Products
Kyocera AVX 9258-100 Series spring-finger board-to-board compression contacts provide full connector functionality in a miniature, low-profile, single-contact form factor that supports flexible PCB placement.
Indium's Heat-Spring HSx thermal interface material is designed for large area dies with warpage of 200 microns or more.
Press Releases
- Naprotek Appoints James Eisenhaure as Chief Financial Officer
- Naprotek Appoints James Eisenhaure as Chief Financial Officer
- ViTrox Announces Strategic Partnership with Maxim SMT to Strengthen Presence in India
- Incap UK achieves JOSCAR Zero accreditation – Strengthens its position in the defence and aerospace sector