Press Releases
SAN JOSE, CA ― SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.
In response to the escalating demands for heightened product reliability and safety in automotive electronic components, SHENMAO proudly presents comprehensive solutions tailored to meet the specific needs of the automotive electronics industry.
SHENMAO will introduce the PF918-P250A Thermal Fatigue Resistance No-Clean Lead-free Solder Paste, meticulously formulated with the groundbreaking SHENMAO Sn/4Ag/3Bi Alloy. This innovative alloy is engineered for high thermal impact reliability, ensuring the longevity of electronic products with stringent reliability requirements. Notably, it excels in voiding performance and printability, mirroring the melting point of SAC305 for seamless integration into existing SAC305 reflow profiles. With its cutting-edge flux design, voiding is effortlessly controlled to less than 10 percent.
Furthermore, extensive Board level thermal cycling tests, utilizing an actual automotive IC product, reveal that the thermal cycling life of PF918 surpasses that of the SAC305 alloy, doubling its longevity. PF918-P250A enhances thermal reliability performance by a minimum of 30 percent, demonstrating superior mechanical shock resistance compared to typical solder alloys like SAC305 and SAC405. This solder paste is ideal for various applications, including consumer electronics, high-power components, servers, and automotive electronics.
Supplementing this advanced offering is the PF606-P250 No-Clean Lead-free Solder Paste, featuring the widely used Sn/3Ag/0.5Cu Alloy. PF606-P250 stands out with its impressive solderability, printability, and voiding performances, while remaining compliant with RoHS, RoHS 2.0, and REACH standards.
For those prioritizing water-soluble options, the PF918-PW216 Thermal Fatigue Resistance Water-Soluble Lead-free Solder Paste is specially designed for water cleanability. Formulated with the newly designed high-reliability lead-free alloy (Sn/4Ag/3Bi), it achieves tensile strength performance 1.4 times higher than typical SAC305 alloys. Its innovative flux design ensures outstanding voiding performance, allowing it to seamlessly follow the regular SAC305 reflow profile. This solder paste caters to the needs of consumer electronics, servers, automotive electronics, and electronic products with extended service life and high reliability requirements. Also available is the PF606-PW216 Water-Soluble Lead-free Solder Paste, which adheres to the commonly used Sn/3Ag/0.5Cu Alloy, offering excellent cleanability, solderability, printability, and voiding performance.
In order to enhance the solder joint protection, SHENMAO has launched two specialized products with built-in epoxy. The Joint Enhanced Solder Paste (JEP) PF606-EP305 seamlessly combines the advantages of conventional solder paste and anisotropic conductive paste, delivering self-alignment and planar insulation. JEP facilitates soldering and joint encapsulation in one-step reflow, featuring a new epoxy-based solder material designed for very fine pad size (70 μm) soldering. It is compatible with various surface finishes, leaving a transparent residue, and requires no cleaning. SHENMAO’s JEP is eco-friendly, boasting both lead-free and halogen-free attributes, meeting J-STD and IEC standards.
Finally, the SMEF-Z52 Active Epoxy Flux is designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. The activator eliminates solder balls, ensuring smooth solder joints. Post-reflow, the epoxy flux residue cures to provide mechanical support to the joint. Epoxy clad in solder joints after curing shields and strengthens joints by 30 percent compared to conventional rosin flux. This newly designed flux requires no cleaning and exhibits exceptional compatibility with molded underfill (MUF) and capillary underfill (CUF). SMEF-Z52 is well-suited for various IC packages, including system-in-package (SIP), wafer-level-package (WLP), and flip-chip technologies.
SHENMAO’s advanced pastes and fluxes are compliant with RoHS, RoHS 2.0, and REACH standards.
Visit SHENMAO at the 2024 IPC APEX EXPO to experience firsthand the innovative solder technology driving the future of automotive electronics manufacturing.
For more information, please visit www.shenmao.com
CHICAGO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at IPC APEX Expo 2024 in Anaheim, CA USA from April 9-11. On booth #1642, Saki will be showcasing its unique range of automated inspection solutions including AOI and the award-winning X-ray Automated Inspection System (AXI).
Increasing demand for Saki's advanced total solutions for in-line automated inspection for SMT processes in the US-market have further strengthened Saki’s strategic focus and commitment to the Americas region. Significant expansion of the sales representatives’ network and technical sales support infrastructures will be introduced at the electronics manufacturing industry’s largest North American trade show. Furthermore, visitors to booth #1642 will discover the high-speed, high-precision automated inspection capability of Saki's latest hardware and software.
The Saki technology team will present the company’s latest equipment lineup for high-speed, high-precision AOI and AXI in-line inspection:
AXI
3Xi-M110 - the industry's fastest automated X-ray inspection solution and winner of a Global Technology Award 2023.
AOI
3Di-LS3 - advanced AOI with powerful dome lighting feature and on-site camera module upgrade capability.
SPI / AOI
3Di-ZS2 - perfect for AOI inspection of extra-large PCBs featuring Saki’s rigid gantry and innovative Z-axis optical head control for improved accuracy. Saki's 3D-SPI and AOI systems share a single hardware and software architecture, allowing for complete compatibility. Interactive 3Di-ZS2 demonstrations at the booth with demonstrate the power of a streamlined operation.
In addition to its machine solutions, Saki will also present its versatile software suite which works with the equipment to form a total solution for quality inspection:
- QD Analyzer, Saki’s powerful SPC system, a BF2-Monitor for offline reviews and a Multi Process View (MPV) demo station will present Saki’s software strength that greatly improves process troubleshooting and determines root causes. These innovations will help clients increase automation to solve labor & resourcing issues, tackle skills shortages, improve productivity and achieve greater manufacturing quality and efficiency.
- One Programming function (reference exhibit) – Software system for batch operation and centralized management of SPI, AOI, and AXI on a line-by-line basis.
- AI Solutions (reference exhibit) – an introduction to Saki’s unique integration of AI functionality.
“The Americas’ manufacturing industry is of prime importance to Saki. We are expanding our specialist and dedicated team focused on delivering our world-class inspection solutions with world-class expertise and support,” said Craig Brown, General Manager, North America of Saki America. “We look forward to welcoming visitors to our booth in Anaheim to discuss all the latest developments in our equipment and software range.”
For more information about Saki visit www.sakicorp.com/en/
DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is excited to announce its participation in the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place on March 19, 2024, at the Plano Event Center. As a trusted partner in delivering cutting-edge solutions for leading electronic manufacturers, StenTech will be exhibiting its innovative stencil, tooling, and parts solutions that empower customer success.
“We take pride in our ability to provide customers with innovative solutions that drive success in their operations," said Greg Starrett, StenTech’s Director of Sales. "Our team is dedicated to pushing the boundaries of what's possible in stencil, tooling, and parts solutions, and we look forward to sharing our latest developments with attendees at the SMTA Dallas Expo & Tech Forum.”
StenTech has established itself as the largest multi-national SMT printing solutions provider, with a presence in 20 facilities across the United States, Mexico, and Canada. These strategically located facilities ensure localized expertise and quick turnaround solutions, providing customers with the convenience and efficiency they require in today's dynamic SMT landscape.
At the core of StenTech's success is its formidable team of over 35 experienced CAD designers and more than 250 production staff. This talented workforce, combined with state-of-the-art equipment and infrastructure, enables StenTech to deliver gold standard products with unmatched speed, precision, quality, and customer care.
Visit StenTech's booth at the SMTA Dallas Expo & Tech Forum to learn more about how its innovative solutions can empower success in your electronic manufacturing operations.
Download 2024 StenTech Brochure: https://www.stentech.com/thebuzz/StenTech_Brochure.pdf
For more information about StenTech and its comprehensive range of stencil, tooling, and parts solutions, please visit www.stentech.com
AUSTIN, TX ― ROCKA Solutions is excited to announce its participation in the upcoming 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. ROCKA Solutions will be exhibiting in Booth #432, where the company will highlight its expanded services in the USA and Canadian markets, along with showcasing top distribution brands.
With a strategic focus on growth and expansion, ROCKA Solutions is committed to further strengthening its presence in the USA and Canadian markets. At the IPC APEX EXPO, attendees can expect to learn more about ROCKA's comprehensive range of services, including SMT production supplies and distribution partnerships with leading brands in the industry.
Among the key highlights at ROCKA's booth will be the display of ROCKA Manufactured SMT production supplies, renowned for their quality, reliability and performance. Visitors will have the opportunity to explore ROCKA's extensive product portfolio and discover innovative solutions tailored to meet the evolving needs of electronics manufacturers.
In addition to showcasing its in-house manufactured products, ROCKA Solutions will also feature a selection of top distribution brands at its booth. Attendees can expect to see products from industry- leading brands such as Zestron, Actnano, Weller, Indium, BT Mix and more.
As an added highlight, Justin Worden, VP Sales & Marketing at ROCKA, will be hosting the WNIE interviews during the event. Attendees can look forward to insightful discussions and valuable insights from industry experts.
Visit Booth #432 at the IPC APEX EXPO to learn more about how ROCKA Solutions can enhance your manufacturing operations and supply chain efficiency.
For more information about ROCKA Solutions, visit www.rockasolutions.com
GAINESVILLE, GA ― Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, will exhibit in Booth #1332 at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in Calif. The COT team will focus on its core product lines at the show:
- Standard Nozzles: COT’s catalog of products includes standard nozzles and tooling replacement parts for the top OEMs, including Fuji, Panasonic, Mycronic, Yamaha, Hanwha/Samsung, Juki, Hitachi, and more. The team at COT understands that customers often have more than just one OEM’s range of machines. Therefore, the company tries to offer as wide a range of SMT nozzles and consumables as possible so that you can keep your supplier bases to a minimum. Recent price restructuring also means more cost savings for customers. COT plans to showcase new SMT nozzle lines for the Yamaha YS and YRM machines with the HM / FM heads. Additionally, nozzles for Hanwha/Samsung HM and Decan series machines as well as the new Juki RS1 machines will be available.
- Custom Nozzles: COT has the experience and manufacturing flexibility to develop custom engineered solutions to satisfy your individual process requirements. With more than 31 years of experience on multiple machine platforms, COT’s team has the professional expertise to solve your pick-and-place issues! This includes special nozzles for LEDs, connectors, switches, push buttons, pins, clips, heavy, over-sized, and more. There is no limit to COT’s capabilities when it comes to automating your custom component processes.
- Component Handling Products: COT offers several styles of component handling trays based on industry proven specifications and the unique requirements of each product. These include the Stripfeeder Platform and the QWIKTRAY systems. Application requirements such as temperature and chemical exposure, manufacturing processes, mechanical and electrical constraints are factors that are combined with operation considerations including production volumes, build costs, total estimated usage and process control. From off -the-shelf kits to custom built tray products, rest assured that COT has the right fit for your next job.
- Automation Tooling Products: As a design and manufacturing company, COT specializes in developing solutions. The focus of the company’s development projects has been on improving the methods of assembly of printed circuit boards. Every aspect of this process can benefit from automation tooling. Customers come to COT with problems that they experience, such as having to hand place odd-form components, repairing worn/damaged feeders, or developing universal board supports, like the ezLOAD series. COT’s team sees every opportunity as a challenge to prove that they are capable of producing solutions at every level of the SMT assembly process, especially nozzles and tooling. The company will showcase its PCB custom Carrier system for AOI, Electrical Test, Cleaning, and other PCB assembly processing. The technology that COT has developed over the years has allowed the company to design and manufacture custom engineered tooling for any process in the SMT industry.
- Selective Soldering Nozzles: As selective soldering continues to become more popular in the electronics manufacturing industry, Count On Tools has realized the need for higher quality selective solder nozzles that can consistently apply flux and solder to component leads without disturbing nearby SMT components. Count On Tools custom selective solder nozzles assist to replace labor-intensive hand soldering while eliminating defects caused by wave soldering machines in the market’s most popular selective soldering equipment. Additionally, Count On Tools offers custom selective solder nozzles based on specific application requirements. This includes special wave form sizes and extended or shortened lengths. COT offers ACE, ESRA, Pillarhouse, and RPS selective solder nozzles.
Count On Tools holds and maintains current ITAR registration, 07FFL, 02SOT, and a first-class Quality Management System. For more information about Count On Tools’ products and services, visit www.cotinc.com
NORTHBROOK, IL – Impossible Objects proudly announces plans to exhibit at Apex 2024, scheduled to take place April, 9-11, 2024 at Anaheim Convention Center. The focus of this exhibition is the game-changing CBAM-25 industrial 3D printer, a true paradigm shift in high-speed, high-performance additive manufacturing.
CBAM 25: Step into the in the Future of 3D Printing Impossible Objects’ CBAM-25 3D printer marks a monumental leap forward in additive manufacturing capabilities. Setting new industry standards, this cutting-edge machine stands out as a true game-changer for electronics tooling (and more), boasting a remarkable fifteen-fold increase in speed compared to the fastest competition.
With the CBAM-25, a new era dawns for electronics tooling, one characterized by unprecedented speed and efficiency, in addition to all of the benefits of 3D printing that shatters traditional limitations. The first CBAM-25 will ship in Q2 2024, heralding a seismic shift in manufacturing processes. This groundbreaking innovation brings 3D printing to the forefront of volume tooling manufacturing, tearing down barriers and expanding the horizons of what can be achieved with advanced materials, exceptional mechanical properties, and superior tolerances.
Design and Manufacturing Renaissance
The CBAM-25 opens doors for engineers to design parts that are not only stronger but also lighter and more durable. Its high-performance composite materials, notably Carbon Fiber/PEEK, offer remarkable chemical and temperature resistance, along with mechanical properties that surpass those of many engineering plastics.
Carbon Fiber/PEEK components have proven to be an exceptional alternative for electronics tooling, as well as a wide range of additional applications, including, aerospace, defense, transportation industries, and beyond. “Our innovative 3D printer represents a quantum leap in additive manufacturing technology, enabling engineers and manufacturers to achieve feats previously considered impossible,” says Robert Swartz, Founder and Chairman of the Board at Impossible Objects.
“We are also committed to serving the global electronics manufacturing community as a premier tooling supplier, providing cutting-edge solutions for their evolving needs.”
Experience the future of 3D printing and discover how Impossible Objects redefines the boundaries of design and manufacturing.
Visit Impossible Objects at APEX 2024, booth #2715 or fill out a contact us form to get in touch with us directly and schedule a dedicated time slot to discuss your specific tooling needs.
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