Products
Kyocera AVX 9258-100 Series spring-finger board-to-board compression contacts provide full connector functionality in a miniature, low-profile, single-contact form factor that supports flexible PCB placement.
Indium's Heat-Spring HSx thermal interface material is designed for large area dies with warpage of 200 microns or more.
Press Releases
- NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
- CE3S and Desco Announce Upcoming ANSI/ESD S20.20-2021 Training Series for ESD Professionals
- ViTrox Americas Appoints ArgoZeta as Sales Partner for the Mid-Atlantic Region
- Altus Group Expands Service Team with Addition of Experienced Engineer