Master Bond UV15-7HP low viscosity, easy to apply, one-part, UV curable adhesive cures rapidly with a minimum intensity of 20-40mW/cm2 using a UV light source emitting at a wavelength of 320-365nm.
Count On Tools (COT) gripper technology designed for ASM surface mount machines enables component handling ranging from 2.0-6.0mm.
Shenmao PF606-P lead-free solder paste for use in "reverse hybrid" board assembly is compatible with existing SAC SMT materials and reflow processes.