Products
Yamaha Robotics SMT Section has released an upgraded version of YSUP-PG, its program generator designed to accelerate new product introduction (NPI) for surface-mount lines. Features an enhanced user interface and advanced automation that streamlines data conversion from popular EDA formats such as ODB++, enabling faster generation of mounter and inspection programs. Real-time component-placement image updates, clickable task lists and automated workflows. Enables AOI libraries to be created directly from CAD data, allowing mounter and inspection programs to be developed in parallel. Enhanced Gerber image and CAM conversion tools produce accurate simulated board images, with built-in compositing that automatically calculates PCB layer images. By combining Gerber and CAD data, the software digitally determines push-up pin positions.
Seika Machinery's Nippon Nozzle division supplies precision spinnerets, spunlace jetstrips, film dies and inspection systems to North American manufacturers. Known for machining tolerances down to ±0.001 mm. The product line includes wet, dry, air-gap and melt spinnerets; hydroentanglement jetstrips; tailored film extrusion nozzles; and ultrasonic cleaning and automated measurement systems. All components are produced through in-house alloy melting, precision machining, polishing and inspection to ensure consistent fiber and film flow.
Solderstar debuts complete vapour phase verification suite. The solution pairs the VP10 Thermal Profiler with the VP Shuttle Verification Fixture, enabling manufacturers to validate both machine performance and board-specific behaviour with precision. The VP10’s low 37 mm profile and 10 measurement channels provide broad thermal coverage, minimising blind spots and reducing profiling runs. Integrated with Solderstar’s SLX datalogger, the system supports vacuum-stage operation and extended processes while maintaining accuracy. The VP Shuttle Fixture further enhances control, testing oven temperature uniformity across 12 strategic points to distinguish between machine variations and PCB-specific characteristics. They form a unified verification system for qualification, calibration and ongoing production checks.
Press Releases
- Datest Launches 2026 Webinar Series: Because Electronics Testing Shouldn’t Be Guesswork
- ASE CEO Tien Wu to Keynote IEEE ECTC 2026 in Orlando
- Nordson Electronics Solutions Announces Expanded Distributor Partnership with Assembly Products, Inc. a subsidiary of Blackstone Global, Across the United States and Canada
- MicroCare Appoints Uwe Wanner as Director of Research & Development