ANN ARBOR, MI – Aven is proud to announce that Hanwha Techwin Automation Americas has integrated its MicroVue Video Inspection Machine into its Center of Excellence. This cutting-edge technology allows prospective clients to review and inspect brand new PCBs up-close, providing enhanced insight into the quality and precision of Hanwha's automation solutions.

Located in Cypress, CA, the Hanwha Center of Excellence serves as a showcase for the company's fully functional equipment, offering live demonstrations. With the addition of the MicroVue Video Inspection Machine, clients can now closely examine fully populated and functional PCBs with unprecedented clarity and detail.

Brian O’Keeffe, Engineering Manager at Hanwha Techwin, commented, "Our customers are now getting a much better view of the final products coming out of the pick-and-place machines, thanks to the MicroVue. It has greatly enhanced our inspection capabilities and allowed us to showcase the exceptional quality of our automation solutions."

The MicroVue boasts powerful features, including up to 110x magnification, allowing for close inspection of solder joints, Foreign Object Debris (FOD), and other critical inspection points. Equipped with a built-in screen and HDMI output, the MicroVue enables easy viewing on external monitors of any size or even overhead projectors for large audience demonstrations.

A standout feature of the MicroVue is its 360-degree viewer accessory, which provides users with a comprehensive "fly around" view of individual components without the need to manually rotate the PCB. This innovative accessory streamlines the inspection process and ensures thorough examination from every angle.

As a leading global provider of precision manufacturing and technology solutions, Hanwha Techwin Automation Americas is renowned for its innovative approach and cutting-edge technology. Hanwha Techwin's revolutionary technologies redefine the landscape of PCB assembly, making it possible to produce more in less time and space, with reduced investment. More information is available at www.hanwha-pm.com.

To see the MicroVue in action, viewers can watch the demonstration video on Aven's YouTube channel at https://www.youtube.com/watch?v=PBMMxx05HJ8. More information about the MicroVue Video Inspection Machine can be found on the Aven website at www.aventools.com

CLINTON, NY – Indium Corporation Technical Support Engineer, CSMPTE, Thuy Nguyen will present at the SMTA Rocky Mountain Expo on May 16 in Aurora, Colorado. The presentation, Exploring Alternative Solder Alloys and Their Beneficial Attributes, will examine alternative alloys with enhanced reliability performance.

As the industry continues to move towards reducing costs in components, substrates, and energy consumption by lowering soldering temperatures, alternative solder alloys are explored to follow this trend. Developments of a low-temperature alloy and/or high-reliability alloy are created through a patented mixed alloy technology when the traditional SAC305 alloy isn’t enough.

“These alternative solder alloys offer enhanced reliability in drop shock performance, thermal cycling, and creep fatigue,” said Nguyen. “Both alloys demonstrate similar or better characteristics than SAC305. We can use this knowledge to our advantage when exploring other alloy options.”

As a Technical Support Engineer, Thuy Nguyen provides leading-edge technical support to customers and potential customers in the Southwest U.S. and the Rocky Mountain region. She is responsible for resolving complex solder process challenges. She also assists customers with optimizing their use of Indium Corporation’s soldering materials and offers training. She is based at Indium Corporation’s global headquarters in Clinton, N.Y.

Thuy joined Indium Corporation in 2015 and has held roles in quality, R&D, and manufacturing during her time with the company. She has contributed to multiple large-scale projects and assisted in implementing new processes and training materials. Thuy holds a bachelor’s degree in chemistry from Utica College. She is also a Certified SMT Process Engineer (CSMTPE).

WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and Polar Semiconductor. The incentives, which are part of the CHIPS and Science Act, will support the expansion of Polar Semiconductor’s chip production capabilities in Minnesota, allowing Polar to double its U.S. fabrication capacity of sensor and power chips within two years and serve diverse market segments. As part of the announcement, Polar Semiconductor will also transition to become a U.S. majority-owned commercial foundry.

The Commerce Department previously announced incentives for Micron, Samsung, TSMC, Intel, GlobalFoundries, Microchip Technology, and BAE Systems.

“Today’s announcement will help Polar Semiconductor expand and innovate its production capabilities, enabling the company to better supply crucial U.S. industries like automotive, aerospace, defense, and medical devices. These incentives will continue to advance the critical priorities of the CHIPS and Science Act, bringing more semiconductor production, jobs, and innovation to U.S. shores. We commend Polar for its significant U.S.-based investments and applaud the U.S. Commerce Department for working to keep the CHIPS Act on track for success. We look forward to continuing to work with leaders in government and industry to ensure the CHIPS Act continues to reinvigorate U.S. chip manufacturing and research and development.”

The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced more than 80 new projects across 25 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 56,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

An SIA-Boston Consulting Group report released last week projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032, ranking second only to Taiwan (31%).

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Upper Midwest Expo & Tech Forum taking place on June 4 at Union Depot in St. Paul, Minnesota. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Upper Midwest Expo & Tech Forum on June 4th, or visit www.aimsolder.com