DIRKSLAND, NETHERLANDS – VDL TBP Electronics has announced a significant leap in production capacity and operational efficiency with the acquisition of a cutting-edge ASMPT SMT assembly line, sourced through Partnertec. This strategic move is poised to meet soaring customer demand and reinforce the company's industry stature, while also fostering greater synergy with Rena Electronica. With the new assembly line becoming operational in May, VDL TBP aims to adapt more fluidly to market dynamics and enhance service delivery.
Strategic Investment for Enhanced Production
The decision to invest in the ASMPT SMT assembly line marks a pivotal moment for VDL TBP Electronics. It reflects not only a commitment to leveraging advanced technology for improved output but also an understanding of the critical role such investments play in maintaining competitive edge. This state-of-the-art equipment is designed to significantly upscale the company's manufacturing capabilities, ensuring that customer demands are met with efficiency and precision. By doing so, VDL TBP Electronics is set to solidify its position as a leader in the electronics manufacturing sector.
Meeting Customer Demand with Cutting-Edge Technology
The electronics industry is characterized by rapid innovation and evolving customer needs. VDL TBP Electronics' investment in the ASMPT SMT assembly line is a response to these challenges, enabling the company to boost its production capacity and meet the increasingly complex demands of its customers. The new assembly line incorporates the latest advancements in surface mount technology (SMT), which, as highlighted in a recent study, is crucial for enhancing the quality and reliability of electronic components through improved inspection techniques and failure analysis. This move not only enhances VDL TBP's operational efficiency but also ensures the production of high-quality, reliable products.
Enhancing Synergy and Market Responsiveness
The collaboration between VDL TBP Electronics and Rena Electronica is set to benefit significantly from this new investment. By incorporating ASMPT's advanced SMT assembly line, both companies can expect to see enhanced synergy in their operations, leading to more streamlined processes and improved product offerings. Moreover, the ability to respond more adeptly to changing market conditions signifies a strategic advantage. With this enhanced capacity, VDL TBP Electronics is better positioned to bring its assembly services to market more effectively, catering to the fast-paced demands of the electronics industry.
As VDL TBP Electronics embarks on this new chapter with the ASMPT SMT assembly line, the implications for the company and its partners are profound. This investment not only underscores a commitment to excellence and innovation but also sets a new benchmark for manufacturing efficiency in the electronics sector. As the assembly line becomes operational, the industry will keenly watch the ripple effects of this strategic move, anticipating the broader impacts on production quality, customer satisfaction, and market competitiveness. Through foresight and technological adoption, VDL TBP Electronics is charting a course for sustained growth and industry leadership.
WASHINGTON – The Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.
Integrated circuit substrates are a critical part of the technology stack that powers the microelectronics that make modern life possible. Semiconductors, substrates and printed circuit boards (PCBs) make up the stack that every electronic device needs to function.
PCBAA Executive Director David Schild said, “This is an important expansion of the work being done at the CHIPS program to reshore the industries we invented here in America but long ago offshored. To build a secure and resilient supply chain for all elements of the technology stack, we need a robust American capacity to manufacture all three: semiconductors, IC substrates and PCBs. That’s why we say ‘Chips Don’t Float’. The third element of the technology stack also needs government investment. We are calling on Congress to pass H.R. 3249, the Protecting Circuit Boards and Substrates Act, which would provide $3 billion to fund factory construction, workforce development and R&D along with a 25% tax credit for purchasers of American-made PCBs and substrates.”
PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is excited to announce its participation alongside Comtree at EPTECH Toronto, scheduled to take place Wednesday, April 17, 2024 at the Sheraton Parkway Toronto North. As trusted partners, representatives from Comtree will be on hand to engage with attendees and discuss Ersa's comprehensive range of solutions tailored for the electronics manufacturing industry.
A key highlight of Kurtz Ersa's offerings at EPTECH Toronto is its patented IR rework technology. This groundbreaking technology has earned a reputation for consistently delivering outstanding results, even in the most challenging rework applications. With a proven track record of benefiting countless users worldwide, Ersa's IR rework systems have become synonymous with reliability, efficiency, and unmatched performance. Their remarkable cost-to- performance ratio makes them the preferred choice for electronics manufacturers seeking superior rework solutions.
Visitors to the event can expect to explore a diverse range of Ersa's rework and soldering systems, all of which showcase the brand's signature superiority and adaptability. Kurtz Ersa has set the benchmark for high-end reflow ovens. Notably, the HOTFLOW series boasts impressive energy savings of up to 25 percent, along with a remarkable 20 percent reduction in N2 consumption.
Comtree represents Ersa throughout Canada. For more information about Comtree, e-mail Ernesto Provenzano at ernesto@comtreeinc.com, Graham Gibson P.Eng. at graham@comtreeinc.com, or call 905 673-7777.
For more information about Kurtz Ersa Inc., visit www.ersa.com
BOHEMIA, NY – Q Source proudly highlights its partnership with Gentex Corporation, a global leader with more than 125 years of innovation in personal protection and situational awareness solutions.
Gentex Corporation’s commitment to continually reinvesting in its company and capabilities has resulted in significant company growth and groundbreaking innovations over the past century. Gentex Corporation remains dedicated to providing top-tier solutions to its customers.
Gentex Corporation offers a range of industry-leading brands, including PureFlo. The PureFlo PAPR (Powered Air Purifying Respirator) is an all-in-one NIOSH-approved air-purifying protection system designed for the most demanding pharmaceutical and clean room environments. The PureFlo 3000 is a modular head borne PAPR that does away with the need for hoses and belts, virtually eliminating snag hazards. The PureFlo PAPR delivers best-in-class integrated respiratory, eye, and face protection against hazardous airborne particulates.
As a PureFlo distributor for Gentex Corporation, Q Source is committed to delivering the innovative solutions to its customers across various industries. By partnering with Gentex Corporation, Q Source ensures that its customers have access to the latest advancements in personal protection. For more information about Q Source's product offerings, including Gentex Corporation’s PureFlo PAPR please visit www.qsource.com
WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the decision by the World Trade Organization (WTO) to renew the Moratorium on Customs Duties on Electronic Transmissions during the 13th Ministerial Conference (MC13) in Abu Dhabi.
“In terms of high drama, once again, the WTO Ministerial Conference didn’t disappoint. Thankfully, trade negotiators were able to overcome obstacles to deliver an extension of the Moratorium, which has been a cornerstone of the digital economy – enabling semiconductor supply chains, fueling economic growth and innovation across the globe, and helping to bridge the digital divide.
“While we celebrate this outcome, we recognize that more needs to be done to educate businesses and policymakers on the importance of the Moratorium. The semiconductor industry supports making the Moratorium permanent, which will provide the stability and predictability necessary for sustained innovation and growth in the digital age. We stand ready to work with the government and industry stakeholders to achieve this goal.”
CLINTON, NY – With more than five million electric vehicles (EVs) on the road with its materials and nearly a decade of experience in the market, Indium Corporation® is proud to feature its innovative Durafuse® solder technology alongside its Rel-ion™ portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, April 9-11, in Anaheim, California, U.S.
Among its featured products, Indium Corporation will showcase its lead-free Durafuse® technology and industry-proven Indium8.9HF solder paste series:
Some of the additional Rel-ion and high-reliability products for power electronics featured at IPC APEX will include:
To learn why Indium Corporation is trusted by top EV and power electronics manufacturers across the globe, visit our experts at booth 4227 or at www.indium.com