MILWAUKIE, OR – ECD announced today that it is continuing its engineering department expansion and has hired a software and manufacturing engineer, further bolstering its team as it accelerates current product line enhancements and NPI initiatives.

Nicholas Chase, Senior Software Engineer, comes to ECD with an impressive decade-long career, which includes software engineering experience at EDA companies Mentor Graphics Corporation (now Siemens EDA) and, most recently, Synopsys, Inc. He has a strong focus on sound design principles, continuous improvement, and has broad programming language proficiency. At ECD, Chase’s responsibilities entail driving development process efficiency, ensuring product software provides an intuitive and responsive user experience, and implementing robust testing procedures. He has already completed a significant project for ECD’s Baking Division with the integration of food safety KillStep Calculator functionality into the new touchscreen M.O.L.E.™ EV6 thermal profiling hardware. Chase holds a B.S. in Software Engineering from Oregon Institute of Technology.

Manufacturing Engineer Rahul Bilakanti oversees production and quality for ECD’s in-house manufacturing operation, which produces M.O.L.E. thermal profilers, SmartDRY™ desiccant cabinets, soldering machine verification pallets, and baked goods and oven sensors. Since joining the company, Bilakanti has contributed to manufacturing waste reduction through the use of 3D-printed fixtures, is leading the implementation of digitized manufacturing processes to streamline workflows, and is focused on improving production efficiency through collaborative DFM procedures. Bilakanti’s previous experience includes quality and manufacturing engineering positions at Abbott Labs and Japan Aviation Electronics’ Automotive Group. He graduated magna cum laude from the University of Southern California, where he earned a B.S. in Biomedical Engineering.

Speaking about the engineering staff growth, ECD President Tara Fischer says, “We are launching new products at an unprecedented pace, with three M.O.L.E. EV-series thermal profilers developed and commercialized within the last year,” she explains, underscoring the company’s ambitious five-year R&D roadmap. “So far, our team has executed our strategy perfectly. Nick and Rahul bring fresh eyes and outstanding credentials to our engineering department and have already been instrumental in our success. We are thrilled to have them on board!”

Chase and Bilakanti began their roles at ECD in November 2023. They are based in the company’s Milwaukie, OR headquarters.

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 19, 2024 at Plano Event Center in Plano, TX. The KYZEN Clean Team will provide information about AQUANOX A4618 and the KYZEN Process Control System (PCS) during the event.

Concentrations of AQUANOX A4618, KYZEN’s newest game-changing cleaning solution, can be effectively monitored and controlled by the KYZEN Process Control System (PCS) to provide proven and cost- effective options in electronics cleaning processes.

AQUANOX A4618 is a groundbreaking aqueous cleaning chemistry designed to address the challenges of cleaning contemporary lead-free flux residues, while achieving mirrored solder finishes. A4618 has an extended tank life and excels at lower concentrations and temperatures to clean all flux types including no-clean and Pb-free residues.

The KYZEN Process Control System controls, monitors and automatically reacts to the dynamic changes in wash concentrations. KYZEN PCS remains the only complete concentration monitoring and control system in the world and is backed by 20 years of continuous improvement by KYZEN.

For more than 30 years, KYZEN has developed innovative chemistries that work effectively with a variety of cleaning processes and challenges. The KYZEN PCS and solutions like AQUANOX A4618 combine to create an efficient and worry-free process.

For more information, visit www.kyzen.com 

CLINTON, NY – As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 18‒21, in Fountain Hills, AZ.

Indium Corporation’s proven SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporation’s newest jetting solder paste, PicoShot® NC-6M, is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6 nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

To learn more about Indium Corporation’s innovative solutions for HIA and SiP, visit our experts at booth #56 at IMAPS Device Packaging Conference or online at indium.com/HIA

DALLAS, TX ― ROCKA Solutions is proud to announce its partnership with SCS (Static Control Solutions), the largest manufacturer of Static Control products in North America. As distributor for SCS products, ROCKA Solutions expands its portfolio to offer comprehensive Static Control Solutions to its customers.

SCS is a full-service provider dedicated to diagnosing ESD events and preventing damage to sensitive components caused by electrostatic discharge (ESD). With a commitment to innovation and quality, SCS offers a wide range of products designed to meet the diverse needs of industries reliant on static control measures.

Founded in 2015 following the acquisition of the 3M Static Control business by Desco Industries, Inc., SCS has since become a vertically integrated manufacturer with control over the entire supply chain. From raw materials to finished products, including specialty films and bags produced at its Sanford, NC facility, SCS ensures the highest standards of quality and performance.

The acquisition of Credence Technologies in 2006 further strengthened SCS's capabilities, leading to the development of high-end monitoring equipment for ESD control compliance. This equipment forms the cornerstone of the SCS Static Management Program (SMP), enabling electronic manufacturers to monitor ESD control compliance in real-time and improve product quality, production yields, and reliability.

"We are excited to partner with SCS to offer our customers access to industry-leading products and technologies that enhance their ESD control programs," said Rodrigo Cacho, President & CEO at ROCKA Solutions.