures up to 150°C, posing a challenge for traditional lead-free Sn-rich solder alloys, which are increasingly unsuitable for harsh environments. For AI applications, where High-Speed and High-Performance Computing (HPC) are paramount, the complexity of module packaging poses its own set of complications such as warpage-induced non-wet-opens.

Chou’s presentation will examine a novel, mixed-alloy solder technology that demonstrates the combined strengths of each constituent solder powder in the paste. This new system has proven to improve the thermal fatigue resistance of solder joints in harsh thermal cycling and thermal shock conditions. It has also been shown to reduce the reflow peak temperature from ~240°C (SAC305) to ~200–210°C.

“I believe that this new, award-winning mixed-alloy solder system provides an innovative solution to many of the challenges posed by the emergence of EV and AI technologies,” said Chou. “I look forward to sharing more about this cutting-edge solution with my industry colleagues at the SMTA Taiwan Tech Forum.”

As Senior Area Technical Manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.