TEMPE, AZ – Benchmark Electronics, Inc. (NYSE: BHE), a global provider of engineering, design, and manufacturing services, today released its 2023 Sustainability Report. The report can be found on the company's website and keeps track of Benchmark's continued progress on environmental, social and governance (ESG) initiatives, including specific achievements across the company's global network.

"I am pleased to release Benchmark's third annual Sustainability Report, sharing our company's latest efforts and results on this important strategic imperative," Jeff Benck, president and CEO, Benchmark. "As demonstrated in our report, we continue to further our efforts to positively impact the environment, engage our people, support our local communities, and continue advancing our vision with customers. We're proud of the work being done in this area across Benchmark."

The report highlights Benchmark's sustainability efforts and achievements over the past year and provides insight into future plans guided by the company's commitment to reduce environmental impact, while increasing social and economic value, and further promoting ethical business practices. A few of the highlights from the 2023 report include:

• The company substantially expanded its ESG/ Sustainability management structure with a new Global Director of Sustainability position, a new Health and Safety Council and an Environmental Council with representatives from every site.
• Benchmark again achieved Silver status from EcoVadis. Benchmark moved up from the 72nd percentile for 2022 to the 89th percentile for 2023, placing the company among the top 25 percent of companies assessed by EcoVadis.
• In 2023, Benchmark conducted its third annual employee survey, achieving 86% participation in the survey, up from 82% in 2022 and 77% in 2021.

"As a leading design and manufacturing service provider to OEMs across the world, Benchmark has a responsibility to our stakeholders, employees, customers, and communities to be a corporate leader in sustainability and DEI pursuits," said Bill Olson, Global Director of Sustainability, Benchmark. "To meet this responsibility, we will lean on our long history of operational excellence and extend that same level of rigor to our pursuit of environmental, social, and governance (ESG) imperatives."

To learn more about Benchmark's sustainability efforts and Product Sustainability Services, visit the company website at https://www.bench.com/sustainability 

LAKEVILLE, MN – ITW EAE will be showcasing its latest developments at IPC APEX, April 9 - 11 in Anaheim. The ITW EAE booth #2327 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

Camalot will be demonstrating their Advanced Tilt and Rotate option on the Prodigy dispensing system. This innovative and patented feature reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.

Electrovert wave solder will feature the new Deep Wave option on the Electra wave soldering system. The new Deep Wave option offered by Electrovert provides the ability to pump up to a 20 mm wave height. The deep wave option overcomes the challenges associated with deep pockets and masking and provides a wave depth necessary to achieve topside hole fill. Electrovert will also feature the new Heavy-Duty Finger Conveyor option which is designed to address the increasing demands of PCB production in terms of weight, throughput capability and process flexibility.

Electrovert Cleaners will feature the NEW Matrix style manifold with Intermix spray technology. Electrovert Cleaners will feature the NEW Matrix style manifold with Intermix spray technology. The new manifold design will allow for manual or automated adjusting the height of the nozzles for increased cleaning performance without any increase in energy consumption. Higher efficiency of energy transfer at the board allows for cleaning under low stand-offs and heavily populated boards. Prepared to meet the evolving demands of future cleaning challenges, this new Electrovert Cleaning technology is ready to effectively tackle tomorrow’s demands.

MPM will conduct live demonstrations on the Momentum II Elite printer. Elite family has the industry leading accuracy, cycle time, and reliability, and its advanced technologies and features bring the benefits of versatility and flexibility, quality and throughput, ease of use. One machine does it all!

Vitronics Soltec will feature the ZEVAm+ Selective Soldering solutions with the patented Bridge Prevention Technology acts as a hot nitrogen knife to prevent bridging for small pitch up to 1mm (40mil) pin to pin distance even with longer leads and increased drag speed. This design is only feasible with the design freedom of 3D metal printing technology. Additionally, the ZEVAm+ Selective Soldering machine accommodates larger board sizes, supporting dimensions up to 510mm x 510mm (20 x 20 inches). This modification is specifically aimed at meeting the needs of high-mix, low-volume manufacturers, with a particular focus on industries like automotive. The growing demand for electronic vehicles is driving an increased need for larger board sizes in manufacturing processes.

Vitronics Soltec will feature Centurion Reflow Oven with True N2 to Air Switching. The True N2 to Air Switching feature offers versatility and convenience, allowing users to seamlessly switch between nitrogen and air atmospheres with the push of a button. This capability ensures optimal cleanliness of the reflow oven tunnel, where operating in air or nitrogen mode. In addition to that, Idle Mode demonstrates Vitronics Soltec’s commitment to sustainability by reducing power and nitrogen consumption when the machine is not in active production. This not only helps to minimize operating costs but also algins with environmental initiatives aimed at conserving resources.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Dallas Expo & Tech Forum taking place on March 19 at the Plano Event Center in Plano, Texas. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Dallas Expo & Tech Forum on March 19th, or visit www.aimsolder.com 

NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum, scheduled to take place Thursday, March 14, 2024 at the Cintermex Convention Center, Hall 2A in Monterrey, Nuevo León. KYZEN will showcase the new aqueous chemistry AQUANOX A4618 in addition to highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.

AQUANOX A4618 is a versatile and easy-to-use aqueous cleaning chemistry designed to clean the latest lead-free flux residues including Pb-free and no-clean fluxes, providing mirrored solder finishes. A4618 works exceptionally well at low temperatures and concentrations, benefits from an adjusted stabilizer package, boasts a long tank life, and is safe for multi-pass applications.

KYZEN E5631J is a ready-to-use, cost-effective solution for removing raw solder paste from stencils in online and offline stencil cleaning processes. Proven compatible with common stencils, cleaning equipment, and printer manufacturers, E5631J quickly and efficiently cleans all types of raw solder paste to ensure every print counts. For understencil wipe applications, CYBERSOLV C8882 is a solvent-based cleaning fluid designed to clean solder paste, uncured SMT adhesive, and flux residue from stencils, misprinted PCBs, stencil tools, and printing squeegees.

For more than 30 years, KYZEN has developed innovative chemistries to work hand-in-hand with your cleaning process. Chemistries including AQUANOX A4618 and stencil cleaners like KYZEN E5631J and CYBERSOLV C8882 assist in ensuring your process is worry-free.

For more information, visit www.kyzen.com