Products
The TR7600FB SII is a 3D automated X-ray inspection system. Optimized for specialized substrates, fine-pitch BGAs, multilayer boards and system-in-package (SiP) devices. Incorporates a newly developed X-ray imaging structure that allows the X-ray tube to operate in close proximity to the board surface without structural interference. This architecture supports detailed inspection of critical components requiring precise internal visibility. Powered by TRI’s AI Ecosystem, combining AI-driven inspection algorithms with metrology-based measurement capabilities. Supports AI Smart Programming.
PF606-P266J is a solder paste developed for high-speed jet dispensing applications in advanced electronics manufacturing. Designed for non-contact solder deposition. The formulation meant to maintain process stability across a broad range of jetting parameters. The solder paste uses a halogen-free flux system that supports strong wetting behavior and low residue levels. PF606-P266J supports ultra-fine solder powders from Type 5 through Type 7. The product is available in multiple alloy options, including SAC305, high-reliability alloys for automotive and industrial electronics and low-temperature alloys.
The VALID SL in-circuit and functional test system is designed for high-channel-count testing in demanding electronics manufacturing environments. Introduces a cable-free architecture with new 128-channel scanner cards, supporting configurations exceeding 4,480 channels for complex test requirements. Offers an expanded test area with both single-stage and dual-stage configurations and supports multi-job operation through Seica’s latest VIVA software interface. Integrates streamlined internal hardware access. Built to support scalable automation and intelligent test strategies for high-volume and high-reliability applications.
Press Releases
- RBB Welcomes Shawn Myers as Engineering Project Manager
- ECIA’s Market Sentiment Index Average Hits Five-Year High in June Industry Pulse Survey
- Incap Slovakia invests in cleanroom capability to support semiconductor manufacturing requirements
- Orbit Technologies accelerates growth and doubles production capacity with Europlacer iineo placement machine