Products
Heraeus Electronics’ mAgic® PE360 is a silver sintering material developed for large-area power module attachment applications requiring high thermal and mechanical performance. The material enables uniform bond lines and low voiding. mAgic® PE360 sinters at relatively low pressure and temperature. The material is available in both printing (PE360P) and dispensing (PE361D) formats.
Hirose's 1.0mm coaxial connector designed for high-frequency applications up to 110GHz. The connector complies with IEEE Std 287 and is engineered to support advanced RF and microwave designs. Features a compression-mount center contact that accommodates a range of PCB thicknesses, from under 1mm to several millimeters. With voltage standing wave ratio (VSWR) values of 1.8 maximum from 0–67GHz and 1.9 maximum from 67–110GHz. These characteristics support applications where signal integrity and low insertion loss are critical.
ASMPT Siplace V placement platform has a new machine frame and efficient linear drives and measuring systems with increased resolution.
Press Releases
- Datest Launches 2026 Webinar Series: Because Electronics Testing Shouldn’t Be Guesswork
- ASE CEO Tien Wu to Keynote IEEE ECTC 2026 in Orlando
- Nordson Electronics Solutions Announces Expanded Distributor Partnership with Assembly Products, Inc. a subsidiary of Blackstone Global, Across the United States and Canada
- MicroCare Appoints Uwe Wanner as Director of Research & Development