Press Releases
WALDENBURG, GERMANY – The Würth Elektronik eiSos Group is taking part of the embedded world exhibition in Nuremberg from 9 through 11 of April 2024. Occupying the 200m² Stand #110 in Hall 2, the company will be presenting components from all its divisions, not only including electronic and electromechanical components, but also the Wireless Connectivity and Sensors division, which are particularly interesting for IoT solutions. The presentation focuses on components, and also on the comprehensive spectrum of dedicated services Würth Elektronik has to offer; including design-in support.
At the embedded world 2024 exhibition, Würth Elektronik will be showcasing all divisions to present itself as a service-orientated partner for developers. Its partnership with IC suppliers will also be discussed as two semiconductor manufacturers will be on hand on the booth each day of the exhibition to present reference designs in cooperation with Würth Elektronik.
Exhibition highlights
Brand-new products include the WL-ICLED RGB LEDs with integrated circuits (IC). These pixel-controlled components combine red, green, and blue LED chips and a pre-programmed IC. SMT-capable digital isolators for signal transmission applications up to 150 Mbps will also be displayed to the public for the first time. Other product highlights include the WE-MAPI, WE-HEPC, and WE-XHMI high-temperature power inductors, and the WE-BMS transformer for battery-management systems. Further eye-catching points of the presentation will be the WRIS-RSKS thick-film resistors, whose high degree of sulfur resistance making them ideal for industrial applications. Additionally, in the area of mechanical components, the lead-free SMT spacers make it considerably easier to manufacture stacked circuit boards. Also shown will be four new series of products in the portfolio of durable aluminium hybrid polymer capacitors.
Because the IQD Frequency Products company is a co-exhibitor this year, further attention-drawing products include quartz crystals and oscillators. This Würth Elektronik eiSos Group affiliate will be presenting a series of quartz crystals embedded in 4-pad SMT ceramic cases with an extended operating-temperature range from -40°C to 125°C.
The service area also has a novel feature to present: The REDEXPERT online simulation tool; now expanded with the MagI³C power module designer feature, which enables the swift and simple integration of a power module into an application without the need for specialist DC/DC converter skills.
Conference paper on EMC
The company’s resident EMC expert, Dr. Heinz Zenkner, will also make Würth Elektronik’s special contribution at the embedded world conference. The paper, titled “EMC Compliant Industrial Electronic Design“, will be presented on April 11, 2024 from 9:30am to 1:00pm. This technical article discusses interface electronics and EMC filter concepts that suppress both transient interferences as well as interference emissions at frequencies above 1 GHz.
“We see ourselves as the developer’s partner of choice, and not only do we deliver components ex stock without minimum order volumes, we also provide tools like REDEXPERT and personal support right from the circuit design stage, to help create high-quality and sustainable products hand in hand with our customers. This is why we attach such great importance to service and support,” says Alexander Gerfer, CTO of the Würth Elektronik eiSos Group, describing the thematic orientation of the company’s embedded world presentation.
April 11 2024 is Student Day at the exhibition, and here, Würth Elektronik will be offering a special programme. Information and registration options can be retrieved at the following link: https://www.we-online.com/en/news-center/events/student-day
Aside from its presence at the exhibition stand, Würth Elektronik will have its Show Truck in attendance. Located in the Exhibition Park, this will be a further popular venue for talks and encounters.
IRVINE, CA – TopLine Corporation will co-exhibit in booth #1231 with Tanaka Precious Metals at the upcoming IPC/APEX 2024 conference and exhibition at the Anaheim Convention Center, Anaheim, California, April 9 – 11. At IPC Apex, At IPC Apex, TopLine will display CCGA, BGA, and daisy chain test components as well as bonding wire by Tanaka Precious Metals.
IPC APEX EXPO 2024 is the electronics manufacturing industry’s largest event in North America, featuring a world-class trade show, cutting-edge technical conference, professional development courses taught by industry experts, non-stop networking and more, in Anaheim, California, April 6-11, 2024, where IPC APEX EXPO hosts the Electronic Circuits World Convention 16 (ECWC16).
TopLine Corporation is a well-known provider of CCGA semiconductor packages for engineering development.
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the signing of Cornerstone Technical Marketing for sales representation in California and Nevada.
Cornerstone Technical Marketing is a solutions-driven technical sales group that was established in 2004, with presence throughout California, Nevada, and Costa Rica. Cornerstone proudly represents manufacturers recognized around the world as industry leaders in the high-tech arena. With 50+ years of combined experience, CTM is an excellent choice for solving the complex challenges in medical device and electronic manufacturing.
“We are thrilled to announce our partnership with Cornerstone Technical Marketing. Their reputation for excellence and extensive industry knowledge make them an ideal collaborator,” said David Suraski, AIM’s Executive Vice President. “Together, we are confident in our ability to provide unparalleled service and support to our customers, delivering innovative solder solutions that meet their evolving needs."
For general inquiries, Cornerstone Technical Marketing can be reached at: lhuerta@cornerstone-tm.com or leonardo@cornestone-tm.com
Visit the company online at www.cornerstone-tm.com
AIM Solder’s Sales Manager for the region, Nolan Neva, can also be reached at nneva@aimsolder.com
SAN JOSE, CA ― Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, pleased to announce the expansion of its capabilities with the acquisition of the iCoat-5 JetSelect Ultra High Precision Conformal Coating Machine from Anda Technologies. The addition of conformal coating capability to its service portfolio further expands the company's ability to meet the diverse needs of its customers.
The iCoat-5 JetSelect is designed to meet the escalating demands for precision in conformal coating applications. This state-of-the-art system integrates advanced jetting valve technology with precision coating valves, delivering unmatched accuracy in critical areas while ensuring enhanced speed in those less stringent. Key features of the iCoat-5 JetSelect include micro coating facilitated by the JET-8600 pneumatic jetting valve, a gantry running accuracy of ±0.02 mm (20 µm), five axes of movement, and a single-head rotational turret design supporting up to three valves.
“We are committed to providing our customers with comprehensive solutions that meet the highest standards of quality and reliability,” said Green Circuits’ CEO Michael W. Hinshaw, Jr. “The iCoat-5 JetSelect enables us to deliver superior conformal coating services that enhance the performance and longevity of our customers' products.”
Green Circuits, Inc. provides high-quality design, prototyping and full-scale production services for all types of printed circuit boards and complex systems. The company is the 2023 CIRCUITS ASSEMBLY EMS Company of the Year and Global SMT & Packaging 2023 Global Technology Award winner for Contract Manufacturers $50-100 million.
For more information, visit www.greencircuits.com
AUBURN HILLS, MI – The Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, has successfully facilitated the sale of an Ersa Versaflow 4/55 Selective Soldering Machine to Emerald Technologies Saline, MI location, a leading electronics manufacturing service provider. This strategic acquisition marks a milestone for Emerald Technologies in its quest to exceed the challenges of the electronics assembly market, by significantly enhancing its soldering process with the industry-leading technology of the Ersa Versaflow 4/55.
The Ersa Versaflow 4/55, known for its top technology in inline selective soldering, offers unmatched flexibility and efficiency. Its full modularity caters to every customer requirement, promising a tripling of throughput with the highest flexibility and an intuitive operating concept. These technical highlights ensure the highest process reliability through proven control systems, making it the non- plus-ultra in selective soldering.
Emerald Technologies, a company that prides itself on solving the most complex technical challenges with a customer-centric approach, sees this acquisition as a game-changer. “The Ersa Versaflow 4/55 is an amazing machine that has significantly enhanced our soldering capabilities, allowing us to offer even higher quality and more reliable products to our clients,” said Randy Ferrell, Process Engineering Manager at Emerald Technologies Saline, MI location. “Matt Percival of The Murray Percival Company was instrumental in this implementation, always knowing exactly what will improve our processes. His expertise and dedication have made a real difference in how we approach manufacturing challenges.”
The Murray Percival Company, a third-generation family-owned business, continues to demonstrate its commitment to improving customer processes and maximizing ROI. “We always appreciate the opportunity to introduce our customers to technologies that will help them grow their bottom line,” said Murray Percival III. “The Kurtz Ersa Equipment has a proven track record of doing that, so for us helping to bring them together with the Emerald team is an ideal situation.”
This partnership between The Murray Percival Company and Emerald Technologies Saline, MI location represents a perfect synergy of expertise and innovation, setting a new standard in the electronics manufacturing industry. Both companies are excited about the potential this brings to Emerald Technologies’ manufacturing capabilities and the benefits it will deliver to their clients.
For further inquiries or to explore how Ersa and The Murray Percival Company can address your PCB supply needs, please visit www.murraypercival.com
HANAU, GERMANY – Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.
Heraeus Printed Electronics, the worldwide only provider of a turnkey solution for digital inkjet printing on electronic components, offers metallic inks, deep process knowledge and printing systems. It complements the broad product portfolio of Heraeus to the electronics industry. The Prexonics ® technology enables selective printing on different substrates for a wide range of applications such as shielding against electromagnetic interference (EMI), printing of conductive structures and metallization for heat dissipation.
"This collaboration represents the missing piece in the mosaic of scaling to mass production for us, having recently passed the important milestone of fulfilling the broad functional requirements of the semiconductor industry with our ground-breaking technology," said Franz Vollmann, Head of Heraeus Printed Electronics. "By combining our core expertise in metallic specialty inks and digital printing processes with the scaling competence of our strong partner SUSS MicroTec, we are setting a new industry standard for mass production in the semiconductor market."
SUSS MicroTec, known for its advanced equipment and process solutions for semiconductor manufacturing, brings its leading-edge automation platform and industrial inkjet production capabilities to the table. Their high-volume production equipment, JETx, designed to integrate various printhead and substrate technologies, expands the application potential of Heraeus' digital printing technology. SUSS MicroTec´s high production capacity and excellent global sales and service network support the smooth transfer of the solution into high-volume manufacturing.
"The integration of Heraeus' breakthrough ink technology and digital printing capabilities with our robust automation platforms is a testimonial to our pursuit of excellence and innovation. We are confident that our combined efforts will result in unprecedented production efficiencies and costs in line with current and future market expectations," said Dr. Robert Wanninger, Senior Vice President Advanced Backend Solutions of SUSS MicroTec.
The scope of the collaboration calls for the development of equipment that integrates Heraeus' digital printing technology, image processing software and advanced ink technology into SUSS MicroTec's automation and JETx platform. The end goal is a state-of-the-art system with a competitive total cost of ownership (TCO) that not only sets new standards in the industry, but also aligns with Heraeus and SUSS MicroTec's vision of cost and performance optimization. The product of this partnership looks to redefine the boundaries of what is possible and push forward into a future where technology serves as the cornerstone for innovation and growth.
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