CLINTON, NY – Indium Corporation Senior Area Technical Manager Jason Chou will present at the SMTA Taiwan Tech Forum on March 26 in Taoyuan City, Taiwan. Chou’s presentation will highlight the growing demand for high reliability and low-temperature solder solutions brought on by the rapidly developing electric vehicle (EV) and artificial intelligence (AI) industries.

The growing EV market is fueling demand for more sensors and power moderators. Devices used under the hood now require service temperatures up to 150°C, posing a challenge for traditional lead-free Sn-rich solder alloys, which are increasingly unsuitable for harsh environments. For AI applications, where High-Speed and High-Performance Computing (HPC) are paramount, the complexity of module packaging poses its own set of complications such as warpage-induced non-wet-opens.

Chou’s presentation will examine a novel, mixed-alloy solder technology that demonstrates the combined strengths of each constituent solder powder in the paste. This new system has proven to improve the thermal fatigue resistance of solder joints in harsh thermal cycling and thermal shock conditions. It has also been shown to reduce the reflow peak temperature from ~240°C (SAC305) to ~200–210°C.

“I believe that this new, award-winning mixed-alloy solder system provides an innovative solution to many of the challenges posed by the emergence of EV and AI technologies,” said Chou. “I look forward to sharing more about this cutting-edge solution with my industry colleagues at the SMTA Taiwan Tech Forum.”

As Senior Area Technical Manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.

ATLANTA – Koh Young, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, invites electronics manufacturers to see its innovative data-driven approach to measurement-based inspection. Join us for live demonstrations at booth 2112 from April 9-11, 2024, at the Anaheim Convention Center.

At our booth, visitors will learn about the latest inspection machines and smart factory offerings while discovering solutions designed to address the industry's toughest challenges. Joel Scutchfield, General Manager of SMT Operations and Director of Sales at Koh Young America, extends an invitation to our booth, accessible at https://www.linkedin.com/feed/update/urn:li:activity:7171854393045164033/

Scutchfield emphasizes, "This year, the Koh Young booth will showcase our commitment to advancing electronics inspection by integrating our award-winning solutions with AI-powered engines. From new hardware to enhanced software, we will feature the latest inspection machines for solder paste, components and joints, dispensed products, advanced packages, and even semiconductors. As a testament to our smart factory focus, our booth will include the ITW EAE (https://www.itweae.com) MPM Momentum II printer in our KPO Printer demonstration area. Additionally, we will showcase our connectivity to industry leaders like Panasonic Connect (https://na.panasonic.com/us/industries/manufacturing) in booth 2332 and ASYS Group (https://www.asys-group.com/en/) in booth 2414. Let us demonstrate how our data-driven approach can elevate your operation to new heights."

Koh Young is revolutionizing process improvement for electronic manufacturers by harnessing the power of AI tools. Discover the benefits of tools like:

• Smart Review 3.0 to minimize false calls and prevent escapes, while reducing operator subjectivity
• Koh Young Auto Programming (KAP) to simplify programming and expedited production
• KPO Printer and KPO Mounter for real-time process optimization and automated correction

These are just a few examples of the advancements you can explore during the show.

To learn more about how our solutions can enhance your quality, visit us at the IPC APEX EXPO in Booth 2112 at the Anaheim Convention Center in California. Register to attend the in-person conference and exposition at https://www.ipcapexexpo.org/. If you are unable to attend the show, explore our best-in-class inspection solutions on our regional website www.kohyoungamerica.com 

REDMOND, WA – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices will showcase device programming and security provisioning solutions delivering high-performance, configuration flexibility automated device programming systems with security provisioning and industry 4.0 integration capability to enable traceability, process analysis and two-way communication that improves factory efficiency and quality at the lowest total cost of ownership. Data I/O will demonstrate a 64% increase in programming performance on Lumen®X Programmers with VerifyBoost™, the PSV family automated device programming systems, SentriX® security provisioning platform and the ConneX® software application that enables Data I/O’s device programming systems to integrate into the connected factory at the IPC APEX Expo in booth #3107 in Anaheim, California from April 9 th – 11 th at the Anaheim Convention Center.

About LumenX Programming Platform & VerifyBoost

VerifyBoost delivers rapid verify performance up to 750 MBps High-speed Gear3 x 2-Lane support for UFS devices for a massive 4.5x increase in performance. This enables our customers to immediately leverage existing production capacity for significant throughput gains, reduce the total cost of programming by up to 39% and maximize their existing investment in Data I/O’s programming technology. High-throughput PSV programming systems using LumenX programmers with high socket capacity and VerifyBoost enable manufacturers to use one PSV system to program what previously required multiple systems to produce. Learn more about VerifyBoost for LumenX programmers at www.dataio.com/VerifyBoost 

About ConneX Service Software

Electronics manufacturers, focused on operational efficiency to drive down costs and increase production capacity, are expanding their smart factory initiatives to integrate offline pre- programming processes into their Manufacturing Execution Systems (MES). ConneX enables customers to directly integrate data programming and security provisioning inputs and outputs between a Data I/O PSV programming system and an external application such as MES systems and analytics or web dashboards via industry standard protocols, to enable traceability, process analysis and two-way communication that improves factory efficiency and quality. To show the power of ConneX, Data I/O will display an example of a factory monitoring application with samples of dashboards a customer can build by accessing key areas of data collected during the programming process including system status, availability, utilization, socket adapter usage statistics and more. Learn more about ConneX at www.dataio.com/Solutions/ConneX 

PSV7000

The PSV7000 is the world’s premier automated programming solution with speed, flexibility, fast changeover, and small parts handling to manage any job for the lowest total cost of ownership. Engineered for velocity and versatility, the PSV7000 combines industry leading robotics handling, the LumenX revolutionary programming technology for fastest device programming and highest socket density ideal for automotive applications. A comprehensive suite of process control software applications along with fiber laser marking and 3D co-planarity component inspection meets the demanding process requirements for automotive electronics applications and Industry 4.0 automation. Learn more at www.dataio.com/PSV7000 

PSV3500

The PSV3500 is the cost-effective entry point for high-quality automated device programming for low mix / high volume applications. Ideal for customers moving to automated pre- placement programming for the first time, the PSV3500 delivers trusted performance and reliability at an affordable price. The PSV3500 is ideal for customers setting up automated pre- placement programming for the first time.. Learn more at www.dataio.com/PSV3500 

SentriX Security Provisioning Platform with SentriX Product Creator

SentriX Security Provisioning Platform with SentriX Product Creator reduces the complexity inherent in defining security for mass production by an order of magnitude. SentriX delivers pre-configured security deployment profiles for the most popular IoT use cases such as cloud onboarding, secure boot, access control, device authenticity and others. OEMs can use the provided pre-defined use cases or customize their own security profile. Secrets and credentials input product definitions using SentriX Product Creator are protected in transport and at rest to a SentriX security provisioning system. The PSV7000 and PSV5000 systems are field-upgradable to support SentriX and secure provisioning. Learn more at www.dataio.com/sentriX 

Customers attending the IPC APEX Expo in Anaheim, California can visit Data I/O’s booth in booth #3107 to see product demonstrations including VerifyBoost for LumenX displaying up to 750 MBps performance, the ConneX Service Software with system monitoring dashboards, SentriX security provisioning platform and the PSV7000 and PSV3500 automated programming systems.

DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, will introduce the new StenTech BluPrint™ Chemical Vapor Deposited (CVD) Surface Treatment at the 2024 IPC APEX EXPO. This groundbreaking technology, designed to enhance SMT processes with unparalleled benefits for stencil performance, longevity, and overall assembly quality, will be showcased for the first time in Booth 1608 from April 9-11, 2024 at the Anaheim Convention Center in California.

The relentless drive to shrink components and circuit boards poses challenges in solder paste printing with laser-cut stainless-steel stencils. StenTech BluPrint™ CVD emerges as the premier solution in North America, aligning with the intricate demands of the semiconductor and EMS industry, backed by cutting-edge laser technology advancements.

StenTech BluPrint™ CVD Surface Treatment introduces a revolutionary method of depositing thin films onto a substrate by introducing chemical precursors into a reactor chamber, resulting in a solid material deposit on the surface. The consistency achieved across all areas distinguishes StenTech's CVD from traditional liquid spray processes, providing a resilient, virtually indestructible coating that ensures uniform printing with identical apertures.

Beyond consistent thickness, StenTech BluPrint™ offers exceptional thermal stability, chemical inertness, anti-stiction properties, a refined smooth surface finish, customizable characteristics, and unmatched print quality consistency. The process begins with plasma polishing, followed by the chemical vapor deposition, resulting in a smoother sidewall and enhanced corrosion resistance.

StenTech BluPrint™ stands out with its application at approximately 1000 times less thickness compared to existing alternatives, ranging from 3-5 micrometers versus 3 nanometers. Positioned as the practical choice for coating high-end SMT solder paste stencils, StenTech BluPrint™ promises noticeable enhancements in transfer efficiency, outperforming current nano-coatings, particularly in high-volume builds.

StenTech invites attendees to Booth 1608 at the 2024 IPC APEX EXPO to explore the StenTech BluPrint™ CVD Surface Treatment and experience firsthand its transformative impact on SMT processes.