NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce its participation in the upcoming 2024 IPC APEX EXPO, scheduled to be held April 9-11, 2024 at the Anaheim Convention Center in California. As an exhibitor in Booth 4237, KYZEN will spotlight the powerful combination of Chemistry and Control, with a focus on its cutting-edge products, AQUANOX A4618 and the new KYZEN ANALYST 2.

The KYZEN ANALYST 2 , building on the success of over 250 installations, demonstrates KYZEN’s commitment to excellence in on-device data analysis. This advanced system incorporates customer feedback for enhanced performance and utilizes sonic velocity technology for real-time concentration measurement. Unlike other sonic velocity instruments, the ANALYST 2 provides more precise measurements by directly measuring concentration, offering fast and stable readings independent of the liquid's conductivity, color, or transparency. With a 0.1% resolution, the ANALYST 2 is compatible with over 60 cleaning solutions, extending its utility beyond KYZEN chemistries.

The ANALYST 2 seamlessly integrates into electronics cleaning processes, enabling the effective monitoring and control of AQUANOX A4618. This groundbreaking aqueous cleaning chemistry is specifically designed to tackle the challenges of cleaning contemporary lead-free flux residues, including no-clean residues, while delivering impeccable, mirrored solder finishes. A4618 offers an extended tank life, outstanding materials compatibility, and high efficacy at lower concentrations and temperatures, making it a game-changer in electronics cleaning processes.

"The KYZEN team is excited to showcase our latest innovations at the IPC APEX EXPO 2024, emphasizing the synergy of Chemistry and Control," said Sherry Stepp, Global Marketing Manager at KYZEN. "The ANALYST 2 and AQUANOX A4618 represent our commitment to delivering proven and cost-effective solutions for the evolving needs of the electronics industry." Visit KYZEN at Booth 4237 to experience firsthand the Chemistry and Control innovation that is shaping the future of electronics cleaning.

For more information, visit www.kyzen.com 

OXFORD, CT – MIRTEC, ‘The Global Leader in Inspection Technology,’ will showcase its complete line of 3D AOI and SPI Inspection Systems at Booth #2100 during the 2024 IPC APEX EXPO scheduled to take place April 9-11, 2024, at the Anaheim Convention Center. “MIRTEC will feature a total of seven systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry including two new state-of-the-art 3D AOI Solutions,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division.

MIRTEC unveils its ‘Groundbreaking’ ART Hybrid 3D AOI System

At APEX 2024, MIRTEC will unveil the All-New ART Hybrid 3D AOI System. Heralded as the World's first 75MP Multi-Camera / Full HD Resolution 12 Projection 3D AOI System, ART introduces a paradigm shift in inspection technology. Leveraging MIRTEC's exclusive 12 Projection Digital Blue Moiré Technology and five 15MP CoaXPress Color Cameras, the ART system specializes in inspecting reflective objects, particularly solder joints in high-end electronics manufacturing industries like automotive electronics, aerospace, and defense. The ART system overcomes challenges faced by conventional 3D AOI systems, ensuring reliable 3D inspection results even on highly reflective surfaces.

The ART system's innovative approach involves complementary image acquisition of its five 15MP cameras. In scenarios where one camera faces light saturation due to reflective surfaces, the system seamlessly utilizes the data from the other cameras to restore precise 3D shape images. This revolutionary design allows the system to precisely measure 3D data at the very point where solder meets the component terminals. This has long been a challenge for conventional 3D AOI systems. Instead of providing REAL 3D Data, competitive systems with simply ‘fill-in’ absent data using software algorithms. This unique capability to accurately measure and characterize solder joints and reflective surfaces sets ART apart in the industry.

MIRTEC introduces TAL 3D SCAN for 30% Increased Productivity

MIRTEC will display two MV-6 OMNI 3D AOI machines at APEX 2024. The first system will feature a specialized 3D Laser Scanner attachment called TAL 3D SCAN. This revolutionary design integrates directly into the PCB transport system of the MV-6 OMNI for precision 3D inspection of tall components prior to transport into the MV-6 OMNI System. The attachment scans waiting PCBs on the first stage while the MV-6 OMNI processes PCBs on the second stage. This innovative approach provides a 30% increase in productivity for mixed THT-SMT PCB manufacturing.

The second MV-6 OMNI machine will showcase a CXP-12 data transfer interface (CoaXPress 2.0), providing double the data transfer rate for lightning- fast processing speeds.

GENESYS-CC AI Based Conformal Coating AOI Series

MIRTEC’s Award-Winning GENESYS-CC AOI machines are configured with MIRTEC’s Exclusive 15MP CoaxPress Camera Technology which is the highest camera resolution among conformal coating AOIs on the market. This system ensures accurate and rapid Conformal Coating Inspection capable of measuring coating thickness from 10μm to 1,000μm. The optional flip conveyor enables double-sided PCB inspection without an external flipper.

MV-3 OMNI Desktop 3D AOI Series

MIRTEC’s Award-Winning MV-3 OMNI Desktop 3D AOI Series features our exclusive OMNI-VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems.

MIRTEC’s 12 Projection Digital Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-3 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System and Multi-Function AOI/SPI Fusion Technology. Without question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine ‘On the Planet!’

MS-11e 3D SPI Series

MIRTEC’s Award-Winning MS-11e 3D SPI Series features our exclusive 15MP or 25MP CoaXPress Camera Technology, providing enhanced image quality, superior accuracy, and incredibly fast inspection rates. The MS-11e 3D SPI is also available with a cost-effective 4MP Camera Link option. These machines use Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient/excessive solder, shape deformity, shift of deposition and bridging. All MIRTEC 3D SPI machines are CFX compliant and feature upstream and downstream Closed Loop Feedback.

INTELLI-PRO AI-Powered Process Management Software Suite

MIRTEC’s INTELLI-PRO AI-Powered Process Management Software Suite, including the Total Remote Management System (TRMS), provides real-time remote monitoring and analysis for each system within the SMT production line. TRMS enhances production process management, and the Remote Debugging System (RDS) serves as the base application for the Optimum Inspection Tool (OIT), an AI assistant for the debugging process.

“IPC APEX has earned a reputation as North America’s largest and most comprehensive Electronics Manufacturing Exhibitions,” continued D’Amico. “We look forward to welcoming visitors to Booth #2100 to learn more about MIRTEC's innovative inspection solutions and to discover why MIRTEC is regarded as one of the most progressive and dynamic suppliers of inspection technology to the electronics manufacturing industry.”

OLDHAM, UK – With just four weeks remaining until the highly anticipated IPC Apex Expo 2024, Solderstar, a leading supplier of temperature profiling equipment for soldering processes, is gearing up to unveil its latest innovations. From April 9th to 11th, at Booth 2538 in Anaheim, California, Solderstar will introduce the newly launched Reflow Shuttle with O2 measurement module. This product promises to redefine soldering process optimization, offering manufacturers unparalleled control and precision.

The Reflow Shuttle O2 stands as a ground-breaking advancement in soldering process verification. It represents the first tool to integrate real-time oxygen (O2) measurement in parts per million (ppm), vibration levels in three axes, vacuum reading, temperature profiles, and conveyor speed onto a single platform. This consolidation of critical parameters helps manufacturers make informed decisions and optimize their reflow soldering processes with accuracy.

"Reflow soldering demands precision and control," said Mark Stansfield, CEO of Solderstar. "The Reflow Shuttle with O2 measurement module delivers detailed insights into critical parameters, equipping manufacturers with the tools needed for informed decision-making and process optimization.

“By consolidating measurement systems onto a single, robust platform, we're providing manufacturers with the knowledge to enhance quality and efficiency in their soldering operations with a single pass through the machine. We look forward to demonstrating this innovative solution at IPC Apex Expo and highlighting how it can benefit attendees' manufacturing processes."

Precise control over O2 levels is paramount in electronics manufacturing, as it directly impacts solder joint quality. The Reflow Shuttle O2 enables detailed monitoring of oxygen levels within each zone, allowing manufacturers to quantify nitrogen consumption and detect process issues quickly.

The Reflow Shuttle O2, with its seamless integration into existing reflow ovens, minimizes downtime during verification procedures while boasting a user-friendly interface that simplifies data collection for operators, facilitating prompt adjustments in case of anomalies. Its versatile design, with a specially engineered battery pack and Smartlink connector ensures continuous verification across multiple production lines without interruption. Importantly, the module allows for zone-by-zone analysis of oxygen levels throughout the reflow process. This provides manufacturers with granular insight to monitor oxygen content precisely and detect nitrogen leaks, thereby optimizing nitrogen consumption and maintaining process quality.

In addition to the Reflow Shuttle with O2 measurement module, Solderstar will feature its zero set-up SLX thermal profiler at the booth. The innovative SLX thermal profiler is designed to capture and analyze temperature profiles in various soldering processes.

Recognized for its accuracy and compact design, the SLX offers comprehensive data capture capabilities, further enhancing process control and product quality. It automatically detects connected test adapters and intelligently auto-configures the information, eliminating the need for manual set-up and saving valuable time.

Attendees are invited to visit Booth 2538 at IPC Apex Expo 2024 in Anaheim, California, to see the Reflow Shuttle O2 measurement module in action and explore Solderstar’s latest profiling equipment for reflow, wave, vapor, and selective soldering, including the zero set-up SLX.

REDDITCH, UK – In today's rapidly advancing electronics manufacturing landscape, achieving zero defects and maintaining stringent quality control standards throughout production processes are paramount. The precision alignment and attachment of components, particularly with flex circuits, can pose significant challenges that demand innovative solutions.

Recognising the need for precision and repeatability in electronics production, May & Scofield, designer and manufacturer of electronic controls and systems, turned to Altus Group, a leading capital equipment distributor in the UK and Ireland. Faced with challenges in their existing manual soldering methods, they sought a solution capable of meeting the stringent requirements for accuracy and consistency integral to their operations.

For May & Scofield's customer, zero hand soldering was mandatory. "We had an extremely challenging application of precisely attaching flexi circuits to rigid PCBs, where manual soldering was not permitted by our prestige automotive customer," said Nuno Goncalves, May & Scofield Production Manager.

After reviewing the challenge, Altus recommended Promation's Quick 9434 robotic soldering platform as the ideal solution. The Quick 9434 features a 4-axis configuration with a teach pendant for intuitive programming. It utilises Promation’s advanced hot iron system, rapidly achieving temperatures up to 500°C. A closed-loop sensor enables exceptional thermal stability and accuracy with the solder wire feeder, utilising fine-toothed gears to feed and perforate solder. This maximizes flux core outgassing to minimize solder splashing for optimum quality.

Joe Booth, CEO of Altus Group said: "We're pleased to have assisted May & Scofield with advanced technology to enhance their manufacturing processes. The Promation Quick 9434 has made a difference in their production, providing precision and reliability in their soldering process.

“With minimal operator involvement, it streamlines operations while optimising resources. May & Scofield's successful adoption of the Quick 9434 demonstrates its effectiveness in overcoming manual limitations, ensuring consistent, high-quality results."

By successfully implementing Promation's Quick 9434 system, May & Scofield has automated the delicate process of flex circuit soldering, effectively addressing their complex manufacturing challenge. The system's advanced technology and precision control capabilities have overcome the limitations of manual soldering, efficiently handling fragile components. Its advanced programming and process monitoring also ensure reliable and repeatable solder joint quality.