Products
Shenamo PF925 near-eutectic solder is said to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics.
Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.
Cybord Real-Time Interception (RTI) visual AI-powered software is said to prevent defective components from being assembled on printed circuit board assemblies (PCBAs) in real time.
Press Releases
- NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
- CE3S and Desco Announce Upcoming ANSI/ESD S20.20-2021 Training Series for ESD Professionals
- ViTrox Americas Appoints ArgoZeta as Sales Partner for the Mid-Atlantic Region
- Altus Group Expands Service Team with Addition of Experienced Engineer